Granted Patent B2

US 12,453,052 · App. 17/781,691 · Granted Oct 21, 2025

Inventors: Fan Liu (Shenzhen, CN); Cheng Tao (Shenzhen, CN); Shuai Li (Shenzhen, CN)

Assignee: ZTE Corporation

H05K7/2039H05K7/20318H05K7/20327

Abstract

Claims (13)

1. A heat dissipation device, comprising:

a condenser, a pump, and a dual channel liquid-cooled plate;

wherein the dual channel liquid-cooled plate comprises a single-phase channel and a two-phase channel, wherein first fins are spaced apart in the single-phase channel and second fins are spaced apart in the two-phase channel; and the first fins are configured to perform a heat exchange with a liquid-state coolant flowing through the single-phase channel to convert the liquid-state coolant after the heat exchange into a gas-liquid two-phase coolant, and the second fins are configured to perform a heat exchange with a gas-liquid two-phase coolant flowing through the two-phase channel to output a coolant after the heat exchange; and

wherein the pump is configured to enable a coolant passing through the pump to flow into the dual channel liquid-cooled plate to perform heat absorption, and the condenser is configured to enable the coolant after the heat absorption to flow back into the dual channel liquid-cooled plate after heat release;

wherein the heat dissipation device further comprises a single plate, the single plate comprises at least one dual channel liquid-cooled plates having the single-phase channel and the two-phase channel, and multiple single channel liquid-cooled plates having one single channel; a dual channel liquid-cooled plate is arranged at an inlet of the single plate, and a single channel liquid-cooled plate is arranged at an outlet of the single plate; the at least one dual channel liquid-cooled plates is sequentially connected in series with the multiple single channel liquid-cooled plates; one single channel liquid-cooled plate of the multiple single channel liquid-cooled plates is connected back to the dual channel liquid-cooled plate arranged at the inlet of the single plate, and the dual channel liquid-cooled plate arranged at the inlet of the single plate is connected in series with single channel liquid-cooled plate located after the one single channel liquid-cooled plate of the multiple single channel liquid-cooled plates;

wherein the heat dissipation device further comprises: a liquid storage tank, a liquid supply pipeline, a liquid supply branch pipeline, a liquid supply dispenser, a connection pipe, a liquid return collection pipe, a liquid return branch pipe, and a liquid return main pipe; and

wherein the condenser, the liquid storage tank, the pump, the liquid supply pipeline, the liquid supply branch pipeline, the liquid supply dispenser, the connection pipe, the single plate, the liquid return collection pipe, the liquid return branch pipe, and the liquid return main pipe are sequentially connected to form a circuit.

2. The heat dissipation device of claim 1 , wherein the single plate is connected to at least one chip to be heat dissipated.

3. The heat dissipation device of claim 1 , wherein at least two single plates are provided, and the at least two single plates are connected in parallel.

4. The heat dissipation device of claim 1 , wherein a surface of at least one of a first fin or a second fin is a rough surface.

5. The heat dissipation device of claim 1 , wherein a metal foam is attached to a surface of at least one of a first fin or a second fin.

6. The heat dissipation device of claim 1 , wherein a metal foam is filled between at least one of a first fin or a second fin.

7. The heat dissipation device of claim 1 , wherein a metal foam is filled between at least one of a first fin or a second fin.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (22)