Surface-mounted magnetic-component module
A magnetic-component module includes a first header, a core on the first header, and a winding including a first trace on the first header. The first header includes a disc-shaped portion that supports the core and a cylinder-shaped portion that receives a hole of the core.
1 . A magnetic-component module comprising:
a first header is a molded header;
a core on the first header; and
a winding including a first trace and an additional trace on the first header; wherein the first header includes:
a disc-shaped portion that extends only along on a bottom surface of the core and that supports the core;
standoffs extending from the disc-shaped portion; and
a cylinder-shaped portion that receives a hole of the core,
the first trace extends along the disc-shaped portion adjacent a bottom surface of the core and extends along the cylinder-shaped portion adjacent an inner surface of the core, and
the additional trace extends from a top side of the first header to a bottom side of a corresponding standoff of the standoffs such that the additional trace electrically connects to a pad on a substrate, when the first header is connected to the substrate.
2 . The magnetic-component module according to claim 1 , further comprising a core standoff between the first header and the core.
3 . The magnetic-component module according to claim 1 , wherein the first trace is electrically connected to the substrate.
4 . The magnetic-component module according to claim 1 , further comprising a second header including a first trace.
5 . The magnetic-component module according to claim 4 , wherein the second header is stacked on the first header.
6 . The magnetic-component module according to claim 5 , further comprising:
a second trace on the first header;
a second trace on the second header;
a first wire bond over the core and connecting the first trace on the first header to the second trace on the first header; and
a second wire bond over the core and connecting the first trace on the second header to the second trace on the second header.
7 . The magnetic-component module according to claim 6 , further comprising an overmold material encapsulating the first header, the core, the second header, the first wire bond, and the second wire bond.
8 . The magnetic-component module according to claim 1 , further comprising overmold material encapsulating a portion of the first header.
9 . The magnetic-component module according to claim 8 , wherein electrical components are mounted on the substrate between the first header and the substrate.
10 . The magnetic-component module according to claim 1 , further comprising
a second trace on the first header; and
a wire bond over the core and connecting the first trace on the first header to the second trace on the first header.
11 . The magnetic-component module according to claim 10 , further comprising overmold material encapsulating the first header, the core, and the wire bond.
12 . A magnetic-component module comprising:
a first header is a molded header having a cup shape with inner and outer rims and including standoffs that extend from the first header;
a core on the first header; and
a winding that includes a first trace and an additional trace on the first header and a first wire bond extending between the inner and outer rims of the first header and connected to the first trace; wherein
the first trace extends along the first header adjacent to an inner surface, a bottom surface, and an outer surface of the core, and
the additional trace extends from a top side of the first header to a bottom side of a corresponding standoff of the standoffs such that the additional trace electrically connects to a pad on a substrate, when the first header is connected to the substrate.
13 . The magnetic-component module according to claim 12 , further comprising a core standoff between the first header and the core.
14 . The magnetic-component module according to claim 12 , further comprising a second header that has a cup shape with inner and outer rims, that includes a second trace, and that is stacked on the first header.
15 . The magnetic-component module according to claim 14 , further comprising a second wire bond extending between the inner and outer rims of the second header and connected to the second trace.
16 . The magnetic-component module according to claim 12 , further comprising overmold material encapsulating a portion of the first header.
17 . The magnetic-component module according to claim 16 , wherein electrical components are mounted on the substrate between the first header and the substrate.
18 . The magnetic-component module according to claim 15 , further comprising overmold material encapsulating the first header, the core, the first wire bond, and the second wire bond.
19 . The magnetic-component module according to claim 1 , wherein the standoffs include surface-mount structures or ridges.
20 . The magnetic-component module according to claim 12 , wherein the standoffs include surface-mount structures or ridges.