IP Library › Granted Patent US 12,482,606
Granted Patent B2
US 12,482,606 · App. 18/513,984 · Granted Nov 25, 2025

Multilayered ceramic capacitor

Inventors: Sung Han (Suwon-si, KR); Sunghoon Kim (Suwon-si, KR); Mi-Geum Kim (Suwon-si, KR); Sangik Cho (Suwon-si, KR); Hoseung Jang (Suwon-si, KR); Kipyo Hong (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/2325H01G4/30
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Quick Facts
Patent No.
US 12,482,606
App. No.
18/513,984
Granted
Nov 25, 2025
Kind
B2
Abstract

A multilayer ceramic capacitor may include a ceramic body, a plurality of first internal electrodes and a plurality of second internal electrodes disposed inside the ceramic body, a first external electrode disposed outside the ceramic body and connected to the plurality of first internal electrodes, and a second external electrode disposed outside the ceramic body and connected to the plurality of second internal electrodes, where the first external electrode may include, a first conductive carbon layer electrically connected to the plurality of first internal electrodes, and a first plated layer covering the first conductive carbon layer, and where the second external electrode may include, a second conductive carbon layer electrically connected to the plurality of second internal electrodes, and a second plated layer covering the second conductive carbon layer.

Claims (126)

1 . A multilayer ceramic capacitor, comprising:

a ceramic body comprising a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface facing each other in a second direction and connecting the first surface and the second surface, a fifth surface and a sixth surface facing each other in a third direction and connecting the first surface and the second surface;

a plurality of first internal electrodes and a plurality of second internal electrodes disposed inside the ceramic body;

a first external electrode disposed on the ceramic body and connected to the plurality of first internal electrodes, the first external electrode comprising a first conductive carbon layer connected to the plurality of first internal electrodes on the first surface of the ceramic body and extending to at least one surface among the third surface, the fourth surface, the fifth surface, and the sixth surface, and a first plated layer covering the first conductive carbon layer; and

a second external electrode disposed on the ceramic body and connected to the plurality of second internal electrodes, the second external electrode comprising a second conductive carbon layer connected to the plurality of second internal electrodes on the second surface of the ceramic body and extending to at least one surface among the third surface, the fourth surface, the fifth surface, and the sixth surface, and a second plated layer covering the second conductive carbon layer,

wherein end portions of the plurality of first internal electrodes are exposed through the first surface of the ceramic body, and end portions of the plurality of second internal electrodes are exposed through the second surface of the ceramic body, and

wherein the first conductive carbon layer is in direct contact with the first surface of the ceramic body between the exposed end portions of the plurality of first internal electrodes, and the second conductive carbon layer is in direct contact with the second surface of the ceramic body between the exposed end portions of the plurality of second internal electrodes.

2 . The multilayer ceramic capacitor of claim 1 , wherein the first conductive carbon layer and the second conductive carbon layer comprise one or more selected from graphite, graphene, carbon nanotube, fullerene, and carbon black.

3 . The multilayer ceramic capacitor of claim 1 , wherein the first plated layer comprises:

a first layer covering the first conductive carbon layer;

a second layer covering the first layer; and

a third layer covering the second layer.

4 . The multilayer ceramic capacitor of claim 3 , wherein:

the first layer comprises copper (Cu);

the second layer comprises nickel (Ni); and

the third layer comprises tin (Sn).

5 . The multilayer ceramic capacitor of claim 1 , wherein the second plated layer comprises:

a first layer covering the second conductive carbon layer;

a second layer covering the first layer; and

a third layer covering the second layer.

6 . The multilayer ceramic capacitor of claim 5 , wherein:

the first layer comprises copper (Cu);

the second layer comprises nickel (Ni); and

the third layer comprises tin (Sn).

7 . The multilayer ceramic capacitor of claim 1 , wherein:

a thickness of the first conductive carbon layer is 0.1 μm or more and 20 μm or less; and

a thickness of the second conductive carbon layer is 0.1 μm or more and 20 μm or less.

8 . The multilayer ceramic capacitor of claim 1 , wherein:

the first conductive carbon layer has:

a portion having a first thickness t 1 and contacting the first surface of the ceramic body,

a portion having a second thickness t 2 and contacting the fifth surface, and

a portion having a third thickness t 3 and contacting the sixth surface; and

0

<

t

⁢

1

≤

10

*

t

⁢

2

⁢

and

⁢

0

<

t

⁢

1

≤

10

*

t

3.

9 . The multilayer ceramic capacitor of claim 1 , wherein:

the second conductive carbon layer has:

a portion having a first thickness t 1 ′ and contacting the second surface of the ceramic body,

a portion having a second thickness t 2 ′ and contacting the fifth surface, and

a portion having a third thickness t 3 ′ and contacting the sixth surface; and

0

<

t

⁢

1

′

≤

10

*

t

⁢

2

′

⁢

and

⁢

0

<

t

⁢

1

′

≤

10

*

t

⁢

3

′

.

10 . A multilayer ceramic capacitor, comprising:

a ceramic body comprising a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface facing each other in a second direction and connecting the first surface and the second surface, a fifth surface and a sixth surface facing each other in a third direction and connecting the first surface and the second surface,

a plurality of first internal electrodes and a plurality of second internal electrodes disposed inside the ceramic body,

a first external electrode disposed on the ceramic body and connected to the plurality of first internal electrodes, the first external electrode comprising:

a first conductive carbon layer disposed on the first surface of the ceramic body and connected to the plurality of first internal electrodes; and

a first metal layer disposed on the fifth surface of the ceramic body and having an edge toward the first surface, the edge contacting the first conductive carbon layer, and

a second external electrode disposed on the ceramic body and connected to the plurality of second internal electrodes, the second external electrode comprising:

a second conductive carbon layer disposed on the second surface of the ceramic body and connected to the plurality of second internal electrodes; and

a second metal layer disposed on the fifth surface of the ceramic body and having an edge toward the second surface, the edge contacting the second conductive carbon layer.

11 . The multilayer ceramic capacitor of claim 10 , wherein the first conductive carbon layer and the second conductive carbon layer comprise one or more selected from graphite, graphene, carbon nanotube, fullerene, and carbon black.

12 . The multilayer ceramic capacitor of claim 10 , wherein:

the first external electrode further comprises a third plated layer covering the first conductive carbon layer and the first metal layer; and

the second external electrode further comprises a fourth plated layer covering the second conductive carbon layer and the second metal layer.

13 . The multilayer ceramic capacitor of claim 12 , wherein:

the first external electrode further comprises a third metal layer disposed on the sixth surface of the ceramic body and having an edge toward the first surface, the edge contacting the first conductive carbon layer; and

the second external electrode further comprises a fourth metal layer disposed on the sixth surface of the ceramic body and having an edge toward the second surface, the edge contacting the second conductive carbon layer.

14 . The multilayer ceramic capacitor of claim 13 , wherein:

the third metal layer is covered by the third plated layer; and

the fourth metal layer is covered by the fourth plated layer.

15 . The multilayer ceramic capacitor of claim 12 , wherein the third plated layer comprises:

a first layer covering the first conductive carbon layer;

a second layer covering the first layer; and

a third layer covering the second layer.

16 . The multilayer ceramic capacitor of claim 15 , wherein:

the first layer comprises copper (Cu);

the second layer comprises nickel (Ni); and

the third layer comprises tin (Sn).

17 . The multilayer ceramic capacitor of claim 12 , wherein the fourth plated layer comprises:

a first layer covering the second conductive carbon layer;

a second layer covering the first layer; and

a third layer covering the second layer.

18 . The multilayer ceramic capacitor of claim 17 , wherein:

the first layer comprises copper (Cu);

the second layer comprises nickel (Ni); and

the third layer comprises tin (Sn).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2023
From: HAN, SUNG; KIM, SUNGHOON; KIM, MI-GEUM; CHO, SANGIK; JANG, HOSEUNG; HONG, KIPYO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 065630/0528 →
Priority Claims (2)
KR 10-2023-0066101 · May 23, 2023 · national
KR 10-2023-0116184 · Sep 1, 2023 · national
Continuity (1)
Related Publication 20240395463A1 · Nov 28, 2024
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