Cooling of electronic components with an electrohydrodynamic flow unit
An arrangement for thermal management is disclosed, wherein a heat generating component is arranged within an enclosure, defined by an enclosure wall and in thermal contact with a thermal management fluid. The arrangement comprises an electrohydrodynamic flow unit, comprising a first and a second electrode, for controlling the flow of fluid within the enclosure.
1 . An arrangement for thermal management of a heat generating electronic component, the arrangement comprising:
the heat generating electronic component arranged within an enclosure and in thermal contact with a dielectric liquid;
a first electrohydrodynamic (EHD) flow unit arranged within the enclosure, wherein the first EHD flow unit comprises a first electrode and a second electrode arranged offset from the first electrode, and wherein the first EHD flow unit controls a flow of the dielectric liquid between the first electrode and the second electrode; and
an enclosure wall at least partly defining the enclosure, wherein the enclosure wall is directly attached to the heat generating electronic component, thereby defining the enclosure.
2 . The arrangement of claim 1 , further comprising a second EHD flow unit arranged within the enclosure, the second EHD flow unit comprising a first electrode and a second electrode arranged offset from the first electrode, wherein:
the first EHD flow unit directs the flow towards the heat generating electronic component; and
the second EHD flow unit directs the flow away from the heat generating electronic component.
3 . The arrangement of claim 2 , wherein:
the second electrodes of the first and second EHD flow units operate as collector electrodes and are arranged on the heat generating electronic component and an inside of the enclosure wall;
the first electrode of the first EHD flow unit forms an emitter electrode arranged closer to the collector electrode arranged on the heat generating electronic component than to the collector electrode arranged on the inside of the enclosure wall; and
the first electrode of the second EHD flow unit forms an emitter electrode arranged closer to the collector electrode arranged on the inside of the enclosure wall than to the collector electrode arranged on the heat generating electronic component.
4 . The arrangement of claim 1 , wherein at least one of the first and second electrodes is arranged on the heat generating electronic component.
5 . The arrangement of claim 4 , wherein the at least one of the first and second electrodes is formed by an electrically conductive layer provided on a surface of the heat generating component.
6 . The arrangement of claim 5 , wherein the at least one of the first and second electrodes is formed by a graphene layer provided on the heat generating electronic component.
7 . The arrangement of claim 4 , wherein at least one of the first and second electrodes is arranged on an inside of the enclosure wall.
8 . The arrangement of claim 1 , wherein at least one of the first and second electrodes is arranged on an inside of the enclosure wall.
9 . The arrangement of claim 1 , further comprising a heat exchanger in thermal contact with the enclosure wall.
10 . The arrangement of claim 9 , further comprising a thermal interface material (TIM) arranged between the heat exchanger and an outside of the enclosure wall.
11 . The arrangement of claim 10 , wherein the TIM comprises graphene.
12 . A method of thermal management of a heat generating electronic component, comprising:
placing the heat generating electronic component within an enclosure;
providing a dielectric liquid in thermal contact with the heat generating electronic component;
placing a first electrohydrodynamic (EHD) flow unit within the enclosure, wherein the first EHD flow unit comprises a first electrode and a second electrode arranged offset from the first electrode, and wherein the first EHD flow unit controls a flow of the dielectric liquid between the first electrode and the second electrode; and
providing an enclosure wall to at least partly define the enclosure, wherein the enclosure wall is attached to the heat generating electronic component, thereby defining the enclosure.
13 . The method of claim 12 , further comprising directing the dielectric liquid flow towards the heat generating electronic component with the first EHD flow unit and directing the dielectric liquid flow away from the heat generating electronic component with a second EHD flow unit.