Electronic device
An electronic device including an electronic unit and a functional unit is provided. The electronic unit includes a substrate, a plurality of semiconductor components, and a cover layer. The substrate has a plurality of first side surfaces. The semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least one of the first side surfaces and at least one of the second side surfaces.
1 . An electronic device, comprising:
an electronic unit, comprising:
a substrate, having a plurality of first side surfaces;
a plurality of semiconductor components, disposed on the substrate; and
a cover layer, disposed on the semiconductor components and having an upper surface, a lower surface, and a plurality of second side surfaces; and
a functional unit, disposed on at least one of at least one of the first side surfaces and at least one of the second side surfaces, wherein a thickness of the functional unit close to the upper surface is less than the thickness of the functional layer close to the lower surface.
2 . The electronic device according to claim 1 , wherein the functional unit comprises an anti-static layer.
3 . The electronic device according to claim 1 , wherein the functional unit comprises a light modulation layer.
4 . The electronic device according to claim 1 , wherein the functional unit comprises an anti-static layer and a light modulation layer.
5 . The electronic device according to claim 4 , wherein the anti-static layer is disposed between the electronic unit and the light modulation layer.
6 . The electronic device according to claim 4 , wherein the light modulation layer is disposed between the electronic unit and the and the anti-static layer.
7 . The electronic device according to claim 1 , wherein the functional unit is in contact with the at least one of the at least one of the first side surfaces and the at least one of the second side surfaces.
8 . The electronic device according to claim 1 , wherein the functional unit comprises a light modulation component disposed between the substrate and the cover layer and located on the at least one of the second side surfaces.
9 . The electronic device according to claim 1 , further comprising a back plate disposed below the electronic unit and having a sectional difference.
10 . The electronic device according to claim 9 , wherein the back plate has a first surface, a second surface, and a side surface between the first surface and the second surface to form the sectional difference, and the side surface and at least one portion of the functional unit are overlapped in a thickness direction of the back plate.
11 . The electronic device according to claim 1 , wherein a cross-sectional structure of the first side surfaces of the substrate has a right angle, a C-shaped chamfer, an R angle, an arc-shaped profile, a regular shape, or an irregular shape.
12 . An electronic device, comprising:
an electronic unit, comprising:
a substrate, having a plurality of first side surfaces;
a plurality of semiconductor components, disposed on the substrate; and
a cover layer, disposed on the semiconductor components and having a plurality of second side surfaces, wherein at least one of the second side surfaces has a chamfer structure.
13 . The electronic device according to claim 12 , wherein the first side surfaces have an extension direction, and the chamfer structure has a third side surface not parallel to the extension direction, wherein an angle between the extension direction and the third side surface is defined, and the angle ranges from 1 degree to 60 degrees.
14 . The electronic device according to claim 12 , wherein the chamfer structure is a negative chamfer structure.
15 . The electronic device according to claim 12 , wherein the chamfer structure is a positive chamfer structure.
16 . The electronic device according to claim 12 , wherein the first side surfaces have an extension direction, the chamfer structure has a third side surface not parallel to the extension direction and a fourth side surface parallel to the extension direction, and an area of the third side surface is greater than about 10% of a sum of the area of the third side surface and an area of the fourth side surface.
17 . The electronic device according to claim 12 , further comprising a functional unit disposed on at least one of at least one of the first side surfaces and the at least one of the second side surfaces.
18 . The electronic device according to claim 12 , wherein a cross-sectional structure of the first side surfaces of the substrate has a right angle, a C-shaped chamfer, an R angle, an arc-shaped profile, a regular shape, or an irregular shape.
19 . The electronic device according to claim 12 , further comprising a back plate disposed below the electronic unit and having a sectional difference.