Vacuum processing apparatus
A vacuum processing apparatus including a vacuum processing unit embracing a vacuum vessel into which a wafer to be processed is transferred and processed; a lock chamber into which the wafer is transferred; an atmospheric transfer unit embracing an atmospheric transfer chamber maintained at atmospheric pressure and inside which the wafer is transferred; and a wafer preserving container for stacking a processed wafer. The wafer preserving container is provided inside with an exhaust port which is placed behind the opening, in front of the stacking space, and in an upper and a lower edge regions relative to the stacking space and exhausts gas in the stacking space to outside and a manifold which is placed behind the stacking space, towards the opening between the upper edge region and the lower edge region, and has gas outlets to supply certain gas into the stacking space.
1 . A vacuum processing apparatus comprising: a vacuum processing unit embracing a vacuum vessel with a depressurized inside space into which a wafer to be processed is transferred and processed; a lock chamber into which the wafer before or after being processed is transferred; an atmospheric transfer unit with a casing embracing an atmospheric transfer chamber which is connected with the lock chamber and maintained at atmospheric pressure and inside which gas flows are formed from upward to downward and the wafer is transferred; and a wafer preserving container which embraces a processed wafer stacking space inside thereof, whose front end side is installed onto a wall surface of the casing, and whose interior communicates with the atmospheric transfer chamber via an opening located in the side wall,
wherein the wafer preserving container is provided inside with an exhaust port which is placed behind the opening, in front of the stacking space, and in an upper edge region and a lower edge region relative to the stacking space and exhausts gas in the stacking space to outside and a manifold which is placed behind the stacking space, towards the opening between the upper edge region and the lower edge region, and has gas outlets to supply certain gas into the stacking space.
2 . The vacuum processing apparatus according to claim 1 ,
wherein the manifold is placed at a corner in both left and right sides of the stacking space, as viewed from the opening.
3 . The vacuum processing apparatus according to claim 1 ,
wherein the wafer preserving container is provided with another manifold which is placed between the stacking space and the exhaust port and supplies the certain gas into the stacking space.
4 . The vacuum processing apparatus according to claim 3 ,
wherein the other manifold is placed at a corner in both left and right sides of the stacking space, as viewed from the opening.
5 . The vacuum processing apparatus according to claim 1 ,
wherein the exhaust port has a tubular form with its axis extending in a horizontal direction and is placed such that the axis of the tubular form is in parallel with the opening.
6 . The vacuum processing apparatus according to claim 5 ,
wherein the exhaust port is provided with at least one exhaust hole in a position on an outside wall surface of the tubular form, the position facing the stacking space.
7 . The vacuum processing apparatus according to claim 6 ,
wherein the exhaust port is configured such that an angle at which the exhaust hole faces the stacking space is adjustable.
8 . The vacuum processing apparatus according to claim 1 ,
wherein the manifold has a tubular form with its axis extending in a vertical direction and is provided with the gas outlets in multiple positions on an outside wall surface of the tubular form, the gas outlets being positioned between a wafer stacked inside the stacking space and the ceiling or bottom of the stacking space or between two adjacent ones of multiple wafers stacked.
9 . The vacuum processing apparatus according to claim 2 ,
wherein the wafer preserving container is provided with another manifold which is placed between the stacking space and the exhaust port and supplies the certain gas into the stacking space.
10 . The vacuum processing apparatus according to claim 9 ,
wherein the other manifold is placed at a corner in both left and right sides of the stacking space, as viewed from the opening.
11 . The vacuum processing apparatus according to claim 9 ,
wherein the exhaust port has a tubular form with its axis extending in a horizontal direction and is placed such that the axis of the tubular form is in parallel with the opening.
12 . The vacuum processing apparatus according to claim 11 ,
wherein the exhaust port is provided with at least one exhaust hole in a position on an outside wall surface of the tubular form, the position facing the stacking space.
13 . The vacuum processing apparatus according to claim 12 ,
wherein the exhaust port is configured such that an angle at which the exhaust hole faces the stacking space is adjustable.
14 . The vacuum processing apparatus according to claim 9 ,
wherein the manifold has a tubular form with its axis extending in a vertical direction and is provided with the gas outlets in multiple positions on an outside wall surface of the tubular form, the gas outlets being positioned between a wafer stacked inside the stacking space and the ceiling or bottom of the stacking space or between two adjacent ones of multiple wafers stacked.