Device for thermal regulation of at least one electronic component
The invention relates to a device for thermal regulation of at least one electronic component, including at least two circulation conduits of a heat transfer fluid, arranged along a stacking axis, and at least one heat transfer fluid manifold in fluidic communication with the circulation conduits. The heat transfer fluid manifold includes at least two fluidic connection portions, respectively assembled at one end of a corresponding circulation conduit and having, respectively, at least one collar bordering an orifice, and at least one hollow connector interposed between two fluidic connection portions along the stacking axis, and having two opposite end sections, slidably mounted inside the collars of two facing fluidic connection portions.
1 . A device for thermally regulating at least one electronic component, said device comprising:
at least two circulation ducts for a heat transfer fluid which are arranged along a stacking axis; and
at least two heat transfer fluid manifolds in fluidic communication with the at least two circulation ducts and attached at opposite ends of the at least two circulation ducts to provide “I”-shaped fluid circulation between the at least two heat transfer fluid manifolds,
wherein each of said at least two heat transfer fluid manifolds has;
at least two fluidic connection portions respectively assembled at one end of a corresponding circulation duct and respectively having at least one collar bordering an orifice, and
at least one hollow connector interposed between the at least two fluidic connection portions along the stacking axis, and having two opposite end sections mounted so as to be able to slide inside the collars of the at least two facing fluidic connection portions.
2 . The device as claimed in claim 1 , wherein each hollow connector has a cylindrical overall shape, with a central portion having a first external diameter and the end sections having a second external diameter greater than the first external diameter.
3 . The device as claimed in claim 2 , wherein the second external diameter of the end sections is equal to or greater than an internal diameter of each collar.
4 . The device as claimed in claim 1 , wherein said at least one collar of one fluidic connection portion of the at least two fluidic connection portions extends toward a neighboring fluidic connection portion of the at least two fluidic connection portions along the stacking axis.
5 . The device as claimed in claim 1 , having a predefined number of half-shells assembled in pairs at the opposite ends of the associated at least two circulation ducts, so as to define the at least two fluidic connection portions of each of said at least two heat transfer fluid manifolds, and wherein said at least one hollow connector is arranged between two pairs of half-shells.
6 . The device as claimed in claim 1 , wherein the at least two fluidic connection portions are made from a first material and each hollow connector includes at least one second, compressible material, the first material having a greater stiffness than said at least one second material.
7 . The device as claimed in claim 1 , wherein each hollow connector is arranged centrally with respect to the ends of the at least two circulation ducts.
8 . The device as claimed in claim 1 , wherein each hollow connector is arranged eccentrically with respect to the ends of the at least two circulation ducts.
9 . The device as claimed in claim 1 , wherein each hollow connector is made by overmolding an insert.
10 . The device as claimed in claim 1 , wherein each of said at least two heat transfer fluid manifolds has at least one end stop for said at least one electronic component along an axis transverse to the stacking axis.