Acoustic wave devices with multi-layer piezoelectric substrate

1. An acoustic wave device comprising:

a substrate,

a functional layer disposed over at least a portion of the substrate;

a piezoelectric layer disposed over at least a portion of the functional layer; and

an interdigital transducer electrode disposed on the piezoelectric layer, the piezoelectric layer has an outer edge spaced inward of an outer edge of the substrate, the outer edge of the piezoelectric layer tapered at an angle relative to a surface of the substrate to thereby reduce an acoustic reflection magnitude at said outer edge of the piezoelectric layer, and the functional layer having an outer lateral edge that is spaced inward of the outer edge of the substrate, tapered at the angle relative to the surface of the substrate, and aligned and coplanar with the outer edge of the piezoelectric layer.

2. The acoustic wave device of claim 1 wherein the angle is between 45 degrees and 80 degrees.

3. The acoustic wave device of claim 1 further comprising a polyimide layer over the tapered outer edge of the piezoelectric layer and over at least a portion of the substrate.

4. The acoustic wave device of claim 1 wherein the functional layer is of silicon dioxide (SiO 2 ).

5. The acoustic wave device of claim 1 wherein the piezoelectric layer includes one or more of lithium tantalate, lithium niobate.

6. The acoustic wave device of claim 1 wherein the substrate includes one of silicon, poly-silicon, amorphous silicon, silicon nitride (SiN), Sapphire, quartz, aluminum nitride (AlN) or polycrystalline ceramic (Mg 2 O 4 ).

7. The acoustic wave device of claim 1 wherein the angle is an acute angle.

8. The acoustic wave device of claim 1 wherein the functional layer is directly disposed on the substrate and the piezoelectric layer is directly disposed on the functional layer.

9. A radio frequency module comprising:

a package substrate;

an acoustic wave device including a substrate, a functional layer disposed over at least a portion of the substrate, a piezoelectric layer disposed over at least a portion of the functional layer, and an interdigital transducer electrode disposed on the piezoelectric layer, the piezoelectric layer having an outer edge spaced inward of an outer edge of the substrate, the outer edge of the piezoelectric layer being tapered at an angle relative to a surface of the substrate to thereby reduce an acoustic reflection magnitude at said outer edge of the piezoelectric layer, and the functional layer having an outer lateral edge that is spaced inward of the outer edge of the substrate, tapered at the angle relative to the surface of the substrate, and aligned and coplanar with the outer edge of the piezoelectric layer; and

additional circuitry, the acoustic wave device and additional circuitry disposed on the package substrate.

10. The radio frequency module of claim 9 wherein the angle is between 45 degrees and 80 degrees.

11. The radio frequency module of claim 9 further comprising a polyimide layer over the tapered outer edge of the piezoelectric layer and over at least a portion of the substrate.

12. The radio frequency module of claim 9 wherein the functional layer is of silicon dioxide (SiO 2 ).

13. The radio frequency module of claim 9 wherein the piezoelectric layer includes one or more of lithium tantalate, lithium niobate.

14. The radio frequency module of claim 9 wherein the substrate includes one of silicon, poly-silicon, amorphous silicon, silicon nitride (SiN), Sapphire, quartz, aluminum nitride (AlN) or polycrystalline ceramic (Mg 2 O 4 ).

15. The radio frequency module of claim 9 wherein the angle is an acute angle.

16. The radio frequency module of claim 9 wherein the functional layer is directly disposed on the substrate and the piezoelectric layer is directly disposed on the functional layer.

17. A wireless communication device comprising:

an antenna; and

a front end module including one or more acoustic wave devices configured to filter a radio frequency signal associated with the antenna, each acoustic wave device including a substrate, a functional layer disposed over at least a portion of the substrate, a piezoelectric layer disposed over at least a portion of the functional layer, and an interdigital transducer electrode disposed on the piezoelectric layer, the piezoelectric layer having an outer edge spaced inward of an outer edge of the substrate, the outer edge of the piezoelectric layer being tapered at an angle relative to a surface of the substrate to thereby reduce an acoustic reflection magnitude at said outer edge of the piezoelectric layer, and the functional layer having an outer lateral edge that is spaced inward of the outer edge of the substrate, tapered at the angle relative to the surface of the substrate, and aligned and coplanar with the outer edge of the piezoelectric layer.

18. The wireless communication device of claim 17 wherein the angle is between 45 degrees and 80 degrees.

19. The wireless communication device of claim 17 further comprising a polyimide layer over the tapered outer edge of the piezoelectric layer and over at least a portion of the substrate.

20. The wireless communication device of claim 17 wherein the functional layer is of silicon dioxide (SiO 2 ).

21. The wireless communication device of claim 17 wherein the piezoelectric layer includes one or more of lithium tantalate, lithium niobate.

22. The wireless communication device of claim 17 wherein the substrate includes one of silicon, poly-silicon, amorphous silicon, silicon nitride (SiN), Sapphire, quartz, aluminum nitride (AlN) or polycrystalline ceramic (Mg 2 O 4 ).

23. The wireless communication device of claim 17 wherein the angle is an acute angle.

24. The wireless communication device of claim 17 wherein the functional layer is directly disposed on the substrate and the piezoelectric layer is directly disposed on the functional layer.