Image sensor and method of fabricating the same
A method of fabricating an image sensor includes forming a semiconductor substrate of a first conductivity type, forming a pixel isolation trench in in the semiconductor substrate to define pixel regions, forming a liner insulating layer in the pixel isolation trench, doping the liner insulating layer with dopants of a first conductivity type, forming a semiconductor layer on the liner insulating layer to fill the pixel isolation trench after the doping of the dopants, and performing a thermal treatment process on the semiconductor substrate.
1 . A method of fabricating an image sensor, comprising:
forming a semiconductor substrate of a first conductivity type;
forming an isolation trench defining pixel regions in the semiconductor substrate;
forming a liner insulating layer in the isolation trench;
doping the liner insulating layer with dopants of the first conductivity type;
forming a semiconductor layer on the liner insulating layer to fill the isolation trench, after the doping of the dopants in the liner insulating layer; and
performing a thermal treatment process on the semiconductor substrate, after forming the semiconductor layer on the liner insulating layer,
wherein, after the thermal treatment process, the semiconductor layer is doped with the same dopants as the dopants doped in the liner insulating layer.
2 . The method of claim 1 , wherein, after the thermal treatment process, a concentration of the dopants in the liner insulating layer is higher than a concentration of the dopants in the semiconductor layer.
3 . The method of claim 1 , further comprising, etching the semiconductor layer such that a top surface of the semiconductor layer is located at a level lower than a top surface of the semiconductor substrate, before the thermal treatment process.
4 . The method of claim 1 , wherein the doping of the dopants comprises performing a plasma doping process, a beam line ion implantation process, or a gas phase doping process.
5 . The method of claim 1 , wherein, after the thermal treatment process, a concentration of the dopants of the first conductivity type in the semiconductor layer is about 8 to 9 times a concentration of the dopants of the first conductivity type in the semiconductor substrate.
6 . The method of claim 1 , wherein the isolation trench has an aspect ratio of about 10:1 to 15:1.
7 . The method of claim 1 , wherein the semiconductor layer is composed of a single poly-silicon layer.
8 . A method of fabricating an image sensor, comprising:
preparing a semiconductor substrate of a first conductivity type, the semiconductor substrate having a first surface and a second surface opposite to the first surface;
forming a device isolation layer near the first surface of the semiconductor substrate;
forming an isolation structure to penetrate the device isolation layer and the semiconductor substrate and to define a plurality of pixel regions;
forming photoelectric conversion regions of a second conductivity type, in the semiconductor substrate and in the pixel regions, respectively; and
forming a pixel gate electrode and a transfer gate electrode on the first surface of the semiconductor substrate, in each of the pixel regions,
wherein the forming of the isolation structure comprises:
patterning the device isolation layer and the semiconductor substrate to form an isolation trench;
depositing a liner insulating layer on a surface of the isolation trench;
doping the liner insulating layer with dopants of the first conductivity type;
forming an undoped poly-silicon layer to fill the isolation trench, after the forming of the liner insulating layer doped with the dopants;
etching the undoped poly-silicon layer to form a polysilicon pattern having a top surface located at a level lower than the first surface of the semiconductor substrate; and
performing a thermal treatment process on the semiconductor substrate, after forming the polysilicon pattern on the liner insulating layer doped with the dopants,
wherein, after the thermal treatment process, the polysilicon pattern is doped with the same dopants as the dopants doped in the liner insulating layer.
9 . The method of claim 8 , wherein a concentration of the dopants in the liner insulating layer is higher than a concentration of the dopants in the polysilicon pattern, after the thermal treatment process.
10 . The method of claim 8 , wherein a concentration of the dopants of the first conductivity type in the polysilicon pattern is about 8 to 9 times that in the semiconductor substrate, after the thermal treatment process.
11 . The method of claim 8 , wherein the forming of the isolation structure further comprises forming a gapfill insulating pattern on the polysilicon pattern, after the thermal treatment process, and
a top surface of the gapfill insulating pattern is coplanar with a top surface of the device isolation layer.
12 . The method of claim 8 , further comprising forming a planarization insulating layer on the second surface of the semiconductor substrate,
wherein the planarization insulating layer is in contact with a bottom surface of the liner insulating layer and a bottom surface of the polysilicon pattern.
13 . The method of claim 12 , further comprising:
forming color filters on the planarization insulating layer to correspond to the pixel regions; and
forming micro lenses on the color filters.
14 . The method of claim 8 , further comprising forming a back-side contact plug coupled to a portion of the polysilicon pattern.
15 . The method of claim 8 , wherein the isolation trench comprises a plurality of first regions extending in a first direction, and a plurality of second regions extending in a second direction crossing the first direction and crossing the first regions, and
the polysilicon pattern continuously extends in both the first and the second directions.
16 . An image sensor, comprising:
a semiconductor substrate of a first conductivity type;
an isolation structure located in the semiconductor substrate to define a plurality of pixel regions, the isolation structure comprising a semiconductor pattern vertically penetrating the semiconductor substrate and a liner insulating pattern interposed between the semiconductor pattern and the semiconductor substrate; and
a back-side contact plug coupled to a portion of the semiconductor pattern,
wherein the semiconductor pattern and the liner insulating pattern comprise dopants of the first conductivity type, and
wherein a concentration of the dopants of the first conductivity type is higher in the liner insulating pattern than in the semiconductor pattern.
17 . The image sensor of claim 16 , wherein the semiconductor pattern is composed of a single poly-silicon layer.
18 . The image sensor of claim 16 , wherein the concentration of the dopants of the first conductivity type in the semiconductor pattern is about 8 to 9 times that in the semiconductor substrate.
19 . The image sensor of claim 16 , wherein the semiconductor substrate has a first surface and a second surface opposite the first surface, and
the concentration of the dopants in the semiconductor pattern decreases in a direction from the first surface of the semiconductor substrate toward the second surface.
20 . The image sensor of claim 16 , wherein the isolation structure further comprises a gapfill insulating pattern disposed on the semiconductor pattern and having a top surface located at the same level as the first surface of the semiconductor substrate.