IP Library › Granted Patent US 12,463,201
Granted Patent B2
US 12,463,201 · App. 17/967,408 · Granted Nov 4, 2025

Dry electrode manufacture with lubricated active material mixture

Inventors: Linda Zhong (Sacramento, CA); Erika Shaw (Sacramento, CA); Bae Kyun Kim (Sacramento, CA)
Assignee: LICAP TECHNOLOGIES, INC.
H01M4/364H01M4/0435H01M4/139H01M4/621H01M4/661H01M10/0567
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,463,201
App. No.
17/967,408
Granted
Nov 4, 2025
Kind
B2
Abstract

A method of manufacturing a free-standing electrode film includes preparing a mixture including an electrode active material, a binder, and an additive solution or conductive paste, the additive solution or conductive paste being in an amount less than 5% by weight of the mixture and including a polymer additive and a liquid carrier, as well as a conductive material in the case of a conductive paste. The mixture may have total solid contents greater than 95% by weight. Preparing the mixture may include mixing the additive solution or conductive paste with the electrode active material to lubricate the electrode active material and subsequently adding and mixing in the binder. The method may further include subjecting the mixture to a shear force and, after the mixture has been subjected to the shear force, pressing the mixture into a free-standing film.

Claims (28)

1 . A method of manufacturing a free-standing electrode film, the method comprising:

preparing a mixture including an electrode active material, a binder, and an additive solution, the additive solution being in an amount less than 5% by weight of the mixture and including a polymer additive and a liquid carrier, the mixture having total solid contents greater than 95% by weight, said preparing comprising mixing the additive solution with the electrode active material to lubricate the electrode active material and subsequently adding the binder;

subjecting the mixture to a shear force; and,

after the mixture has been subjected to the shear force, pressing the mixture into a free-standing film.

2 . The method of claim 1 , further comprising mixing the polymer additive with the liquid carrier to produce the additive solution.

3 . The method of claim 1 , wherein the polymer additive is 0.5-10% by weight of the additive solution.

4 . The method of claim 3 , wherein the polymer additive is 1-5% by weight of the additive solution.

5 . The method of claim 1 , wherein the mixture further includes a conductive material, said preparing comprising mixing the additive solution with the electrode active material to lubricate the electrode active material and subsequently adding the binder and the conductive material.

6 . The method of claim 1 , wherein said pressing includes applying a roller press to the mixture.

7 . A method of manufacturing an electrode, the method comprising:

the method of claim 1 ; and

laminating the free-standing film on a current collector.

8 . A method of manufacturing a free-standing electrode film, the method comprising:

preparing a mixture including an electrode active material, a binder, and a conductive paste, the conductive paste being in an amount less than 5% by weight of the mixture and including a polymer additive, a liquid carrier, and a conductive material, the mixture having total solid contents greater than 95% by weight, said preparing comprising mixing the conductive paste with the electrode active material to lubricate the electrode active material and subsequently adding the binder;

subjecting the mixture to a shear force; and,

after the mixture has been subjected to the shear force, pressing the mixture into a free-standing film.

9 . The method of claim 8 , further comprising mixing the polymer additive, the liquid carrier, and the conductive material to produce the conductive paste.

10 . The method of claim 9 , wherein said mixing the polymer additive, the liquid carrier, and the conductive material to produce the conductive paste comprises mixing the polymer additive and the liquid carrier to produce an additive solution and, thereafter, mixing the conductive material into the additive solution.

11 . The method of claim 10 , wherein the polymer additive is 0.5-10% by weight of the additive solution.

12 . The method of claim 11 , wherein the polymer additive is 1-5% by weight of the additive solution.

13 . The method of claim 8 , wherein the conductive material is 1-20% by weight of the conductive paste.

14 . The method of claim 13 , wherein the conductive material is 2-15% by weight of the conductive paste.

15 . The method of claim 14 , wherein the conductive material is 5-10% by weight of the conductive paste.

16 . The method of claim 8 , wherein the mixture further includes a second conductive material other than the conductive material included in the conductive paste, said preparing comprising mixing the conductive paste with the electrode active material to lubricate the electrode active material and subsequently adding the binder and the second conductive material.

17 . The method of claim 8 , wherein said pressing includes applying a roller press to the mixture.

18 . A method of manufacturing an electrode, the method comprising:

the method of claim 8 ; and

laminating the free-standing film on a current collector.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2023
From: ZHONG, LINDA; SHAW, ERIKA; KIM, BAE KYUN
To: LICAP TECHNOLOGIES, INC.
Reel/Frame 065843/0173 →
Continuity (2)
Continuation 17014862 · Sep 8, 2020
Related Publication 20230056854A1 · Feb 23, 2023
References Cited (65)
US 4216045A · Morioka · 1980 [cited by applicant]
US 6086790A · Hayashi et al. · 2000 [cited by applicant]
US 6667000B1 · Nakazato et al. · 2003 [cited by applicant]
US 7090946B2 · Mitchell et al. · 2006 [cited by applicant]
US 7102877B2 · Mitchell et al. · 2006 [cited by applicant]
US 7295432B2 · Xu · 2007 [cited by applicant]
US 7352558B2 · Zhong et al. · 2008 [cited by applicant]
US 7492571B2 · Zhong et al. · 2009 [cited by applicant]
US 7495349B2 · Mitchell et al. · 2009 [cited by applicant]
US 7508651B2 · Mitchell et al. · 2009 [cited by applicant]
US 7791860B2 · Mitchell et al. · 2010 [cited by applicant]
US 7791861B2 · Zhong et al. · 2010 [cited by applicant]
US 7935155B2 · Mitchell et al. · 2011 [cited by applicant]
US 8072734B2 · Zhong et al. · 2011 [cited by applicant]
US 8213156B2 · Mitchell et al. · 2012 [cited by applicant]
US 10741843B2 · Duong et al. · 2020 [cited by applicant]
US 20040164440A1 · Ozaki et al. · 2004 [cited by applicant]
US 20050250011A1 · Mitchell et al. · 2005 [cited by applicant]
US 20050266298A1 · Mitchell et al. · 2005 [cited by applicant]
US 20080089006A1 · Zhong et al. · 2008 [cited by applicant]
US 20080201925A1 · Zhong et al. · 2008 [cited by applicant]
US 20090223630A1 · Mitchell et al. · 2009 [cited by applicant]
US 20090290288A1 · Mitchell et al. · 2009 [cited by applicant]
US 20090294081A1 · Gadkaree et al. · 2009 [cited by applicant]
US 20100014215A1 · Zhong et al. · 2010 [cited by applicant]
US 20110171371A1 · Li et al. · 2011 [cited by applicant]
US 20110287305A1 · Scordilis-Kelley et al. · 2011 [cited by applicant]
US 20130255872A1 · Zhong · 2013 [cited by applicant]
US 20160099461A1 · Kishimoto · 2016 [cited by applicant]
US 20180277847A1 · Saidi · 2018 [cited by applicant]
US 20200395614A1 · Liu et al. · 2020 [cited by applicant]
US 20210002496A1 · Kory · 2021 [cited by applicant]
CN 1509481A · 2004 [cited by applicant]
CN 100337350C · 2007 [cited by applicant]
CN 101313377A · 2008 [cited by applicant]
CN 102324317A · 2012 [cited by applicant]
CN 111564632 · 2020 [cited by applicant]
DE 102017208220A1 · 2018 [cited by applicant]
EP 1923895A1 · 2008 [cited by applicant]
EP 2908370B1 · 2018 [cited by applicant]
GB 1421514A · 1976 [cited by applicant]
JP S5013843A1 · 1973 [cited by applicant]
JP 50013843A · 1975 [cited by applicant]
JP 3793751B2 · 2006 [cited by applicant]
JP 2017517862A · 2017 [cited by applicant]
JP 2017532737A · 2017 [cited by applicant]
JP 2020196887A · 2020 [cited by applicant]
JP 2021519495A · 2021 [cited by applicant]
KR 1020060118023A · 2006 [cited by applicant]
KR 1020140136952A · 2014 [cited by applicant]
KR 1020190129969A · 2019 [cited by applicant]
UA 83075C2 · 2008 [cited by applicant]
WO 2016210419A1 · 2016 [cited by applicant]
Korean Office Action for Korean Application No. 10-2021-0109185; mailed Apr. 10, 2023. [cited by applicant]
Amendment Dissmissal for Korean Application No. 10-2021-0109185; mailed Jan. 26, 2023. [cited by applicant]
Korean Office Action for Application No. KR 10-2023-0088769; mailed Sep. 5, 2024. [cited by applicant]
European Office Action for Application No. EP 21 185 758.6-1103; mailed Dec. 16, 2022. [cited by applicant]
European Office Action for Application No. EP 21 185 758.6-1103; mailed Sep. 29, 2023. [cited by applicant]
Chinese Office Action for Chinese Patent Application No. 2021109247156; dated Aug. 31, 2022. [cited by applicant]
Decision for Grant of JP Application No. 2021-119484; dated Nov. 9, 2021. [cited by applicant]
Extended European Search Report for Application No. 13767354.7 dated Nov. 18, 2015 (11 pages). [cited by applicant]
Extended European Search Report for Application No. 201185758.6; dated Jan. 5, 2022. [cited by applicant]
International Search Report dated May 3, 2013 for PCT/US2013/028220 (6 pages). [cited by applicant]
Korean Office Action for KR 10-2021-0109185; dated Apr. 13, 2022. [cited by applicant]
Korean Office Action for KR 10-2021-0109185; dated Oct. 30, 2022. [cited by applicant]