PVD apparatus and method
A Physical Vapour Deposition (PVD) apparatus having a PVD chamber, a target, a substrate support in the PVD chamber comprising an upper rotatable portion having an upper surface on which a substrate can be supported and a lower stationary portion, an RF source configured to supply an RF signal having an RF power to the lower stationary portion, and an arrangement for rotating the upper rotatable portion during a PVD process performed in the PVD chamber. The upper rotatable portion and the lower stationary portion are spaced apart so that the RF power supplied to the lower stationary portion is capacitively coupled to the upper rotatable portion.
1 . A Physical Vapour Deposition (PVD) apparatus comprising:
a PVD chamber;
a target;
a substrate support in the PVD chamber comprising an upper rotatable portion having an upper surface on which a substrate can be supported and a lower stationary portion;
an RF source configured to supply an RF signal having an RF power to the lower stationary portion; and
an arrangement for rotating the upper rotatable portion during a PVD process performed in the PVD chamber;
wherein the upper rotatable portion and the lower stationary portion are spaced apart so that the RF power supplied to the lower stationary portion is capacitively coupled to the upper rotatable portion.
2 . The PVD apparatus according to claim 1 , wherein the upper rotatable portion and the lower stationary portion are spaced apart with a gap of less than 3 mm.
3 . The PVD apparatus according to claim 2 , wherein the upper rotatable portion and the lower stationary portion are spaced apart with a gap in a range from 0.5 to 1.5 mm.
4 . The PVD apparatus according to claim 1 , wherein the upper rotatable portion is positioned on a plurality of non-conductive bearings, the plurality of non-conductive bearings also being in contact with the lower stationary portion.
5 . The PVD apparatus according to claim 1 , wherein the arrangement for rotating the upper rotatable portion comprises a source of rotational motion coupled to a rotatable shaft, the rotatable shaft being in driving connection with the upper rotatable portion.
6 . The PVD apparatus according to claim 5 , wherein the lower stationary portion of the substrate support comprises a platform portion which is spaced from the upper rotatable portion.
7 . The PVD apparatus according to claim 6 , wherein the platform portion is supported by a support stem.
8 . The PVD apparatus according to claim 7 , wherein the rotatable shaft extends through the support stem.
9 . The PVD apparatus according to claim 1 , wherein the lower stationary portion is electrically isolated from the PVD chamber by a dielectric break structure.
10 . The PVD apparatus according to claim 7 , further comprising an upper sheath which surrounds a periphery of the upper rotatable portion of the substrate support.
11 . The PVD apparatus according to claim 10 , wherein the upper sheath is in contact with the upper rotatable portion.
12 . The PVD apparatus according to claim 10 , wherein the upper sheath comprises an upper surface which is co-planar with the upper surface of the upper rotatable portion so that the substrate can be supported by both the upper rotatable portion and the upper sheath.
13 . The PVD apparatus according to claim 10 , further comprising a lower sheath which surrounds a periphery of the lower stationary portion of the substrate support and is spaced therefrom.
14 . The PVD apparatus according to claim 13 , wherein the lower sheath surrounds a periphery of the platform portion and the support stem.
15 . The PVD apparatus according to claim 13 , wherein the lower sheath is in electrical connection with the PVD chamber.
16 . The PVD apparatus according to claim 13 , wherein the upper sheath and the lower sheath are spaced apart by a dark space gap.
17 . The PVD apparatus according to claim 6 , wherein the lower stationary portion of the substrate support comprises one or both of resistive heater elements and fluid cooling conduits.
18 . The PVD apparatus according to claim 17 , wherein the platform portion houses the resistive heater elements and the fluid cooling conduits.
19 . A method of performing PVD comprising:
placing a substrate on a substrate support in a PVD chamber, the substrate support comprising an upper rotatable portion having an upper surface on which the substrate can be supported and a lower stationary portion;
supplying an RF signal having an RF power to the lower stationary portion; and
performing a PVD process to deposit a material on to the substrate by sputtering a target while the upper rotatable portion is rotated and the lower stationary portion is stationary, wherein the RF power supplied to the lower stationary portion is capacitively coupled to the upper rotatable portion.
20 . The method according to claim 19 , wherein the upper rotatable portion is rotated at a speed in a range from 1 to 10 rpm.
21 . The method according to claim 19 , wherein the target overlays and extends radially beyond the substrate.
22 . The method according to claim 19 , wherein a temperature of the upper rotatable portion is controlled by controlling a temperature of the lower stationary portion.