Replacement gate methods that include treating spacers to widen gate
A method may include forming a dummy dielectric layer over a substrate, and forming a dummy gate over the dummy dielectric layer. The method may also include forming a first spacer adjacent the dummy gate, and removing the dummy gate to form a cavity, where the cavity is defined at least in part by the first spacer. The method may also include performing a plasma treatment on portions of the first spacer, where the plasma treatment causes a material composition of the portions of the first spacer to change from a first material composition to a second material composition. The method may also include etching the portions of the first spacer having the second material composition to remove the portions of the first spacer having the second material composition, and filling the cavity with conductive materials to form a gate structure.
1. A device, comprising:
a first source/drain region and a second source/drain region over a substrate;
a gate structure over the substrate between the first source/drain region and the second source/drain region, wherein the gate structure comprises one or more gate dielectric layers and one or more gate electrode layers; and
a plurality of spacers along a first sidewall of the gate structure, wherein a width of each spacer of the plurality of spacers increases as each spacer approaches the substrate.
2. The device of claim 1 , wherein an interface between the one or more gate dielectric layers and a first spacer of the plurality of spacers is inclined at an angle of inclination relative to an upper surface of the substrate under the gate structure.
3. The device of claim 2 , wherein the angle of inclination is greater than or equal to 3 degrees.
4. The device of claim 1 , wherein a first spacer of the plurality of spacers contacts a first gate dielectric layer of the one or more gate dielectric layers, wherein an upper surface of the first spacer is level with an upper surface of the first gate dielectric layer.
5. The device of claim 1 , further comprising:
a dielectric layer on opposing sides of the gate structure, wherein a first spacer of the plurality of spacers contacts a first gate dielectric layer of the one or more gate dielectric layers, wherein an upper surface of the first spacer is level with an upper surface of the dielectric layer.
6. The device of claim 1 , wherein an upper surface of a first spacer of the plurality of spacers is level with an upper surface of each remaining spacer of the plurality of spacers.
7. The device of claim 1 , wherein a first spacer of the plurality of spacers contacts the one or more gate dielectric layers, wherein the first spacer comprises SiONC.
8. A device, comprising:
a first source/drain region and a second source/drain region formed in a substrate;
a gate structure over the substrate between the first source/drain region and the second source/drain region, wherein the gate structure comprises a gate dielectric layer and a gate electrode over the gate dielectric layer;
a first spacer contacting a sidewall of the gate structure; and
a second spacer contacting a sidewall of the first spacer, wherein the first spacer is between the second spacer and the gate structure, wherein a first width of the first spacer is greater adjacent the substrate than at a first location more distal from the substrate, wherein a second width of the second spacer is greater adjacent the substrate than at a second location more distal from the substrate.
9. The device of claim 8 , wherein an interface between the first spacer and the second spacer is closer to perpendicular to an upper surface of the substrate under the gate structure than an interface between the first spacer and the gate structure.
10. The device of claim 8 , wherein a width of the gate electrode at an upper surface is 0% to 30% greater than a width of the gate electrode at a lower surface.
11. The device of claim 8 , wherein the gate structure contacts the second spacer.
12. The device of claim 8 , further comprising a dielectric layer between the first spacer and the substrate.
13. The device of claim 12 , wherein the dielectric layer is between the second spacer and the substrate.
14. The device of claim 12 , wherein the gate dielectric layer extends along a sidewall of the dielectric layer.
15. The device of claim 8 , wherein the first spacer comprises Si 1-x-y-z O x N y C z , where x is about 45%±15%, y is about 15%±15% and z is 10%±10%.
16. A device, comprising:
a first source/drain region and a second source/drain region in a substrate;
a gate structure over the substrate between the first source/drain region and the second source/drain region, wherein the gate structure comprises a gate dielectric layer and a gate electrode over the gate dielectric layer;
a first spacer on a sidewall of the gate structure; and
a second spacer on a first sidewall of the first spacer opposite the gate structure, wherein a second sidewall of the first spacer tapers at an angle greater than the first sidewall of the first spacer relative to a line perpendicular to an upper surface of the substrate.
17. The device of claim 16 , wherein the angle is greater than or equal to 3 degrees relative to a line perpendicular to the upper surface of the substrate.
18. The device of claim 16 , wherein a bottom surface of the first spacer is level with a bottom surface of the second spacer.
19. The device of claim 16 , wherein the gate dielectric layer extends closer to the substrate than the first spacer.
20. The device of claim 16 , wherein a width of the gate structure at an upper surface is between 0% and 30% greater than a width of the gate structure at a lower surface.