System and method for performing alignment and overlay measurement through an opaque layer
An alignment or overlay target that has an optically opaque layer disposed between the top and bottom target structure is measured using opto-acoustic metrology. A classifier library is generated for classifying whether an opto-acoustic metrology signal is on or off the bottom structure. A target may be measured by acquiring opto-acoustic measurement data for the bottom structure of the target and determining a location of the bottom structure using opto-acoustic metrology data acquired from the different locations over the bottom structure and the classifier library. Locations for acquisition of the data may be based on classification results of each measurement and a search pattern. The top structure of the target may be optically imaged. The relative position of the top structure with respect to the bottom structure is determined using the opto-acoustically determined location of the bottom structure and the image of the top structure.
1 . A method of non-destructive opto-acoustic metrology of a target on a sample, the target comprising an overlying structure and an underlying structure, and an optically opaque layer is disposed between the overlying structure and the underlying structure, the method comprising:
acquiring opto-acoustic metrology data for the underlying structure at different locations;
determining a location of the underlying structure using the opto-acoustic metrology data from the different locations;
acquiring an image of the overlying structure of the target; and
determining a relative position of the overlying structure with respect to the underlying structure based on the location of the underlying structure determined using the opto-acoustic metrology data and a location of the overlying structure determined using the image of the overlying structure.
2 . The method of claim 1 , wherein the different locations at which the opto-acoustic metrology data for the underlying structure is acquired comprises locations on the underlying structure and locations off the underlying structure.
3 . The method of claim 1 , wherein acquiring the opto-acoustic metrology data for the underlying structure at the different locations and determining the location of the underlying structure using the opto-acoustic metrology data comprises:
iteratively acquiring opto-acoustic metrology data for the underlying structure at different locations and determining if the opto-acoustic metrology data for the underlying structure is from locations on the underlying structure or locations off the underlying structure until the location of the target is determined.
4 . The method of claim 3 , wherein iteratively acquiring opto-acoustic metrology data for the underlying structure at different locations comprises scanning the sample in a pre-defined search pattern between acquisition of opto-acoustic metrology data at each location.
5 . The method of claim 1 , wherein acquiring opto-acoustic metrology data for the underlying structure at each of the different locations comprises:
directing an excitation beam at a location on the sample at an estimated location of the underlying structure, wherein an acoustic wave in the sample is produced in response to the excitation beam;
directing a probe beam at the location on the sample; and
detecting the opto-acoustic metrology data from interaction of the acoustic wave and the probe beam.
6 . The method of claim 1 , wherein determining the relative position of the overlying structure with respect to the underlying structure comprises an overlay determination.
7 . The method of claim 1 , further comprising obtaining a localized mapping of the underlying structure, wherein the localized mapping comprises collected opto-acoustic metrology data for a plurality of locations of the underlying structure, wherein determining the location of the underlying structure uses the opto-acoustic metrology data from the different locations and the localized mapping of the underlying structure.
8 . The method of claim 1 , further comprising obtaining a classifier library for the underlying structure that is below the optically opaque layer on a reference sample, wherein the classifier library comprises collected opto-acoustic metrology data for a plurality of locations of the underlying structure on the reference sample, wherein determining the location of the underlying structure uses the opto-acoustic metrology data from the different locations and the classifier library for the underlying structure.
9 . An apparatus for non-destructive acoustic metrology of a target on a sample, the target comprising an overlying structure and an underlying structure, and an optically opaque layer is disposed between the overlying structure and the underlying structure, comprising:
an opto-acoustic metrology device configured to acquire opto-acoustic metrology data for the underlying structure at different locations;
an imaging device configured to image the sample;
a stage for holding the sample and configured to move the sample with respect to the opto-acoustic metrology device;
at least one processor coupled to the opto-acoustic metrology device, the imaging device, and the stage, the at least one processor configured to:
acquire opto-acoustic metrology data from the opto-acoustic metrology device for the underlying structure at different locations;
determine a location of the underlying structure using the opto-acoustic metrology data from the different locations;
acquire an image of the overlying structure of the target from the imaging device; and
determine a relative position of the overlying structure with respect to the underlying structure based on the location of the underlying structure determined using the opto-acoustic metrology data and a location of the overlying structure determined using the image of the overlying structure.
10 . The apparatus of claim 9 , wherein the different locations at which the opto-acoustic metrology data for the underlying structure is acquired comprises locations on the underlying structure and locations off the underlying structure.
11 . The apparatus of claim 9 , wherein the at least one processor is configured to acquire the opto-acoustic metrology data for the underlying structure at the different locations and determine the location of the underlying structure using the opto-acoustic metrology data by being configured to:
iteratively acquire opto-acoustic metrology data for the underlying structure at different locations and determine if the opto-acoustic metrology data for the underlying structure is from locations on the underlying structure or locations off the underlying structure until the location of the target is determined.
12 . The apparatus of claim 11 , wherein the at least one processor is configured to iteratively acquire opto-acoustic metrology data for the underlying structure at different locations by being configured to control the stage to scan the sample in a pre-defined search pattern between acquisition of opto-acoustic metrology data at each location by the opto-acoustic metrology device.
13 . The apparatus of claim 11 , wherein the at least one processor is further configured to obtain a localized mapping of the underlying structure, wherein the localized mapping comprises collected opto-acoustic metrology data for a plurality of locations of the underlying structure, wherein the at least one processor is configured to determine the location of the underlying structure uses the opto-acoustic metrology data from the different locations and the localized mapping of the underlying structure.
14 . The apparatus of claim 11 , wherein the at least one processor is further configured to obtain a classifier library for the underlying structure that is below the optically opaque layer on a reference sample, wherein the classifier library comprises collected opto-acoustic metrology data for a plurality of locations of the underlying structure on the reference sample, wherein the at least one processor is configured to determine the location of the underlying structure using the opto-acoustic metrology data from the different locations and the classifier library for the underlying structure.
15 . The apparatus of claim 9 , wherein the opto-acoustic metrology device comprises:
an excitation beam source configured to generate and direct an excitation beam at a location on the sample at an estimated location of the underlying structure, wherein an acoustic wave in the sample is produced in response to the excitation beam;
a probe beam source configured to generate and direct a probe beam at the location on the sample; and
a sensor configured to detect the opto-acoustic metrology data from interaction of the acoustic wave and the probe beam.
16 . The apparatus of claim 9 , wherein the at least one processor is configured to determine the relative position of the overlying structure with respect to the underlying structure in an overlay determination.
17 . An apparatus for non-destructive acoustic metrology of a target on a sample, the target comprising an overlying structure and an underlying structure, and an optically opaque layer is disposed between the overlying structure and the underlying structure, comprising:
means for acquiring opto-acoustic metrology data for the underlying structure at different locations;
means for determining a location of the underlying structure using the opto-acoustic metrology data from the different locations;
means for acquiring an image of the overlying structure of the target; and
means for determining a relative position of the overlying structure with respect to the underlying structure based on the location of the underlying structure determined using the opto-acoustic metrology data and a location of the overlying structure determined using the image of the overlying structure.
18 . The apparatus of claim 17 , wherein the different locations at which the opto-acoustic metrology data for the underlying structure is acquired comprises locations on the underlying structure and locations off the underlying structure.
19 . The apparatus of claim 17 , wherein the means for acquiring the opto-acoustic metrology data for the underlying structure at the different locations and means for determining the location of the underlying structure using the opto-acoustic metrology data comprises:
means for iteratively acquiring opto-acoustic metrology data for the underlying structure at different locations and means for determining if the opto-acoustic metrology data for the underlying structure is from locations on the underlying structure or locations off the underlying structure until the location of the target is determined.
20 . The apparatus of claim 19 , wherein the means for iteratively acquiring opto-acoustic metrology data for the underlying structure at different locations comprises means for scanning the sample in a pre-defined search pattern between acquisition of opto-acoustic metrology data at each location.
21 . The apparatus of claim 17 , wherein the means for determining the relative position of the overlying structure with respect to the underlying structure comprises an overlay determination.
22 . The apparatus of claim 17 , further comprising means for obtaining a localized mapping of the underlying structure, wherein the localized mapping comprises collected opto-acoustic metrology data for a plurality of locations of the underlying structure, wherein the means for determining the location of the underlying structure uses the opto-acoustic metrology data from the different locations and the localized mapping of the underlying structure.
23 . The apparatus of claim 17 , further comprising means for obtaining a classifier library for the underlying structure that is below the optically opaque layer on a reference sample, wherein the classifier library comprises collected opto-acoustic metrology data for a plurality of locations of the underlying structure on the reference sample, wherein the means for determining the location of the underlying structure uses the opto-acoustic metrology data from the different locations and the classifier library for the underlying structure.