IP Library Granted Patent US 12,455,843
Granted Patent B2
US 12,455,843 · App. 18/744,042 · Granted Oct 28, 2025

Data processing system and method

Inventors: Wen Yin (Shenzhen, CN); Wei Li (Shenzhen, CN); Yigang Zhou (Shanghai, CN); Manbo Wu (Shenzhen, CN); Xianzhou Lin (Hangzhou, CN); Chuanwei Wen (Dongguan, CN); Ruonan Wang (Shenzhen, CN); Yining Li (Shenzhen, CN)
Assignee: HUAWEI TECHNOLGOIES CO., LTD.
G06F13/1668G06F13/18G06F13/409G06F13/4243
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Quick Facts
Patent No.
US 12,455,843
App. No.
18/744,042
Granted
Oct 28, 2025
Kind
B2
Abstract

A data processing system includes a computing subsystem and a memory subsystem. In the computing subsystem, a processor is connected to one end of a high-speed parallel bus via a first bus interface. The processor transmits data to the memory subsystem and receives data transmitted through the high-speed parallel bus. The memory subsystem receives and transmits data to the computing subsystem through the high-speed parallel bus.

Claims (59)

1. A system, comprising:

a high-speed parallel bus comprising:

a first end; and

a second end;

a computing subsystem comprising:

a first bus interface connected to the first end; and

a processor connected to the first end via the first bus interface and configured to:

send, via the first bus interface, a data access command; and

receive, via the first bus interface, data, wherein the first bus interface is configured to:

modulate, through higher-order modulation, the data access command; and

demodulate, through the higher-order modulation, the data; and

a memory subsystem comprising:

a second bus interface connected to the second end; and

a memory component connected to the second bus interface, comprising the data, and configured to:

receive, via the second bus interface and from the computing subsystem, the data access command;

access, according to the data access command, the data; and

send, via the second bus interface and to the computing subsystem, the data,

wherein the second bus interface is configured to:

demodulate, through the higher-order modulation, the data access command; and

modulate, through the higher-order modulation, the data.

2. The system of claim 1 , wherein the memory component comprises a plurality of types of memory components, wherein the memory subsystem further comprises a plurality of hierarchical memory controllers, and wherein one of the plurality of hierarchical memory controllers is connected to one of the plurality of types of memory components, connected, via the second bus interface, to the high-speed parallel bus, and configured to either:

receive, via the second bus interface, the data access command; or

send, via the second bus interface, the data.

3. The system of claim 1 , wherein the first bus interface comprises a plurality of signal pin groups, wherein a ratio of a first quantity of pins for ground signal transmission to a second quantity of pins for data transmission in each of the plurality of signal pin groups is greater than 1 and less than 2, and wherein the data comprises a data signal, a control signal, and a clock signal.

4. The system of claim 3 , wherein the ratio is 5:3.

5. The system of claim 3 , wherein pins in each of the plurality of signal pin groups are arranged in an array comprising rows, and wherein pins in adjacent rows are not aligned.

6. The system of claim 3 , wherein each of the plurality of signal pin groups comprises 32 pins.

7. The system of claim 3 , wherein each of the plurality of signal pin groups comprises eight pins for data signal transmission, two pins for control signal transmission, two pins for clock signal transmission, and twenty pins for the ground signal transmission.

8. The system of claim 3 , wherein the plurality of signal pin groups comprises eight signal pin groups.

9. The system of claim 3 , wherein pins in each of the plurality of signal pin groups are arranged in an array comprising rows, wherein pins in a plurality of spaced rows are aligned, and wherein the spaced rows are spaced at an interval of one row from each other in the array.

10. The system of claim 3 , wherein pins in each of the plurality of signal pin groups are arranged in an array comprising rows, and wherein a perpendicular line from any pin in one of the rows to an adjacent row coincides with a mid-perpendicular line of two adjacent pins in the adjacent row.

11. The system of claim 3 , wherein pins in each of the plurality of signal pin groups are arranged in an array comprising rows, wherein any pin in one of the rows and two adjacent pins form an equilateral triangle, and wherein the two adjacent pins are located in a same row.

12. The system of claim 1 , wherein the computing subsystem further comprises a clock circuit configured to provide a first clock signal for the first bus interface, wherein the clock circuit comprises an inductor and a signal source, and wherein the inductor and the signal source are in a T-shaped structure.

13. The system of claim 12 , further comprising a frequency adjustment circuit, wherein the clock circuit is connected, through the frequency adjustment circuit, to the first bus interface, wherein the frequency adjustment circuit is configured to increase a frequency of the first clock signal to produce a second clock signal, and wherein the first bus interface is further configured to perform, based on the second clock signal, the higher-order modulation.

14. A method, comprising:

modulating, by a first bus interface of a computing subsystem and through higher-order modulation, a data access command to produce a modulated data access command;

sending, by a processor of the computing subsystem, via the first bus interface, and to a memory subsystem, the modulated data access command;

receiving, by a second bus interface of the memory subsystem, the modulated data access command;

demodulating, by the second bus interface and through the higher-order modulation, the modulated data access command to produce the data access command; and

accessing, by a memory component of the memory subsystem and according to the data access command, data in the memory component.

15. The method of claim 14 , further comprising:

modulating, by the second bus interface and through the higher-order modulation, the data to produce modulated data;

sending, by the memory component, via the second bus interface, and to the computing subsystem, the modulated data;

receiving, by the processor and via the first bus interface, the modulated data; and

demodulating, by the first bus interface and through the higher-order modulation, the modulated data to produce the data.

16. The method of claim 14 , wherein receiving the modulated data access command comprises receiving, by one of a plurality of hierarchical memory controllers of the memory subsystem and via the second bus interface, the modulated data access command.

17. The method of claim 15 , wherein sending the modulated data comprises sending, by one of a plurality of hierarchical memory controllers of the memory subsystem and via the second bus interface, the modulated data.

18. A computer program product comprising instructions that are stored on a non-transitory computer-readable storage medium and that, when executed by a first processor, cause an apparatus to:

modulate, by a first bus interface of a computing subsystem and through higher-order modulation, a data access command to produce a modulated data access command;

send, by a second processor of the computing subsystem, via the first bus interface, and to a memory subsystem, the modulated data access command;

receive, by a second bus interface of the memory subsystem, the modulated data access command;

demodulate, by the second bus interface and through the higher-order modulation, the modulated data access command to produce the data access command; and

access, by a memory component of the memory subsystem and according to the data access command, data in the memory component.

19. The computer program product of claim 18 , wherein the first processor is further configured to execute the instructions to:

modulate, by the second bus interface and through the higher-order modulation, the data to produce modulated data;

send, by the memory component, via the second bus interface, and to the computing subsystem, the modulated data;

receive, by the second processor and via the first bus interface, the modulated data; and

demodulate, by the first bus interface and through the higher-order modulation, the modulated data to produce the data.

20. The computer program product of claim 18 , wherein the first processor is further configured to execute the instructions to receive, by one of a plurality of hierarchical memory controllers of the memory subsystem and via the second bus interface, the modulated data access command.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY NAME PREVIOUSLY RECORDED AT REEL: 71959 FRAME: 214. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 11, 2025
From: LI, WEI; ZHOU, YIGANG; WU, MANBO; LIN, XIANZHOU; WEN, CHUANWEI
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 072404/0537 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2025
From: SHANGHAI HUAWEI TECHNOLOGIES CO., LTD.
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 071959/0281 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2025
From: HISILICON TECHNOLOGIES CO., LIMITED
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 071959/0494 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2025
From: LI, WEI; ZHOU, YIGANG; WU, MANBO; LIN, XIANZHOU; WEN, CHUANWEI
To: TECHNOLOGIES, HUAWEI
Reel/Frame 071959/0214 →
EMPLOYMENT AGREEMENT Recorded Aug 7, 2025
From: YIN, WEN
To: SHANGHAI HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 072400/0861 →
EMPLOYMENT AGREEMENT Recorded Aug 7, 2025
From: WANG, RUONAN
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 072400/0868 →
EMPLOYMENT AGREEMENT Recorded Aug 7, 2025
From: LI, YINING
To: HISILICON TECHNOLOGIES CO., LIMITED
Reel/Frame 072329/0565 →
Priority Claims (2)
CN 202111550014.7 · Dec 17, 2021 · national
CN 202210223791.9 · Mar 9, 2022 · national
Continuity (2)
Continuation PCTCN2022136906 · Dec 6, 2022
Related Publication 20240338328A1 · Oct 10, 2024
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