Device for heating sample
A device for heating a sample according to the present disclosure includes: a thermal block unit accommodating a reaction vessel; a heat transfer module thermally connected to the thermal block unit; and a heat sink thermally connected to the heat transfer module, wherein the thermal block unit includes: a thermal block having a plurality of accommodating portions for accommodating the reaction vessel; and a heating plate having a plurality of holes into which the plurality of accommodating portions are inserted.
1 . A device for heating a sample, comprising:
a thermal block unit accommodating a reaction vessel;
a heat transfer module thermally connected to the thermal block unit; and
a heat sink thermally connected to the heat transfer module,
wherein the thermal block unit comprises:
a thermal block having a plurality of accommodating portions for accommodating the reaction vessel; and
a heating plate having a plurality of holes into which the plurality of accommodating portions are inserted.
2 . The device of claim 1 , wherein the heating plate comprises an edge region and a central region, the edge region having a greater power density than the central region.
3 . The device of claim 1 , wherein the heating plate is a flexible printed circuit board (FPCB).
4 . The device of claim 1 , wherein the thermal block comprises a base portion, and the plurality of accommodating portions are formed protruding from the base portion.
5 . The device of claim 4 , wherein the plurality of accommodating portions each comprise a cylindrical body and a conical recess formed in the cylindrical body.
6 . The device of claim 4 , further comprising an edge insulator enclosing the periphery of the base portion.
7 . The device of claim 4 , wherein the base portion is thermally connected to the heat transfer module via a heat conducting layer.
8 . The device of claim 7 , wherein the heat transfer module comprises a Peltier element.
9 . The device of claim 6 , further comprising a clamp coupled to the edge insulator.
10 . The device of claim 9 , wherein the clamp is installed to press the base portion.
11 . The device of claim 4 , further comprising a heat insulating plate having a plurality of holes into which the plurality of accommodating portions is inserted.
12 . The device of claim 11 , wherein the heat insulating plate is a porous polymer.
13 . The device of claim 12 , wherein the porous polymer is a silicone sponge.
14 . The device of claim 11 , wherein the heating plate is disposed between the heat insulating plate and the base portion.