IP Library Granted Patent US 12,488,933
Granted Patent B2
US 12,488,933 · App. 17/522,925 · Granted Dec 2, 2025

Wireless charger having thermoelectric cooler chips for dissipating heat

Inventors: Tsung-Chan Wu (Hsinchu County, TW); Yen-Ming Liu (Changhua County, TW); Chien-Hui Chen (Taoyuan, TW)
Assignee: CYNTEC CO., LTD.
H01F27/2823H01F27/24H01F27/32H01F41/04H01Q7/06H01Q7/08H02J7/0044H02J50/10H02J50/70H05K7/20145H10N10/00
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Quick Facts
Patent No.
US 12,488,933
App. No.
17/522,925
Granted
Dec 2, 2025
Kind
B2
Abstract

A wireless charger comprises atop cover; a metallic case; and a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device.

Claims (16)

1 . A wireless charger, comprising:

a top cover, comprising an insulating and heat-conducting material;

a metallic case, wherein at least one conductive element is disposed therein;

a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a first heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device; and

a second thermoelectric cooler chip, disposed between the bottom surface of the top cover and the top surface of the metallic case to form a second heat conductive path from the top cover to the metallic case via the second thermoelectric cooler chip for dissipating heat generated by the electronic device disposed on the top cover for wireless charging the electronic device.

2 . The wireless charger of claim 1 , wherein a first recess is formed in the metallic case, wherein the at least one conductive element is disposed in the first recess.

3 . The wireless charger of claim 2 , wherein the at least one conductive element comprises a plurality of coils disposed in the first recess, wherein the plurality of coils are stacked into a plurality of layers for charging the electronic device.

4 . The wireless charger of claim 2 , wherein the metallic case comprises a metallic plate, wherein the first recess is formed at the upper side of the metallic plate of the metallic case, wherein a second recess is formed at the lower side of the metallic plate of the metallic case, wherein a circuit board is disposed in the second recess of the metallic case.

5 . The wireless charger of claim 4 , wherein the metallic plate comprises Al—Si—Cu alloy.

6 . The wireless charger of claim 1 , wherein the metallic case has a through-opening, wherein a fan is disposed in the through-opening.

7 . The wireless charger of claim 1 , wherein the at least one conductive element comprises a coil, wherein an EMI filter comprising a metal is disposed between the top cover and the coil, wherein the first thermoelectric cooler chip is disposed between a bottom surface of the EMI filter and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the EMI filter for dissipating heat generated by the electronic device.

8 . The wireless charger of claim 7 , wherein a shielding layer is disposed under the coil.

9 . The wireless charger of claim 1 , wherein the metallic case comprises Al.

10 . The wireless charger of claim 1 , wherein an air deflector is disposed at a lateral side of the metallic case.

11 . The wireless charger of claim 1 , wherein the at least one conductive element comprises a plurality of coils, wherein a magnetic material encapsulates the plurality of coils, wherein the plurality of coils are in contact with the magnetic material.

12 . The wireless charger of claim 1 , wherein the at least one conductive element comprises a coil, wherein the first thermoelectric cooler chip and the second thermoelectric cooler chip are located at two opposite sides of the coil.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2022
From: WU, TSUNG-CHAN; LIU, YEN-MING; CHEN, CHIEN-HUI
To: CYNTEC CO., LTD.
Reel/Frame 059071/0119 →
Continuity (2)
Provisional Application 63113815 · Nov 13, 2020
Related Publication 20220158491A1 · May 19, 2022
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