Sputtering apparatus and related systems and methods for sputtering substrates
A sputtering apparatus includes a substrate holder assembly configured to support a plurality of elongated substrates relative to a sputtering source. Each elongated substrate of the plurality of elongated substrates extends along a respective substrate axis. The sputtering apparatus also includes a holder drive assembly that is configured to rotate the substrate holder assembly about a holder axis. Each respective substrate axis is oriented non-parallel relative to the holder axis. Further, the sputtering apparatus includes a substrate drive assembly that is configured to individually rotate each elongated substrate about its respective substrate axis. The sputtered material is configured to be deposited onto the plurality of elongated substrates as the substrate holder assembly is being rotated about the holder rotational axis simultaneous with the rotation of each elongated substrate about its respective substrate axis.
1 . A sputtering system, comprising:
a sputtering source; and
a sputtering apparatus, comprising:
a substrate holder assembly configured to support a plurality of elongated substrates relative to the sputtering source, each elongated substrate of the plurality of elongated substrates extending along a respective substrate axis;
a holder drive assembly configured to rotate the substrate holder assembly about a holder axis;
a substrate drive assembly comprising a substrate transmission operatively coupled between a drive source and the plurality of elongated substrates such that the substate transmission is configured to individually rotate each elongated substrate about the respective substrate axis for said elongated substrate, each respective substrate axis oriented perpendicular to the holder axis,
wherein sputtered material is configured to be deposited onto the plurality of elongated substrates as the substrate holder assembly is being rotated about the holder axis simultaneous with rotation of each elongated substrate about the respective substrate axis for said elongated substrate,
wherein the drive source comprises a common drive source with the holder drive assembly,
wherein the holder drive assembly comprises a drive shaft coupled to the drive source and an intermediate shaft coupled to the drive shaft for rotation therewith about the holder axis, the substrate drive assembly including a gear-based transmission coupled between the intermediate shaft and the substrate transmission, and
wherein the gear-based transmission comprises at least one intermediate gear supported by the intermediate shaft and a fixed ring gear configured to mesh with the at least one intermediate gear as the intermediate shaft and the at least one intermediate gear rotate together about the holder axis.
2 . The sputtering system of claim 1 , wherein meshing of the at least one intermediate gear and the fixed ring gear results in rotation of the at least one intermediate gear relative to the intermediate shaft about an axis and wherein the at least one intermediate gear is coupled to the substrate transmission such that rotation of the at least one intermediate gear about the axis results in each elongated substrate being rotated about the respective substrate axis for said elongated substrate.
3 . The sputtering system of claim 1 , wherein the substrate transmission comprises a plurality of meshing substrate gears, each substrate gear of the plurality of substrate gears being coupled to a respective elongated substrate to allow said respective elongated substrate to be rotated about the respective substrate axis for said respective elongated substrate, the at least one intermediate gear being coupled to one of the plurality of substrate gears to rotationally drive the substrate transmission.