IP Library › Granted Patent US 12,464,873
Granted Patent B2
US 12,464,873 · App. 17/970,406 · Granted Nov 4, 2025

Display device, method of fabricating the same, and tiled display device including a plurality of display devices

Inventors: Nak Cho Choi (Yongin-si, KR); Sang Woo An (Asan-si, KR); Yong Duck Son (Seongnam-si, KR); Won Ho Jang (Hwaseong-si, KR); Myung Koo Hur (Asan-si, KR)
Assignee: Samsung Display Co., Ltd.
H10H20/857G09F9/3026G09F9/33H01L25/0753H10H20/0364
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Quick Facts
Patent No.
US 12,464,873
App. No.
17/970,406
Granted
Nov 4, 2025
Kind
B2
Abstract

A display device includes a substrate including a first surface, a second surface opposite the first surface, a first chamfered surface extending from a side of the first surface, a second chamfered surface extending from a side of the second surface, and a first side surface connecting the first chamfered surface and the second chamfered surface, a plurality of subpixels on the first surface, a side wiring on the first surface, the first chamfered surface, the first side surface, the second chamfered surface, and the second surface of the substrate, and a circuit board on the second surface. The side wiring comprises a first portion on the first surface and a second portion on the first side surface, and includes metal particles where a packing density of the metal particles in the first portion is higher than a packing density of the metal particles in the second portion.

Claims (24)

1 . A display device comprising:

a substrate comprising a first surface, a second surface opposite the first surface, a first chamfered surface extending from a side of the first surface, a second chamfered surface extending from a side of the second surface, and a first side surface connecting the first chamfered surface and the second chamfered surface;

a plurality of subpixels on the first surface of the substrate and respectively comprising inorganic light emitting elements configured to emit light;

a side wiring on the first surface, the first chamfered surface, the first side surface, the second chamfered surface, and the second surface of the substrate; and

a circuit board on the second surface of the substrate and electrically connected to the side wiring,

wherein the side wiring comprises a first portion on the first surface of the substrate and a second portion on the first side surface of the substrate, and

wherein the side wiring comprises metal particles and a packing density of the metal particles of the first portion is higher than a packing density of the metal particles of the second portion.

2 . The display device of claim 1 , wherein the side wiring further comprises a third portion on the first chamfered surface of the substrate, and the packing density of the metal particles of the first portion is higher than a packing density of the metal particles of the third portion.

3 . The display device of claim 2 , wherein the packing density of the metal particles of the second portion is higher than the packing density of the metal particles of the third portion.

4 . The display device of claim 1 , wherein the side wiring further comprises a fourth portion on the second surface of the substrate, and a packing density of the metal particles of the fourth portion is higher than the packing density of the metal particles of the second portion.

5 . The display device of claim 4 , wherein the side wiring further comprises a fifth portion provided on the second chamfered surface of the substrate, and the packing density of the metal particles of the fourth portion is higher than a packing density of the metal particles of the fifth portion.

6 . The display device of claim 5 , wherein the packing density of the metal particles of the second portion is higher than the packing density of the metal particles of the fifth portion.

7 . The display device of claim 1 , wherein the side wiring further comprises a third portion on the first chamfered surface of the substrate, and a thickness of the first portion of the side wiring is greater than a thickness of the third portion of the side wiring.

8 . The display device of claim 7 , wherein a thickness of the second portion of the side wiring is greater than the thickness of the third portion of the side wiring.

9 . A tiled display device comprising:

a first display device and a second display device; and

a seam between the first display device and the second display device, the seam configured to couple the first display device to the second display device,

wherein each of the first display device and the second display device comprises:

a substrate comprising a first surface, a second surface opposite the first surface, a first chamfered surface extending from a side of the first surface, a second chamfered surface extending from a side of the second surface, and a first side surface connecting the first chamfered surface and the second chamfered surface;

a plurality of subpixels on the first surface of the substrate and respectively comprising inorganic light emitting elements configured to emit light;

a side wiring on the first surface, the first chamfered surface, the first side surface, the second chamfered surface, and the second surface of the substrate; and

a circuit board on the second surface of the substrate and electrically connected to the side wiring,

wherein the side wiring comprises a first portion on the first surface of the substrate and a second portion on the first side surface of the substrate, and

wherein the side wiring comprises metal particles and a packing density of the metal particles of the first portion is higher than a packing density of the metal particles of the second portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2022
From: CHOI, NAK CHO; AN, SANG WOO; SON, YONG DUCK; JANG, WON HO; HUR, MYUNG KOO
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 061951/0938 →
Priority Claims (1)
KR 10-2022-0012657 · Jan 27, 2022 · national
Continuity (1)
Related Publication 20230238494A1 · Jul 27, 2023
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