Image sensor
An image sensor is provided. The image sensor includes: a photoelectric conversion region in a semiconductor substrate; a photocharge collection region provided in the photoelectric conversion region; a floating diffusion region in the semiconductor substrate that is spaced apart from the photocharge collection region along a vertical direction; a charge multiplication region between the photocharge collection region and the floating diffusion region; and a vertical gate electrode which extends into the semiconductor substrate and overlaps the photocharge collection region along the vertical direction. A side surface of the vertical gate electrode is adjacent to the floating diffusion region and the charge multiplication region.
1 . An image sensor comprising:
a photoelectric conversion region in a semiconductor substrate;
a photocharge collection region provided in the photoelectric conversion region;
a floating diffusion region in the semiconductor substrate that is spaced apart from the photocharge collection region along a vertical direction;
a charge multiplication region between the photocharge collection region and the floating diffusion region, wherein the charge multiplication region comprises dopants having a first conductivity type; and
a vertical gate electrode which extends into the semiconductor substrate and overlaps the photocharge collection region along the vertical direction,
wherein a side surface of the vertical gate electrode is adjacent to the floating diffusion region and the charge multiplication region.
2 . The image sensor of claim 1 , wherein the first conductivity type is different from a conductivity type of the photocharge collection region and a conductivity type the floating diffusion region.
3 . The image sensor of claim 1 , wherein a dopant concentration of the photocharge collection region is greater than a dopant concentration of the photoelectric conversion region.
4 . The image sensor of claim 1 , further comprising an anode region provided on the photoelectric conversion region and spaced apart from the floating diffusion region along a horizontal direction with the vertical gate electrode interposed therebetween,
wherein the anode region has a conductivity type different from that of the floating diffusion region.
5 . The image sensor of claim 1 , wherein the vertical gate electrode has a ring shape and surrounds the floating diffusion region when viewed in a plan view.
6 . The image sensor of claim 1 , wherein the vertical gate electrode partially surrounds the floating diffusion region when viewed in a plan view.
7 . The image sensor of claim 1 , wherein the vertical gate electrode comprises a pair of sub-gate electrodes that extend in parallel to each other along a horizontal direction with the floating diffusion region interposed therebetween.
8 . The image sensor of claim 1 , further comprising a pixel isolation structure provided in the semiconductor substrate that defines a pixel region,
wherein the pixel isolation structure surrounds the photoelectric conversion region when viewed in a plan view, and
wherein the floating diffusion region is located in a central portion of the pixel region.
9 . The image sensor of claim 8 , wherein the pixel isolation structure comprises:
a conductive pattern that extends into the semiconductor substrate along the vertical direction; and
a liner insulating pattern between the conductive pattern and the semiconductor substrate.
10 . The image sensor of claim 8 , wherein the pixel isolation structure comprises a dopant region doped with dopants that have the first conductivity type, and
wherein the semiconductor substrate has the first conductivity type.
11 . An image sensor comprising:
a semiconductor substrate that has a first conductivity type;
a photoelectric conversion region that has a second conductivity type and is provided in the semiconductor substrate;
a photocharge collection region that has the second conductivity type and is provided in the photoelectric conversion region;
a floating diffusion region that has the second conductivity type and is spaced apart from the photocharge collection region along a vertical direction;
a charge multiplication region that has the first conductivity type and is provided between the photocharge collection region and the floating diffusion region;
a vertical gate electrode which extends into the semiconductor substrate, overlaps the photocharge collection region along the vertical direction, and surrounds the floating diffusion region and the charge multiplication region; and
an anode region that has the first conductivity type and is provided in the semiconductor substrate outside the vertical gate electrode.
12 . The image sensor of claim 11 , further comprising a pixel isolation structure that defines define a pixel region in the semiconductor substrate and surrounds the photoelectric conversion region when viewed in a plan view.
13 . The image sensor of claim 12 , wherein the pixel isolation structure comprises:
a conductive pattern that extends into the semiconductor substrate along the vertical direction; and
a liner insulating pattern between the conductive pattern and the semiconductor substrate.
14 . The image sensor of claim 11 , wherein a dopant concentration in the photocharge collection region is greater than a dopant concentration in the photoelectric conversion region.
15 . The image sensor of claim 11 , wherein a width of the photocharge collection region is substantially equal to a diameter of the vertical gate electrode.
16 . The image sensor of claim 11 , wherein the floating diffusion region is self-aligned with an inner side surface of the vertical gate electrode.
17 . An image sensor comprising:
a semiconductor substrate that has a first conductivity type;
a pixel isolation structure in the semiconductor substrate that defines a plurality of pixel regions;
a photoelectric conversion region provided in the semiconductor substrate in each of the plurality of pixel regions and comprising dopants having a second conductivity type;
a photocharge collection region that has the second conductivity type and is provided in the photoelectric conversion region;
a floating diffusion region that has the second conductivity type, is adjacent to a first surface of the semiconductor substrate in each of the plurality of pixel regions and is spaced apart from the photocharge collection region along a vertical direction;
a charge multiplication region that has the first conductivity type and is provided between the photocharge collection region and the floating diffusion region;
a vertical gate electrode that extends into the semiconductor substrate and surrounds the floating diffusion region and the charge multiplication region;
an anode region that has the first conductivity type and is provided in the semiconductor substrate outside the vertical gate electrode; and
a plurality of micro lenses disposed on a second surface of the semiconductor substrate and provided on the plurality of pixel regions, respectively.
18 . The image sensor of claim 17 , wherein the vertical gate electrode overlaps with the photocharge collection region along the vertical direction.
19 . The image sensor of claim 17 , wherein the pixel isolation structure extends from the first surface of the semiconductor substrate to the second surface of the semiconductor substrate.
20 . The image sensor of claim 17 , wherein the charge multiplication region is configured to induce an avalanche phenomenon based on a reverse bias being applied between the semiconductor substrate and the photoelectric conversion region, and a turn-on voltage being applied to the vertical gate electrode.