Auto-calibration to a station of a process module that spins a wafer
A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.
1 . A method for calibration, comprising:
picking up a process wafer from an inbound load lock using a transfer module (TM) robot;
applying a condition correction to the process wafer using the TM robot, wherein the condition correction corrects for a condition induced offset of a rotation axis of a rotation device located within a process module when the process module is under a condition, wherein the rotation axis is referenced to an initial calibrated location of a center of a pedestal located within the process module, wherein the initial calibrated location is defined for a reference coordinate system when no condition is applied to the process module; and
transferring the process wafer to the pedestal using the TM robot for processing.
2 . The method of claim 1 , further comprising:
determining an entry offset of a calibration wafer when transferring the calibration wafer to the pedestal within the reference coordinate system when the process module is under the condition, wherein the entry offset is based on the initial calibrated location of the center of the pedestal;
rotating the calibration wafer within the process module using the rotation device;
determining an exit offset of the calibration wafer within the reference coordinate system based on the initial calibrated location; and
determining the conditioned induced offset of the rotation axis using the entry offset and the exit offset.
3 . The method of claim 2 , further comprising:
determining a difference vector between the entry offset and the exit offset; and
halving a magnitude of the difference vector to determine the condition induced offset of the rotation axis of the rotation device.
4 . The method of claim 1 ,
wherein the condition includes at least one of a temperature level or a vacuum level.
5 . The method of claim 2 , further comprising:
teaching the TM robot to the initial calibrated location by placing the calibration wafer centered to the pedestal when the no condition is applied to the process module, wherein the center of the pedestal under the no condition is aligned with the initial calibrated location of the pedestal;
removing the calibration wafer using the TM robot; and
defining a calibrated reference measurement of the calibration wafer using a measurement device that is fixed within the reference coordinate system, the calibrated reference measurement being aligned with the initial calibrated location,
wherein each of the entry offset and the exit offset is measured from the calibrated reference measurement using the measurement device.
6 . The method of claim 5 ,
wherein the calibrated reference measurement, the entry offset, and the exit offset are located outside of the process module.
7 . The method of claim 5 , further comprising:
establishing the reference coordinate system based on the initial calibrated location of the pedestal within the process module;
establishing the calibrated reference measurement of the calibration wafer within the reference coordinate system using the measurement device fixed within the reference coordinate system when transferring the calibration wafer from the process module from the initial calibrated location using the TM robot, the calibration wafer placed to be centered about the pedestal such that the calibrated reference measurement is aligned with the initial calibrated location of the center of the pedestal.
8 . The method of claim 1 ,
wherein the rotation axis is aligned with the initial calibrated location.
9 . The method of claim 8 ,
wherein the rotation axis is fixedly offset from the initial calibrated location.
10 . The method of claim 1 ,
wherein the rotation device is an end-effector.
11 . The method of claim 1 ,
wherein the rotation device is a lift pad configured to separate from the pedestal.
12 . The method of claim 5 , further comprising:
determining an alignment measurement of the process wafer within the reference coordinate system when transferring the process wafer to the process module;
determining an alignment correction of the process wafer corresponding to an offset of the process wafer from the calibrated reference measurement based on the alignment measurement; and
applying the alignment correction using the TM robot to align the process wafer to the initial calibrated location.
13 . A system for processing, comprising:
a process module including a rotation device having a rotation axis, wherein the rotation axis is referenced to an initial calibrated location of a center of a pedestal located within the process module, wherein the initial calibrated location is identified using a reference coordinate system;
the pedestal within the process module; and
a transfer module (TM) robot configured for picking up a process wafer from an inbound load lock and transferring the process wafer to the pedestal for processing,
wherein the TM robot is configured for transferring the process wafer to and from the process module,
wherein the TM robot is configured to apply a condition correction to the process wafer,
wherein the condition correction corrects for a condition induced offset of the rotation axis of the rotation device when the process module is under a condition,
wherein the rotation axis is referenced to the initial calibrated location of the center of the pedestal located within the process module,
wherein the initial calibrated location is defined for the reference coordinate system when no condition is applied to the process module.
14 . The system of claim 13 , further comprising:
a measurement system fixed within the reference coordinate system,
wherein the measurement system is configured to determine an entry offset of a calibration wafer when transferring the calibration wafer to the pedestal within the reference coordinate system when the process module is under the condition, wherein the entry offset is based on the initial calibrated location of the center of the pedestal,
wherein the measurement system is configured to determine an exit offset of the calibration wafer within the reference coordinate system based on the initial calibrated location, wherein the exit offset is determined when transferring the calibration wafer from the process module and after the calibration wafer has been rotated by the rotation device when the process module is under the condition,
wherein the measurement system is configured to determine the conditioned induced offset of the rotation axis using the entry offset and the exit offset.
15 . The system of claim 14 ,
wherein the measurement system is configured to determine a difference vector between the entry offset and the exit offset,
wherein the condition induced offset of the rotation axis of the rotation device is determined by halving a magnitude of the difference vector.
16 . The system of claim 13 ,
wherein the condition includes at least one of a temperature level or a vacuum level.
17 . The system of claim 13 ,
wherein the rotation device is an end-effector.
18 . The system of claim 13 ,
wherein the rotation device is a lift pad configured to separate from the pedestal.
19 . The system of claim 13 ,
wherein the rotation axis is aligned with the initial calibrated location.
20 . The system of claim 14 ,
wherein the measurement system is configured for determining an alignment offset of an incoming wafer based on the initial calibrated location of the center of the pedestal,
wherein the TM robot is configured for applying an alignment correction based on the alignment offset.