Granted Patent B2

US 12,451,578 · App. 18/149,015 · Granted Oct 21, 2025

Inventors: Abdellatif Zanati (Hamburg, DE); Jonas Ove Harm (Hamburg, DE); Adrianus Buijsman (Nijmegen, NL)

Assignee: NXP B.V.

H01P5/103H01P5/085H01Q1/22H05K1/111H05K1/115H01P3/121

Abstract

Claims (74)

1. A device comprising:

an interposer circuit board (“interposer”) having a top surface and a bottom surface;

a first set of electrical contacts disposed on the top surface of the interposer;

a second set of electrical contacts disposed on the bottom surface of the interposer;

a coaxial transition structure formed by:

a first via that extends along a vertical direction from a feed contact belonging to the first set of electrical contacts to a first depth within the interposer; and

a set of additional vias that surround the first via and extend along the vertical direction from the top surface of the interposer to a second depth within the substrate interposer that is less than first depth;

wherein each of the set of additional vias are electrically short-circuited to each other and are separated from the first via by dielectric material of the interposer; and

a waveguide structure formed within the interposer beneath the set of additional vias that defines a volume in which wireless signals coupled to the waveguide structure propagate;

wherein the waveguide structure extends in a horizontal direction from a first waveguide end to a second waveguide end;

wherein the waveguide structure extends along a vertical direction from the second depth within the interposer to a third depth within the interposer that is greater than the second depth;

wherein the first via penetrates the waveguide structure at the first waveguide end and extends within the waveguide structure from the first depth to the second depth;

wherein the waveguide structure has an aperture at the third depth within the interposer at the second waveguide end where conductive material defining the waveguide is absent; and

wherein the coaxial transition structure and the waveguide structure are jointly configured and arranged to direct millimeter-wave energy delivered to the feed contact to the aperture in the waveguide structure.

2. The device of claim 1 , wherein vias of the set of additional vias are separated from each other within the interposer by the dielectric material of the interposer.

3. The device of claim 2 , wherein the vias of the set of additional vias are physically separated from each other within the interposer by a spacing that is less than a distance equal to a characteristic wavelength of propagating electromagnetic radiation within the interposer that corresponds to a desired operating frequency of the device.

4. The device of claim 1 , wherein contacts of the first set of contacts are spaced apart from each other with a spacing characterized by a first contact pitch and contacts of the second set of contacts are spaced apart from each other with a spacing characterized by a second contact pitch that is different from the first contact pitch.

5. The device of claim 4 , wherein the first contact pitch is smaller than the second contact pitch.

6. The device of claim 4 , wherein the contacts of the first set of contacts have a smaller diameter than the contacts of the second set of contacts.

7. A system comprising:

an interposer circuit board (“interposer”) having a top surface and a bottom surface, the interposer comprising:

a first set of electrical contacts disposed on the top surface of the interposer;

a second set of electrical contacts disposed on the bottom surface of the interposer;

a coaxial transition structure formed by:

a first via that extends along a vertical direction from a feed contact belonging to the first set of electrical contacts to a first depth within the interposer; and

a set of additional vias that surround the first via and extend along the vertical direction from the top surface of the interposer to second depth within the interposer that is less than first depth;

wherein each of the set of additional vias are electrically short-circuited to each other and are separated from the first via by dielectric material of the interposer; and

a waveguide structure formed within the interposer beneath the set of additional vias that defines a volume in which wireless signals coupled to the waveguide structure propagate;

wherein the waveguide structure extends in a horizontal direction from a first waveguide end to a second waveguide end;

wherein the waveguide structure extends along a vertical direction from the second depth within the interposer to a third depth within the interposer that is greater than the second depth;

wherein the first via penetrates the waveguide structure at the first waveguide end and extends within the waveguide structure from the first depth to the second depth;

wherein the waveguide structure has an aperture at the third depth within the interposer at the second waveguide end where conductive material defining the waveguide is absent; and

wherein the coaxial transition structure and the waveguide structure are jointly configured and arranged to direct millimeter-wave energy delivered to the feed contact to the aperture in the waveguide structure;

an integrated circuit (IC) bonded to the top surface of the interposer and electrically coupled to electrical contacts belonging to the first set of electrical contacts, wherein the IC is configured to transmit or receive millimeter-wave signals via the feed contact; and

an additional circuit board having a top surface bonded to the bottom surface of the interposer;

wherein the IC, the interposer, and the additional circuit board are jointly configured and arranged such that wireless millimeter wave signals are coupled between the IC and the additional circuit board via the aperture in the waveguide structure of the interposer.

8. The system of claim 7 , wherein vias of the set of additional vias are separated from each other within the interposer by the dielectric material of the interposer.

9. The system of claim 8 , wherein the vias of the set of additional vias are physically separated from each other within the interposer by a spacing that is less than a distance equal to a characteristic wavelength of propagating electromagnetic radiation within the interposer that corresponds to a desired operating frequency of the device.

10. The system of claim 7 , wherein contacts of the first set of contacts are spaced apart from each other with a spacing characterized by a first contact pitch and contacts of the second set of contacts are spaced apart from each other with a spacing characterized by a second contact pitch that is different from the first contact pitch.

11. The system of claim 10 , wherein the first contact pitch is smaller than the second contact pitch.

12. The device of claim 10 , wherein the contacts of the first set of contacts have a smaller diameter than the contacts of the second set of contacts.

13. The system of claim 7 ,

wherein the additional circuit board comprises an antenna structure; and

wherein the IC, the interposer, and the additional circuit board are jointly configured and arranged such that wireless millimeter wave signals are coupled between the IC and antenna structure of the additional circuit board via the aperture in the waveguide structure of the interposer.

14. The system of claim 7 , wherein the additional circuit board comprises an additional waveguide structure; and wherein the aperture of the waveguide structure of the interposer is aligned to couple wireless signals between the waveguide structure and the additional waveguide structure.

15. A method comprising:

bonding an interposer circuit board (“interposer”) having a top surface and a bottom surface to an additional circuit board having an antenna structure;

wherein the interposer comprises:

a first set of electrical contacts disposed on the top surface of the interposer;

a second set of electrical contacts disposed on the bottom surface of the interposer;

a coaxial transition structure formed by:

a first via that extends along a vertical direction from a feed contact belonging to the first set of electrical contacts to a first depth within the interposer; and

a set of additional vias that surround the first via and extend along the vertical direction from the top surface of the interposer to second depth within the interposer that is less than first depth;

wherein each of the set of additional vias are electrically short-circuited to each other and are separated from the first via by dielectric material of the interposer; and

a waveguide structure formed within the interposer beneath the set of additional vias that defines a volume in which wireless signals coupled to the waveguide structure propagate;

wherein the waveguide structure extends in a horizontal direction from a first waveguide end to a second waveguide end;

wherein the waveguide structure extends along a vertical direction from the second depth within the interposer to a third depth within the interposer that is greater than the second depth;

wherein the first via penetrates the waveguide structure at the first waveguide end and extends within the waveguide structure from the first depth to the second depth;

wherein the waveguide structure has an aperture at the third depth within the interposer at the second waveguide end where conductive material defining the waveguide is absent; and

wherein the coaxial transition structure and the waveguide structure are jointly configured and arranged to direct millimeter-wave energy delivered to the feed contact to the aperture in the waveguide structure;

wherein the additional circuit board comprises a top surface configured to be bonded to the bottom surface of the interposer;

wherein the interposer, and the additional circuit board are jointly configured and arranged such that wireless millimeter wave signals are coupled between the feed contact and the additional circuit board via the aperture in the waveguide structure of the interposer.

16. The method of claim 15 ,

wherein the vias of the set of additional vias are separated from each other within the interposer by the dielectric material of the interposer;

wherein the vias of the set of additional vias are separated from each other within the interposer by a spacing that is less than a distance equal to a characteristic wavelength of propagating electromagnetic radiation within the interposer that corresponds to a desired operating frequency of the device.

17. The method of claim 15 ,

wherein contacts of the first set of contacts are spaced apart from each other with a spacing characterized by a first contact pitch and contacts of the second set of contacts are spaced apart from each other with a spacing characterized by a second contact pitch that is different from the first contact pitch; and

wherein first contact pitch is smaller than the second contact pitch or the contacts of the first set of contacts have a smaller diameter than the contacts of the second set of contacts.

18. The method of claim 15 ,

wherein the additional circuit board comprises an antenna structure; and

wherein the IC, the interposer, and the additional circuit board are jointly configured and arranged such that wireless millimeter wave signals are coupled between the IC and antenna structure of the additional circuit board via the aperture in the waveguide structure of the interposer.

19. The method of claim 15 ,

wherein the additional circuit board comprises an additional waveguide structure; and

wherein the method further comprises aligning the aperture of the waveguide structure of the interposer over the additional waveguide structure such that wireless signals can propagate between the waveguide structure of the interposer and the additional waveguide structure.

Assignments (1)

Continuity (1)

References Cited (19)