Granted Patent B2

US 12,481,259 · App. 18/096,965 · Granted Nov 25, 2025

Inventors: Miguel Galvez (Westford, MA); Richard J. Campero (Irvine, CA); Eric G. Lang (Milwaukee, WI); Abu Bakr Khan (Franklin, WI); Donald A. Gottschalk, Jr. (Racine, WI); Daniel M. Curtis (Franklin, WI); Trent M. Swanson (Wellington, FL); Karl F. Reichenberger (Mequon, WI)

Assignee: TYCO FIRE & SECURITY GMBH

G05B19/042G05B2219/25011

Abstract

Claims (74)

1 . A method, comprising:

activating a building platform chip integrated with a circuit board of a building device of a building and coupled, via at least one trace of the circuit board, with a processing circuit of the circuit board of the building device;

retrieving, by the building platform chip, first data from the processing circuit via the at least one trace of the building device through communication with the processing circuit;

generating, by the building platform chip using the retrieved first data, second data to cause a digital twin of the building device to be constructed; and

transmitting, by the building platform chip, the second data to a server to cause the server to construct the digital twin.

2 . The method of claim 1 , comprising:

establishing, by the building platform chip, a communication link between the building platform chip and the processing circuit of the building device; and

retrieving, by the building platform chip, the first data from the processing circuit through communication with the processing circuit.

3 . The method of claim 1 , comprising:

establishing, by the building platform chip, a communication link between the building platform chip and a building platform; and

transmitting, by the building platform chip, the second data to the building platform through the communication link to construct the digital twin.

4 . The method of claim 1 , comprising:

integrating the building platform chip into the building device by:

inserting the building platform chip into a receiver of the building device to electrically couple the building platform chip to the processing circuit; or

mounting the building platform chip to the circuit board of the building device to electrically couple the building platform chip to the processing circuit via at least one electrical trace.

5 . The method of claim 1 , wherein:

the digital twin includes a building graph comprising a plurality of nodes and a plurality of edges between the plurality of nodes;

the first data includes indications of a plurality of entities and indications of a plurality of relationships between the plurality of entities;

the method comprising:

constructing the building graph to include the plurality of nodes representing the plurality of entities and the plurality of edges between the plurality of nodes representing the plurality of relationships between the plurality of entities.

6 . The method of claim 1 , comprising:

constructing, by the building platform chip, the digital twin based on the first data defining the digital twin; and

transmitting, by the building platform chip, the digital twin to a building platform responsive to construction of the digital twin.

7 . The method of claim 1 , comprising:

transmitting, by the building platform chip, the first data to a building platform, the building platform to construct the digital twin based on the first data and store the digital twin.

8 . The method of claim 1 , wherein the first data is at least one of:

entities comprising at least one of an indication of the building device, an indication of a point of the building device, an indication of a space that the building device is located in, or an indication of another building device related to the building device;

event data describing an event generated by the building device; or

relationships between the entities.

9 . The method of claim 1 , comprising:

receiving new data defining the digital twin; and

updating the digital twin of the building device through transmitting the new data defining the digital twin to a building platform.

10 . A building device, comprising:

a processing circuit; and

a building platform chip integrated with a circuit board of the building device and coupled, via at least one trace of the circuit board, to the processing circuit of the circuit board of the building device, the building platform chip configured to:

retrieve first data from the processing circuit via the at least one trace of the building device through communication with the processing circuit;

generate, using the retrieved first data, second data to cause a digital twin of the building device to be constructed; and

transmit the second data to a server to cause the server to construct the digital twin.

11 . The building device of claim 10 , the building platform chip configured to:

establish a communication link between the building platform chip and the processing circuit of the building device in response to an integration of a building platform into the building device; and

retrieve the first data from the processing circuit through communication with the processing circuit.

12 . The building device of claim 10 , the building platform chip configured to:

establish a communication link between the building platform chip and a building platform; and

transmit the second data to the building platform through the communication link to construct the digital twin.

13 . The building device of claim 10 , wherein:

the digital twin includes a building graph comprising a plurality of nodes and a plurality of edges between the plurality of nodes;

the first data includes indications of a plurality of entities and indications of a plurality of relationships between the plurality of entities;

the building platform chip configured to:

construct the building graph to include the plurality of nodes representing the plurality of entities and the plurality of edges between the plurality of nodes representing the plurality of relationships between the plurality of entities.

14 . The building device of claim 10 , the building platform chip configured to:

construct the digital twin based on the first data defining the digital twin; and

transmit the digital twin to a building platform responsive to construction of the digital twin.

15 . The building device of claim 10 , the building platform chip configured to:

transmit the second data defining the digital twin to a building platform, the building platform to construct the digital twin based on the second data and store the digital twin.

16 . The building device of claim 10 , wherein the first data is at least one of:

entities comprising at least one of an indication of the building device, an indication of a point of the building device, an indication of a space that the building device is located in, or an indication of another building device related to the building device;

event data describing an event generated by the building device; or

relationships between the entities.

17 . A building platform chip, configured to:

integrate with a circuit board of a building device and couple, via at least one trace of the circuit board, to a processing circuit of the circuit board of the building device;

retrieve first data from the processing circuit via the at least one trace of the building device through communication with the processing circuit;

generate, using the retrieved first data, second data to cause a digital twin of the building device to be constructed; and

transmit the second data to a server to cause the server to construct the digital twin.

18 . The building platform chip of claim 17 , configured to:

establish a communication link between the building platform chip and the processing circuit of the building device in response to an activation of the building platform chip; and

retrieve the first data from the processing circuit through communication with the processing circuit.

19 . The building platform chip of claim 17 , configured to:

establish a communication link between the building platform chip and a building platform; and

transmit the second data to the building platform through the communication link to construct the digital twin.

20 . The building platform chip of claim 17 , wherein:

the digital twin includes a building graph comprising a plurality of nodes and a plurality of edges between the plurality of nodes;

the first data includes indications of a plurality of entities and indications of a plurality of relationships between the plurality of entities;

the building platform chip configured to:

construct the building graph to include the plurality of nodes representing the plurality of entities and the plurality of edges between the plurality of nodes representing the plurality of relationships between the plurality of entities.

Assignments (2)

Continuity (5)

References Cited (400)