Multilayer board, electronic device, and multilayer board inspection method
A multilayer board includes a first insulator layer including a first coil pattern thereon, a second insulator layer including a second coil pattern thereon, a third insulator layer including a third coil pattern thereon, a first terminal on the first insulator layer and connected to one end of the first coil pattern, a first floating pattern on the first insulator layer and not connected to the first coil pattern, and a second terminal on the third insulator layer and connected to one end of the third coil pattern. The first, second, and third insulator layers are sequentially laminated. The first, second, and third coil patterns are respectively electrically connected in sequence. The first floating pattern overlaps the second coil pattern when viewed from a laminating direction.
1. A multilayer board comprising:
a first insulator layer including a first coil pattern thereon;
a second insulator layer including a second coil pattern thereon;
a third insulator layer including a third coil pattern thereon;
a first terminal on the first insulator layer and connected to one end of the first coil pattern;
a first floating pattern on the first insulator layer and not connected to the first coil pattern; and
a second terminal electrically connected to one end of the third coil pattern; wherein
the first insulator layer, the second insulator layer, and the third insulator layer are sequentially laminated;
the first coil pattern, the second coil pattern, and the third coil pattern are respectively electrically connected in sequence; and
the first floating pattern overlaps the second coil pattern when viewed from a laminating direction.
2. The multilayer board according to claim 1 , wherein
the second coil pattern includes a coil portion having in a loop shape and an extending portion extending outward from the coil portion of the second coil pattern; and
the first floating pattern overlaps the coil portion of the second coil pattern when viewed from the laminating direction.
3. The multilayer board according to claim 1 , wherein the second terminal is on the third insulator layer.
4. The multilayer board according to claim 1 , wherein
the first coil pattern includes a coil portion having a loop shape and an extending portion extending outward from the coil portion of the first coil pattern;
an end portion of the extending portion of the first coil pattern is connected to the first terminal; and
the first floating pattern is opposed to an extending direction of the extending portion of the first coil pattern.
5. The multilayer board according to claim 1 , wherein the first floating pattern is adjacent to or in a vicinity of the first terminal.
6. An electronic device to which the multilayer board according to claim 1 is attached, wherein the first floating pattern is not connected to a power supply of the electronic device.
7. The multilayer board according to claim 1 , wherein
the second coil pattern includes a coil portion having a loop shape and an extending portion extending outward from the coil portion of the second coil pattern; and
the first floating pattern overlaps the extending portion of the second coil pattern when viewed from the laminating direction.
8. The multilayer board according to claim 7 , wherein an area of the first floating pattern is larger than an area of the extending portion of the second coil pattern.
9. The multilayer board according to claim 7 , wherein an area of the extending portion of the second coil pattern is larger than an area of the first floating pattern.
10. The multilayer board according to claim 7 , wherein the extending portion of the second coil pattern is connected to an interlayer connection conductor to connect to the third coil pattern.
11. The multilayer board according to claim 1 , wherein the first floating pattern extends along a shape of the first coil pattern.
12. The multilayer board according to claim 11 , wherein the first floating pattern extends along the coil portion of the first coil pattern.
13. The multilayer board according to claim 1 , further comprising:
a fourth insulator layer laminated with respect to the third insulator layer oppositely to the second insulator layer and including a conductor pattern thereon; wherein
the second terminal is on the fourth insulator layer and is connected via the conductor pattern to the third coil pattern.
14. The multilayer board according to claim 13 , further comprising:
a second floating pattern on the fourth insulator layer and not connected to the conductor pattern; wherein
the second floating pattern overlaps the third coil pattern when viewed from the laminating direction.
15. The multilayer board according to claim 14 , wherein
the third coil pattern includes a coil portion having a loop shape and an extending portion extending outward from the coil portion of the third coil pattern; and
the second floating pattern overlaps the extending portion of the third coil pattern when viewed from the laminating direction.
16. The multilayer board according to claim 15 , wherein an area of an extending portion of the third coil pattern is larger than an area of the second floating pattern.
17. The multilayer board according to claim 15 , wherein an area of the second floating pattern is larger than an area of an extending portion of the third coil pattern.
18. The multilayer board according to claim 15 , wherein the extending portion of the third coil pattern is connected to an interlayer connection conductor to connect to the second coil pattern.
19. The multilayer board according to claim 14 , wherein
the conductor pattern includes a coil portion having a loop shape and an extending portion extending outward from the coil portion of the conductor pattern;
an end portion of the extending portion of the conductor pattern is connected to the second terminal; and
the second floating pattern extends in an extending direction of the extending portion of the conductor pattern.
20. The multilayer board according to claim 14 , wherein the second floating pattern is adjacent to or in a vicinity of the second terminal.
21. The multilayer board according to claim 14 , further comprising:
a fifth insulator layer including a conductor pattern thereon and a sixth insulator layer including a sixth coil pattern thereon, between the third insulator layer and the fourth insulator layer; wherein
the fifth insulator layer and the sixth insulator layer are sequentially laminated from a side closer to the third insulator layer than to the first insulator layer; and
the third coil pattern, the conductor pattern of the fifth insulator layer, the sixth coil pattern, and the conductor pattern of the fourth insulator layer are connected.