IP Library Granted Patent US 12,480,212
Granted Patent B2
US 12,480,212 · App. 17/709,304 · Granted Nov 25, 2025

Chemical-dose substrate deposition monitoring

Inventors: Albert Barrett Hicks (Sunnyvale, CA); Serghei Malkov (Hayward, CA)
Assignee: Applied Materials, Inc.
C23C16/52C23C16/45544G06N20/20
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Quick Facts
Patent No.
US 12,480,212
App. No.
17/709,304
Granted
Nov 25, 2025
Kind
B2
Abstract

A method including receiving, by a processing device, first data characterizing a film on a surface of a substrate processed within a recess of a sensor assembly positioned in a first region of a processing chamber. The processed surface of the film corresponds to a substrate processing procedure. The method further includes determining, based on the first data, a rate of advancement of a first processed surface boundary of the film across the surface of the substrate. The method further includes determining, using the rate of advancement, a dosage strength of a reactive species delivered to the first region of the processing. The method may further include preparing an indication of the dosage strength for presentation on a graphical user interface (GUI). The method may further include altering an operation of the processing chamber based on the dosage strength.

Claims (43)

1 . A method, comprising:

receiving, by a processing device, first data characterizing a processed surface of a film disposed on a surface of a substrate processed within a recess of a sensor assembly positioned in a first region of a processing chamber, that was processed according to a non-line of sight deposition procedure;

determining, by the processing device based on the first data, a rate of advancement of a first processed surface boundary of the film across the surface of the substrate caused by the non-line of sight deposition procedure, wherein the rate of advancement is correlated with a dosage strength of a reactive species delivered to the first region of the processing chamber during the non-line of sight deposition procedure and a predicted depth of deposition within a feature of a patterned substrate at the region;

determining, by the processing device using the rate of advancement, the dosage strength of the reactive species delivered to the first region of the processing chamber; and

altering, by the processing device, an operation of the processing chamber for future execution of the non-line of sight deposition procedure based on the dosage strength.

2 . The method of claim 1 , further comprising:

determining, using the first data, a thickness map comprising one or more values indicating a thickness of the film at one or more location across the surface of the substrate, wherein the dosage strength is determined further using the thickness map.

3 . The method of claim 2 , further comprising:

determining, using the thickness map, a first portion of the film comprising a first spatial variance below a threshold value;

determining, using the thickness map, a second portion of the film comprising a second spatial variance above the threshold value; and

determining, using the thickness map, a thickness gradient of the film in the second portion, wherein the dosage strength is determined further using the thickness gradient.

4 . The method of claim 1 , further comprising:

determining, by the processing device based on the dosage strength, a first update to one or more process parameters of the non-line of sight deposition procedure, wherein altering the operation is based on the first update.

5 . The method of claim 1 , wherein the first data comprises image data characterizing light reflected from one or more locations across the surface of the film.

6 . The method of claim 5 , wherein the light reflected from the one or more locations comprises at least one of polarization filtered light or color filtered light.

7 . The method of claim 1 , wherein the first data comprises one or more values indicative of a mass of the film at one or more locations across the surface of the substrate.

8 . The method of claim 1 , wherein the first data comprises one or more values characterizing selections of the film corresponding to discrete locations across the surface of the substrate.

9 . The method of claim 1 , wherein the first data is received while the non-line of sight deposition procedure is occurring.

10 . The method of claim 1 , further comprising:

using the first data as input to a machine learning model; and

receiving one or more outputs from the machine learning model, the one or more outputs indicating the dosage strength of the processed surface boundary of the film.

11 . The method of claim 1 , wherein altering the operation of the processing chamber results in a change to one or more of:

a gas flow rate in the processing chamber;

a gas mix provided to the processing chamber;

pressure;

temperature;

process time; or

radio frequency power.

12 . A method, comprising:

receiving, by a processing device, first data characterizing one or more process conditions of a processing chamber, wherein the one or more process conditions are associated with performing a non-line of sight deposition procedure;

determining a process result prediction by processing the first data using one or more machine learning models (MLMs), the process result prediction characterizing a processed surface of a film disposed on a surface of a substrate processed within a recess of a sensor assembly disposed within the processing chamber, the substrate processed according to the non-line of sight deposition procedure under the one or more process conditions; and

altering, by the processing device, an operation of the processing chamber for future execution of the non-line of sight deposition procedure based on the process result prediction.

13 . The method of claim 12 , wherein the process result prediction comprises a thickness profile indicating one or more thickness values of the film at one or more locations across the surface of the substrate.

14 . The method of claim 12 , wherein the process result prediction comprises a rate of advancement of a processed surface boundary of the film across the surface of the substrate.

15 . The method of claim 12 , further comprising:

determining, by the processing device based on the process result prediction, a first update to the non-line of sight deposition procedure, wherein altering the operation is based on the first update.

16 . The method of claim 12 , wherein altering the operation of the processing chamber results in a change to one or more of:

a gas flow rate in the processing chamber;

a gas mix provided to the processing chamber;

pressure;

temperature;

process time; or

radio frequency power.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2022
From: HICKS, ALBERT BARRETT, III; MALKOV, SERGHEI
To: APPLIED MATERIALS, INC.
Reel/Frame 060453/0913 →
Continuity (1)
Related Publication 20230313379A1 · Oct 5, 2023
References Cited (32)
US 6162488A · Gevelber · 2000 [cited by examiner]
US 6335288B1 · Kwan · 2002 [cited by examiner]
US 8007588B2 · Ito et al. · 2011 [cited by applicant]
US 8529700B2 · Carcia et al. · 2013 [cited by applicant]
US 9792393B2 · Tetiker et al. · 2017 [cited by applicant]
US 10197908B2 · Sriraman et al. · 2019 [cited by applicant]
US 20030022528A1 · Todd · 2003 [cited by examiner]
US 20030143324A1 · Delzer · 2003 [cited by examiner]
US 20040031776A1 · Gevelber · 2004 [cited by examiner]
US 20050107870A1 · Wang · 2005 [cited by examiner]
US 20060144335A1 · Lee et al. · 2006 [cited by applicant]
US 20110117288A1 · Honda · 2011 [cited by examiner]
US 20150219508A1 · Bryant · 2015 [cited by examiner]
US 20160322503A1 · Tezuka · 2016 [cited by examiner]
US 20170177997A1 · Karlinsky et al. · 2017 [cited by applicant]
US 20180179630A1 · Takezawa et al. · 2018 [cited by applicant]
US 20190347398A1 · Cramer · 2019 [cited by examiner]
US 20190368032A1 · Harutyunyan · 2019 [cited by examiner]
US 20200377997A1 · Trinh et al. · 2020 [cited by applicant]
US 20210175103A1 · Madananth · 2021 [cited by examiner]
US 20210407066A1 · Dhandapani et al. · 2021 [cited by applicant]
US 20230085325A1 · Kyokane et al. · 2023 [cited by applicant]
US 20230316486A1 · Hicks, III · 2023 [cited by examiner]
US 20240055282A1 · Yang et al. · 2024 [cited by applicant]
JP 2014126263A · 2014 [cited by applicant]
Kaur, Kamaljeet, et al., “Determining real-time mass deposition with a quartz crystal microbalance in an electrostatic, parallel-flow, air-liquid interface exposure system”. Journal of Aerosol Science 151 (2021) 105653,… [cited by examiner]
Sippola, Mark R., et al., “Experiments Measuring Particle Deposition from Fully Developed Turbulent Flow in Ventilation Ducts”. Aerosol Science and Technology, 38:914-925, 2004. [cited by examiner]
Wostbrock, Neal, et al., “Stress and Refractive Index Control of SiO2 Thin Films for Suspended Waveguides”. Nanomaterials, 2020, 10, 2105 pp. 1-9. [cited by examiner]
International Search Report and Written Opinion for International Application No. PCT/US2023/011464, mailed Jul. 26, 2023, 11 Pages. [cited by applicant]
Cho D., H., et al.. “Vision-based High Speed Wafer Film Thickness Profile Estimation with Nonlinear Regression,” ODS: Industrial Optical Devices and Systems, SPIE, 2020, vol. 11500, pp. K1-K13. [cited by applicant]
Notley S., et al., “Examining the Use of Neural Networks for Feature Extraction: A Comparative Analysis Using Deep Learning, Support Vector Machines, and K-Nearest Neighbor Classifiers,” Arxiv Preprint arXiv:1805.02294v… [cited by applicant]
Thevenot A., “Understand and Visualize Color Spaces to Improve Your Machine Learning and Deep Learning Models,” Towards Data Science, May 14, 2020, pp. 1-31. Retrieved from [https://towardsdatascience.com/understand-and… [cited by applicant]