Liquid-cooling heat dissipation device, cabinet, and system
A liquid-cooling heat dissipation device includes a pipeline outlet formed on an exterior sidewall of a chassis, wherein the exterior sidewall is an exterior wall of side panel in contact with a chassis panel and an IO port panel of the chassis, a circuit board fixed on an inner bottom surface of the chassis, an evaporator fixed on the circuit board with a preset gap, forming an accommodating space with the circuit board, a heat-generating electronic component mounted on the circuit board within the accommodating space, electrically connected to the circuit board and thermally connected to the evaporator, a condenser fixed to the exterior sidewall where the pipeline outlet is located, and a vapor pipeline and a liquid pipeline pass through the pipeline outlet, connecting the evaporator and the condenser.
1 . A liquid-cooling heat dissipation cabinet comprising:
two front pillars near a front door of the liquid-cooling heat dissipation cabinet;
two rear pillars near a rear door of the liquid-cooling heat dissipation cabinet;
a chassis tray for placing a liquid-cooling heat dissipation device; and
a liquid cooling mechanism used in conjunction with a condenser fixed on an exterior sidewall of the liquid-cooling heat dissipation device,
wherein the chassis tray is fixed within an area enclosed by the two front pillars and the two rear pillars, and is secured through the two front pillars and the two rear pillars;
the liquid cooling mechanism is fixed above the chassis tray, on one of the rear pillars on the same side as the condenser;
the liquid-cooling heat dissipation device comprises: a chassis, a circuit board, an evaporator, a heat-generating electronic component, a condenser, a vapor pipeline, and a liquid pipeline;
an exterior sidewall of the chassis is equipped with a pipeline outlet, and the exterior sidewall is an exterior wall of a side panel in contact with a chassis panel and an IO port panel of the chassis;
the circuit board is fixed on an inner bottom surface of the chassis;
the evaporator is fixed on the circuit board with a preset gap, forming an accommodating space with the circuit board;
the heat-generating electronic component is mounted on the circuit board within the accommodating space, electrically connected to the circuit board and thermally connected to the evaporator;
the condenser is fixed on the exterior sidewall where the pipeline outlet is located;
the vapor pipeline and the liquid pipeline pass through the pipeline outlet, connecting the evaporator with the condenser; and
when the heat-generating electronic component is operating, liquid inside the evaporator absorbs heat emitted by the heat-generating electronic component and vaporizes into vapor, enters the condenser along the vapor pipeline under the internal vapor pressure, and returns to the evaporator along the liquid pipeline after being cooled into liquid by the condenser;
the liquid cooling mechanism comprises: a cold plate, an elastic member, an inlet pipeline, an outlet pipeline, a cold plate slide structure, an inlet manifold, and an outlet manifold; wherein
the cold plate slide structure is fixed on one of the rear pillars;
one end of the elastic member is fixed on one of the rear pillars, and is located between corresponding areas of the cold plate slide structure;
the cold plate is fixed to an other end of the elastic member and is slidably mounted inside the cold plate slide structure, connecting to the inlet manifold through the inlet pipeline, and connecting to the outlet manifold through the outlet pipeline;
wherein, when the cold plate is not in contact with a heat-conductive pad provided on the condenser, the elastic member is in a naturally extended state; when the cold plate is in contact with the heat-conductive pad provided on the condenser, the elastic member is in a compressed state, enabling the cold plate to make conductive heat transfer with the condenser through the heat-conductive pad, and assist in dissipating heat from the heat-generating electronic component inside the liquid-cooling heat dissipation device through the condenser and the evaporator within the liquid-cooling heat dissipation device.
2 . The liquid-cooling heat dissipation cabinet according to claim 1 , wherein, the cold plate slide structure comprises a first slide and a second slide; and the elastic member comprises a first fixation part and a second fixation part; wherein
the first slide and the second slide are fixed to the two rear pillars at a predetermined distance, and the predetermined distance is slightly greater than the thickness of the cold plate;
the cold plate is slidably installed within a second accommodating space formed by the first slide and the second slide; and
the first fixation part is fixed to a surface of the cold plate facing one of the rear pillars, and the second fixation part is fixed to a surface of one of the rear pillars facing the cold plate.
3 . The liquid-cooling heat dissipation cabinet according to claim 1 , wherein, the vapor pipeline of the condenser is arranged opposite to a cold water inlet of the cold plate connected to a manifold, and the liquid pipeline of the condenser is arranged opposite to a hot water outlet of the cold plate connected to the manifold.
4 . The liquid-cooling heat dissipation cabinet according to claim 1 , wherein, the liquid cooling heat dissipation cabinet further comprises: a chassis fixation member, wherein
the chassis fixation member is used to fix the liquid-cooling heat dissipation device placed on the chassis tray to the two front pillars, ensuring that the elastic member remains in a compressed state.
5 . The liquid-cooling heat dissipation cabinet according to claim 1 , wherein the condenser comprises a base plate, a casing, a plurality of condenser fins, a vapor inlet and a liquid outlet,
wherein the casing and the base plate form a sealed chamber;
the plurality of condenser fins are arranged side by side at intervals and fixed to the base plate within the sealed chamber;
the vapor inlet, which connects to the vapor pipeline, is located at one end of a sidewall of the casing, parallel to the plurality of condenser fins; and
the liquid outlet, which connects to the liquid pipeline, is located at an opposite end of the sidewall of the casing, parallel to the plurality of condenser fins.
6 . The liquid-cooling heat dissipation cabinet according to claim 1 , wherein, the number of the condenser is even, and
the pipeline outlet is formed on two opposite exterior sidewalls of the chassis, and the condensers are symmetrically fixed on the exterior sidewalls where the pipeline outlets are located.
7 . The liquid-cooling heat dissipation cabinet according to claim 1 , wherein, the liquid-cooling heat dissipation device further comprises a heat-conductive pad, and
the heat-conductive pad is placed on a side of the condenser to be in contact with the cold plate in the liquid-cooling heat dissipation cabinet.
8 . A liquid-cooling heat dissipation system, comprising: a liquid-cooling heat-dissipation device, and a liquid-cooling heat dissipation cabinet,
wherein the liquid-cooling heat dissipation device comprises: a chassis, a circuit board, an evaporator, a heat-generating electronic component, a condenser, a vapor pipeline, and a liquid pipeline;
an exterior sidewall of the chassis is equipped with a pipeline outlet, and the exterior sidewall is an exterior wall of a side panel in contact with a chassis panel and an IO port panel of the chassis;
the circuit board is fixed on an inner bottom surface of the chassis;
the evaporator is fixed on the circuit board with a preset gap, forming an accommodating space with the circuit board;
the heat-generating electronic component is mounted on the circuit board within the accommodating space, electrically connected to the circuit board and thermally connected to the evaporator;
the condenser is fixed on the exterior sidewall where the pipeline outlet is located;
the vapor pipeline and the liquid pipeline pass through the pipeline outlet, connecting the evaporator with the condenser;
when the heat-generating electronic component is operating, liquid inside the evaporator absorbs heat emitted by the heat-generating electronic component and vaporizes into vapor, enters the condenser along the vapor pipeline under the internal vapor pressure, and returns to the evaporator along the liquid pipeline after being cooled into liquid by the condenser;
the liquid-cooling heat dissipation cabinet comprises: two front pillars near a front door of the liquid-cooling heat dissipation cabinet, two rear pillars near a rear door of the liquid-cooling heat dissipation cabinet, a chassis tray for placing the liquid-cooling heat dissipation device, and a liquid cooling mechanism used in conjunction with the condenser fixed on the exterior sidewall of the liquid-cooling heat dissipation device;
the chassis tray is fixed within an area enclosed by the two front pillars and the two rear pillars, and is secured through the two front pillars and the two rear pillars;
the liquid cooling mechanism is fixed above the chassis tray, on one of the rear pillars on the same side as the condenser; and
the liquid-cooling heat dissipation device is placed on the chassis tray in the liquid-cooling heat dissipation cabinet, and when being mounted along the chassis tray into the liquid-cooling heat dissipation cabinet, each condenser fixed on the exterior sidewall of the liquid-cooling heat dissipation device contacts with a cold plate fixed on the rear pillar in the liquid-cooling heat dissipation cabinet through a heat-conductive pad, and the cold plate slides towards the rear pillar along a cold plate slide structure, compressing an elastic member between the cold plate and one of the rear pillars from a naturally extended state to a compressed state, which ensures the cold plate conducts heat to the condenser through contact with the heat-conductive pad, assisting the condenser and the evaporator inside the liquid-cooling heat dissipation device in dissipating heat from the heat-generating electronic component within the liquid-cooling heat dissipation device.