IP Library › Granted Patent US 12,449,607
Granted Patent B2
US 12,449,607 · App. 18/760,550 · Granted Oct 21, 2025

Optical module

Inventors: Yuriko Kawamura (Musashino, JP); Takashi Yamada (Musashino, JP); Yusuke Nasu (Musashino, JP)
Assignee: NTT, INC.
G02B6/3628G02B6/262G02B6/424
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Quick Facts
Patent No.
US 12,449,607
App. No.
18/760,550
Granted
Oct 21, 2025
Kind
B2
Abstract

An optical module according to the present invention includes: an optical device including an optical waveguide chip; an optical fiber block bonded to and arranged on an end face of the optical waveguide chip; an optical fiber that has one end optically connected to the optical waveguide chip via the optical fiber block; an optical fiber holding mechanism for holding the other end of the optical fiber; and an optical fiber carrier. The optical fiber is arranged while being curved from the optical fiber carrier toward the optical fiber block in a U-shape, and a wall structure is formed on the surface of the carrier while being adjacent to the optical fiber at, for example, a position on the outer side of the U-shaped curve of the optical fiber position at which the wall structure reduces a normal force of the optical fiber.

Claims (10)

1. An optical module comprising:

an optical fiber block;

an optical fiber to which the optical fiber block is attached, the optical fiber having a curved portion;

an optical waveguide chip optically connected to the optical fiber; and

a wall structure provided in a vicinity of the optical fiber,

wherein the wall structure is arranged at a location at which, when the optical fiber comes into contact with the wall structure, the wall structure reduces a restoring force of the optical fiber that is applied to an optical connection portion between the optical waveguide chip and the optical fiber block, by a resistance that acts on the optical fiber from the wall structure, and

wherein a cross section of the wall structure is L-shaped and the optical fiber is in contact with two portions that form the cross section being L-shaped.

2. The optical module according to claim 1 , wherein the wall structure is formed on a carrier for holding the optical fiber, the carrier being arranged above the optical waveguide chip.

3. The optical module according to claim 1 , wherein the wall structure is formed on an electronic substrate on which the optical waveguide chip is mounted.

4. The optical module according to claim 2 , wherein the wall structure is formed on an electronic substrate on which the optical waveguide chip is mounted.

Assignments (2)
CHANGE OF NAME Recorded Aug 18, 2025
From: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
To: NTT, INC.
Reel/Frame 072507/0699 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2024
From: KAWAMURA, YURIKO; YAMADA, TAKASHI; NASU, YUSUKE
To: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
Reel/Frame 067885/0824 →
Continuity (2)
Continuation 17619124
Related Publication 20240353627A1 · Oct 24, 2024
References Cited (9)
US 7284911B2 · Takeda · 2007 [cited by examiner]
US 20030077054A1 · Marazzi et al. · 2003 [cited by applicant]
US 20060088249A1 · Takeda · 2006 [cited by applicant]
US 20080239468A1 · Hamada · 2008 [cited by applicant]
JP H0815573A · 1996 [cited by applicant]
JP 2006010891A · 2006 [cited by applicant]
JP 2008244223A · 2008 [cited by applicant]
JP 201253217A · 2012 [cited by applicant]
H. Tanobe, Y. Kurata, Y. Nakanishi, H. Fukuyama, M. Itoh, and E. Yoshida, Compact 100Gb/s DPQPSK Integrated Receiver Module Employing Three-Dimensional Assembly Technology, Optics Express 22(5), (2014) pp. 6108-6113. [cited by applicant]