Adhesive dispensing systems and methods
Apparatus, systems ( 400 ), and methods for predicting a parameter of dispenser system, dispensing a dispensable material, calibrating a dispenser system are described. Apparatus and systems can use machine learning algorithms based on environmental variables and other factors in a system where the adhesive dispenser ( 100 ) is used. Furthermore, apparatus and systems can adjust an operational parameter of the dispenser system based on at least one process parameter. Still further, apparatus and systems can provide one or more settings for one or more dispenser components based on a calibration model. Algorithms ( 412 ) can operate on remote or local software and control systems, or as part of an edge computing system or Internet of Things (IoT) system.
1 . A dispenser system comprising:
one or more dispenser components comprising one or more sensors for providing at least one process parameter of a dispensable material, the one or more sensors comprising
(i) a temperature sensor comprising a probe arranged in a fluid path of the dispensable material and configured to sense a temperature of the dispensable material; and
(ii) a conductivity sensor configured to sense a conductivity of the dispensable material;
a processor operatively coupled to the one or more dispenser components, the processor configured to:
receive at least one parameter associated with the dispenser system;
determine a value for an operational parameter of the dispenser system, based on the at least one parameter, that will achieve a flow rate of a dispensable material in the dispenser system;
provide the operational parameter;
receive the temperature of the dispensable material from the temperature sensor;
receive a sensed conductivity of the dispensable material from the conductivity sensor;
determine a state of cure of the dispensable material based on the sensed temperature of the dispensable material and the sensed conductivity of the dispensable material
adjust the value for the operational parameter of the dispenser system based on the sensed temperature and state of cure; and
provide the adjusted operational parameter.
2 . The dispenser system of claim 1 , wherein the operational parameter is driving force pressure of the dispenser system.
3 . The dispenser system of claim 1 , wherein either: (i) the probe is configured to directly contact the dispensable material in the fluid path; or (ii) the temperature sensor further comprises a shield to separate an outer surface of the probe from the dispensable material and the probe is configured to sense the temperature of the dispensable material through the shield.
4 . The dispenser system of claim 1 , wherein the temperature sensor comprises the conductivity sensor and wherein the temperature sensor is further configured to apply a voltage to the dispensable material in the fluid path of the dispensable material.
5 . The dispenser system of claim 1 , wherein the at least one parameter of the dispenser system comprises a density of the dispensable material:
the one or more sensors further comprises a mass measurement device configured to sense mass data of the dispensable material;
the at least one process parameter comprises the mass data; and
the processor is further configured to determine a volumetric flow of the dispensable material based on the density of the dispensable material and the mass data of the dispensable material.
6 . The dispenser system of claim 1 , wherein the processor is further configured to:
determine a maximum idle time or a purge time for the one or more dispenser components based on the at least one parameter and the at least one process parameter; and
provide the maximum idle time or the purge time.
7 . The dispenser system of claim 6 , wherein the one or more sensors are further configured to provide at least one environmental parameter and the processor is further configured to determine the maximum idle time or the purge time based on the at least one environmental parameter, the at least one parameter, and the at least one process parameter.
8 . The dispenser system of claim 6 , further comprising a user interface operatively coupled to the processor and wherein the processor is further configured to:
receive one or more user inputs comprising one or more of a safety factor, a process control factor, and a waste factor; and
determine the maximum idle time or the purge time based on the one or more user inputs, the at least one parameter, and the at least one process parameter.
9 . The dispenser system of claim 1 , wherein the processor is configured to provide the operational parameter and the adjusted operational parameter to the one or more dispenser components.
10 . The dispenser system of claim 1 , wherein the dispensable material comprises an adhesive.
11 . A method of dispensing a dispensable material using a dispenser system, the method comprising:
receiving at least one parameter associated with the dispenser system;
determining a value for an operational parameter of the dispenser system, based on the at least one parameter, that will achieve a flow rate of the dispensable material in the dispenser system;
providing the operational parameter;
receiving at least one process parameter comprising a sensed temperature of the dispensable material;
receiving a sensed conductivity of the dispensable material from a conductivity sensor;
determining a state of cure of the dispensable material based on the sensed temperature of the dispensable material and the sensed conductivity of the dispensable material; and
adjusting the value for the operational parameter of the dispenser system based on the sensed temperature and the state of cure; and
providing the adjusted operational parameter.
12 . The method of claim 11 , wherein the operational parameter is a driving force pressure of the dispenser system.
13 . The method of claim 11 , wherein the at least one parameter of the dispenser system comprises a density of the dispensable material, and wherein the at least one process parameter further comprises mass data of the dispensable material and wherein the method further comprises determining a volumetric flow of the dispensable material based on the density of the dispensable material and the mass data of the dispensable material.
14 . The method of claim 11 , further comprising:
determining a maximum idle time or a purge time for one or more dispenser components of the dispenser system based on the at least one parameter and the at least one process parameter; and
providing the maximum idle time or the purge time.
15 . The method of claim 14 , further comprising:
receiving at least one environmental parameter provided by one or more sensors; and
determining the maximum idle time or the purge time based on the at least one environmental parameter, the at least one parameter, and the at least one process parameter.
16 . The method of claim 14 , further comprising:
receiving one or more user inputs comprising one or more of a safety factor, a process control factor, and a waste factor; and
determining the maximum idle time or the purge time based on the one or more user inputs, the at least one parameter, and the at least one process parameter.
17 . The method of claim 11 , further comprising providing the operational parameter and the adjusted operational parameter to one or more dispenser components of the dispenser system.
18 . The method of claim 11 , wherein the dispensable material comprises adhesive.