Semiconductor wafer
This semiconductor wafer has formed therein a plurality of chips, each of which has incorporated therein a semiconductor element to be tested. The semiconductor wafer is characterized by comprising: first pads which are formed on the chips, and to which a plurality of probe needles are connected, the probe needles being connected to the semiconductor elements and used for testing the semiconductor elements; and a second pad that is used for performing a contact check on the probe needles, the second pad having a conductive section greater in length than the distance between the centers of the first pads.
1 . A semiconductor wafer formed with a plurality of chips each of which is formed with a semiconductor element to be inspected, the semiconductor wafer comprising:
a set of first pads each of which is formed on a chip of the plurality of chips and each of which is configured to be connected with a probe needle to be connected to the semiconductor element, the probe needle being used for inspection of the semiconductor element; and
a second pad configured to be used for contact check of the probe needle, the second pad corresponding to the set of first pads and having a conductive portion whose length is longer than a center-to-center distance of the set of first pads,
wherein the second pad is present outside a scribe line of the chip and is connected to a second pad of another adjacent chip.
2 . The semiconductor wafer according to claim 1 , wherein
the second pad is conductive to a part of the first set of pads within a range where inspection of the semiconductor element is not disturbed.
3 . The semiconductor wafer according to claim 1 , wherein
a plurality of the second pads are disposed for one chip.
4 . The semiconductor wafer according to claim 1 , wherein
the second pad includes a pad portion whose minimum width is equal to or larger than 50 μm, is disposed in the chip in a horizontally and vertically symmetrical manner, and is provided to every chip.
5 . The semiconductor wafer according to claim 1 , wherein
the second pad includes a conductive portion whose length is larger than the center-to-center distance of the set of first pads at at least one or more positions in each of a vertical direction and a horizontal direction of the chip.
6 . The semiconductor wafer according to claim 1 , wherein
the second pad is also used for flip-chip connection.
7 . The semiconductor wafer according to claim 1 , wherein
a plurality of the second pads are disposed in one chip, and all of the plurality of second pads are conductive.