Semiconductor package
A semiconductor package is provided. The semiconductor package includes a package substrate, an interposer including a lower protective layer, conductive connectors connecting the package substrate to the interposer, a semiconductor chip arranged between the package substrate and the interposer, and cooling patches arranged between the semiconductor chip and the interposer and having cylindrical shapes, wherein each of the cooling patches includes the same material as each of the conductive connectors, a height of each of the cooling patches is less than or equal to a diameter of each of the cooling patches, and thermal conductivity of each of the cooling patches is greater than thermal conductivity of the lower protective layer.
1 . A semiconductor package comprising:
a package substrate;
an interposer arranged on the package substrate and comprising a plurality of lower pads and a lower protective layer that comprises a plurality of openings exposing the plurality of lower pads;
a plurality of conductive connectors connecting the package substrate to the interposer;
a semiconductor chip arranged between the package substrate and the interposer;
a plurality of cooling patches arranged between the semiconductor chip and the interposer and having cylindrical shapes; and
an insulation filler directly contacting side surfaces of the plurality of conductive connectors, a side surface of the semiconductor chip, and side surfaces of the plurality of cooling patches,
wherein upper surfaces of the plurality of cooling patches are coplanar with an upper surface of the insulation filler,
wherein lower surfaces of the plurality of cooling patches directly contact an upper surface of the semiconductor chip,
wherein a height of each of the plurality of cooling patches is less than or equal to a diameter of each of the plurality of cooling patches,
wherein thermal conductivity of each of the plurality of cooling patches is greater than thermal conductivity of the lower protective layer,
wherein the thermal conductivity of each of the plurality of cooling patches ranges from 10 W/(m·K) to 100 W/(m·K),
wherein the diameter of each of the plurality of cooling patches ranges from 50 μm to 200 μm, and
wherein the height of each of the plurality of cooling patches ranges from 10 μm to 100 μm.
2 . The semiconductor package of claim 1 , wherein each of the plurality of cooling patches comprises a conductive material.
3 . The semiconductor package of claim 1 , wherein each of the plurality of cooling patches comprises a solder material.
4 . The semiconductor package of claim 1 , wherein each of the plurality of cooling patches comprises any one of copper, tin, and lead.
5 . The semiconductor package of claim 1 , wherein each of the plurality of cooling patches directly contacts a lower surface of the interposer.
6 . The semiconductor package of claim 1 ,
wherein the semiconductor chip comprises a plurality of hot spots that are local maximum points of a temperature of the semiconductor chip during operation, and
wherein some of the plurality of cooling patches vertically overlap corresponding ones of the plurality of hot spots.
7 . The semiconductor package of claim 1 , wherein the insulation filler surrounds a side surface of each of the plurality of cooling patches.
8 . The semiconductor package of claim 1 , further comprising a heat dissipation device arranged on the interposer.
9 . The semiconductor package of claim 8 , wherein the interposer comprises a plurality of lower thermal conductive pads respectively connected to the plurality of cooling patches, and a plurality of upper thermal conductive pads connected to the heat dissipation device.
10 . The semiconductor package of claim 9 , wherein the plurality of lower thermal conductive pads and the plurality of upper thermal conductive pads are insulated from the semiconductor chip and the package substrate.
11 . The semiconductor package of claim 9 , further comprising a plurality of thermally conductive vias connecting the plurality of upper thermal conductive pads to the plurality of lower thermal conductive pads.
12 . A semiconductor package comprising:
a package substrate;
an interposer arranged on the package substrate and comprising a base insulating layer and a plurality of Through Silicon Vias (TSVs) penetrating the base insulating layer;
a plurality of conductive connectors connecting the package substrate to the interposer;
a semiconductor chip arranged between the package substrate and the interposer and comprising a plurality of hot spots that are local maximum points of a temperature of the semiconductor chip during operation; and
a plurality of cooling patches arranged between the semiconductor chip and the interposer and adjacent to the plurality of hot spots, each of the plurality of cooling patches having a cylindrical shape,
wherein lower surfaces of the plurality of cooling patches directly contact an upper surface of the semiconductor chip,
wherein upper surfaces of the plurality of cooling patches are at the same level as upper surfaces of the plurality of conductive connectors, wherein a height of each of the plurality of cooling patches is less than or equal to a diameter of each of the plurality of cooling patches,
wherein thermal conductivity of each of the plurality of cooling patches ranges from 10 W/(m·K) to 100 W/(m·K),
wherein the diameter of each of the plurality of cooling patches ranges from 50 μm to 200 μm, and
wherein the height of each of the plurality of cooling patches ranges from 10 μm to 100 μm.
13 . The semiconductor package of claim 12 , further comprising:
a plurality of insulating patches arranged between the semiconductor chip and the interposer,
wherein the height of each of the plurality of cooling patches is the same as a height of each of the plurality of insulating patches.
14 . The semiconductor package of claim 13 ,
wherein the plurality of insulating patches are spaced apart from the plurality of hot spots, respectively.
15 . The semiconductor package of claim 13 , wherein the thermal conductivity of each of the plurality of cooling patches is greater than thermal conductivity of each of the plurality of insulating patches.
16 . The semiconductor package of claim 13 , wherein a planar shape of each of the plurality of cooling patches is different from a planar shape of each of the plurality of insulating patches.
17 . A semiconductor package comprising:
a package substrate;
an interposer arranged on the package substrate and comprising a plurality of lower pads and a lower protective layer that comprises a plurality of openings exposing the plurality of lower pads;
a plurality of conductive connectors connecting the package substrate to the interposer;
a semiconductor chip arranged between the package substrate and the interposer;
a plurality of cooling patches having cylindrical shapes, each of the plurality of cooling patches having lower surfaces directly contacting an upper surface of the semiconductor chip and upper surfaces contacting a lower surface of the interposer; and
an insulation filler surrounding the plurality of cooling patches and directly contacting side surfaces of the plurality of cooling patches,
wherein an upper surface of the insulation filler is coplanar with upper surfaces of the plurality of conductive connectors and upper surfaces of the plurality of cooling patches,
wherein a height of each of the plurality of cooling patches is less than or equal to a diameter of each of the plurality of cooling patches,
wherein thermal conductivity of each of the plurality of cooling patches is greater than thermal conductivity of the lower protective layer,
wherein the diameter of each of the plurality of cooling patches ranges from 50 μm to 200 μm, and
wherein the height of each of the plurality of cooling patches ranges from 10 μm to 100 μm.