IP Library › Granted Patent US 12,497,675
Granted Patent B2
US 12,497,675 · App. 18/273,472 · Granted Dec 16, 2025

Hot-stamping formed body

Inventors: Kodai Murasawa (Tokyo, JP); Shingo Fujinaka (Tokyo, JP); Yuri Toda (Tokyo, JP)
Assignee: NIPPON STEEL CORPORATION
C22C38/32B32B15/011C21D1/18C21D6/002C21D6/005C21D6/007C21D6/008C21D8/0205C21D8/0221C21D8/0247C21D8/0278C21D9/46C22C38/001C22C38/002C22C38/005C22C38/02C22C38/04C22C38/06C22C38/08C22C38/10C22C38/12C22C38/14C22C38/16C22C38/28C21D2211/001C21D2211/008
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,497,675
App. No.
18/273,472
Granted
Dec 16, 2025
Kind
B2
Abstract

This hot-stamping formed body includes, as a chemical composition, by mass %: C: 0.15% or more and 0.50% or less; Si: 0.10% or more and 3.00% or less; Mn: 0.10% or more and 3.00% or less; P: less than 0.10%; S: less than 0.10%; N: less than 0.10%; Ti: 0.020% or more and 0.150% or less; B: 0.002% or more and 0.010% or less; optionally Al, Cr, Mo, Co, Ni, Cu, V, W, Ca, Mg, and REM; and a remainder including Fe and impurities, in which a microstructure of the hot-stamping formed body includes, by volume fraction, 85% or more of martensite and less than 15% of retained austenite, and in the microstructure, a standard deviation of a frequency distribution of nanohardnesses is 0.70 GPa or less, and an average grain size is 4.0 μm or less.

Claims (40)

1 . A hot-stamping formed body comprising, as a chemical composition, by mass %:

C: 0.15% or more and 0.50% or less;

Si: 0.10% or more and 3.00% or less;

Mn: 0.10% or more and 3.00% or less;

P: less than 0.10%;

S: less than 0.10%;

N: less than 0.10%;

Ti: 0.020% or more and 0.150% or less;

B: 0.002% or more and 0.010% or less;

Al: 0% or more and 2.0% or less;

Nb: 0% or more and 0.150% or less;

Cr: 0% or more and 1.0% or less;

Mo: 0% or more and 1.0% or less;

Co: 0% or more and 2.0% or less;

Ni: 0% or more and 3.0% or less;

Cu: 0% or more and 1.0% or less;

V: 0% or more and 1.0% or less;

W: 0% or more and 1.0% or less;

Ca: 0% or more and 0.0100% or less;

Mg: 0% or more and 0.0100% or less;

REM: 0% or more and 0.0100% or less; and

a remainder including Fe and impurities,

wherein a microstructure of the hot-stamping formed body includes, by volume fraction, 85% or more of martensite and less than 15% of retained austenite, and

in the microstructure, a standard deviation of a frequency distribution of nanohardnesses is 0.70 GPa or less, and an average grain size is 4.0 μm or less.

2 . The hot-stamping formed body according to claim 1 , comprising, as the chemical composition, by mass %, one or more of:

Al: 0.0002% or more and 2.0% or less;

Nb: 0.010% or more and 0.150% or less;

Cr: 0.1% or more and 1.0% or less;

Mo: 0.1% or more and 1.0% or less;

Co: 0.1% or more and 2.0% or less;

Ni: 0.1% or more and 3.0% or less;

Cu: 0.1% or more and 1.0% or less;

V: 0.1% or more and 1.0% or less;

W: 0.1% or more and 1.0% or less;

Ca: 0.0010% or more and 0.0100% or less;

Mg: 0.0010% or more and 0.0100% or less; and

REM: 0.0010% or more and 0.0100% or less.

3 . The hot-stamping formed body according to claim 1 , wherein a surface of the hot-stamping formed body has an alloy layer.

4 . The hot-stamping formed body according to claim 2 ,

wherein a surface of the hot-stamping formed body has an alloy layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2023
From: MURASAWA, KODAI; FUJINAKA, SHINGO; TODA, YURI
To: NIPPON STEEL CORPORATION
Reel/Frame 064343/0591 →
Priority Claims (1)
JP 2021-019911 · Feb 10, 2021 · national
Continuity (1)
Related Publication 20240117477A1 · Apr 11, 2024
References Cited (19)
US 8802005B2 · Mizuno · 2014 [cited by examiner]
US 20030084965A1 · Nishi et al. · 2003 [cited by applicant]
US 20110226393A1 · Senuma · 2011 [cited by examiner]
US 20130167980A1 · Kawata · 2013 [cited by examiner]
US 20140004378A1 · Tanahashi · 2014 [cited by examiner]
US 20200157666A1 · Sakakibara · 2020 [cited by examiner]
US 20200385836A1 · Yi et al. · 2020 [cited by applicant]
US 20220127705A1 · Fujinaka et al. · 2022 [cited by applicant]
EP 3943623A1 · 2022 [cited by applicant]
JP 2002102980A · 2002 [cited by applicant]
JP 2006152427A · 2006 [cited by applicant]
JP 201065294A · 2010 [cited by applicant]
JP 201065295A · 2010 [cited by applicant]
JP 201070806A · 2010 [cited by applicant]
WO WO2018151332A1 · 2018 [cited by applicant]
WO WO2019003543A1 · 2019 [cited by applicant]
WO WO2020189761A1 · 2020 [cited by applicant]
U.S. Office Action for U.S. Appl. No. 17/795,741, dated Dec. 26, 2024. [cited by applicant]
U.S. Office Action for U.S. Appl. No. 17/795,741, dated Jun. 12, 2025. [cited by applicant]