Semiconductor memory device comprises a bit line having a plurality of pins extending toward a substrate
View Patent ↗The present disclosure relates to a semiconductor memory device and a fabricating method thereof, includes a substrate, a plurality of gate structures, a plurality of isolation fins, at least one bit line, and a plug. The gate structures are disposed in the substrate, being parallel with each other along a first direction. The isolation fins are disposed on the substrate, parallel with each other and extending along the first direction, over each of the gate structures respectively. The bit line is disposed on the substrate to extend along a second direction being perpendicular to the first direction. The bit line includes a plurality of pins extending toward the substrate, being alternately arranged with the isolation fins along the second direction. The plug is disposed on the substrate, being alternately with the bit line in the first direction.
1 . A semiconductor memory device, comprising:
a substrate;
a plurality of gate structures disposed in the substrate, parallel with each other and extending along a first direction;
a plurality of isolation fins disposed on the substrate, parallel with each other and extending along the first direction, over each of the gate structures respectively;
at least one bit line disposed on the substrate, extending along a second direction being perpendicular to the first direction, wherein the bit line comprises a plurality of pins extending toward the substrate, and the pins are alternately arranged with the isolation fins along the second direction; and
a plug disposed on the substrate, the plug and the bit line being alternately disposed in the first direction.
2 . The semiconductor memory device according to claim 1 , wherein the plurality of pins directly contacts the substrate.
3 . The semiconductor memory device according to claim 1 , wherein a portion of the isolation fins is disposed under the bit line.
4 . The semiconductor memory device according to claim 1 , wherein a bottommost surface of the pins is lower than a bottommost surface of the isolation fins.
5 . The semiconductor memory device according to claim 1 , further comprising:
a plurality of spacers, disposed on sidewalls of the bit line and the isolation fins, wherein the spacers disposed on sidewalls of a portion of the pins comprise different heights.
6 . The semiconductor memory device according to claim 5 , wherein the spacers disposed on the sidewalls of the isolation fins comprise different heights.
7 . The semiconductor memory device according to claim 5 , wherein a portion of the spacers is disposed within the substrate and a bottommost surface of the portion of the spacers is lower than a top surface of the substrate.
8 . The semiconductor memory device according to claim 1 , wherein a top surface of the isolation fins is lower than a top surface of the plug.
9 . The semiconductor memory device according to claim 1 , further comprising:
an insulating layer disposed on the substrate, and the isolation fins are disposed on the insulating layer.
10 . The semiconductor memory device according to claim 9 , wherein the insulating layer comprises an oxide-nitride-oxide structure.
11 . The semiconductor memory device according to claim 1 , wherein the bit line comprises a semiconductor layer, a barrier layer, and a conductive layer stacked from bottom to top.
12 . The semiconductor memory device according to claim 11 , wherein the semiconductor layer and the barrier layer comprises a U-shape structure.
13 . The semiconductor memory device according to claim 11 , wherein the bit line further comprises a mask layer disposed over the semiconductor layer, the barrier layer and the conductive layer.