IP Library Granted Patent US 12,498,321
Granted Patent B2
US 12,498,321 · App. 18/035,202 · Granted Dec 16, 2025

Sensor-chip and manufacturing method thereof

Inventors: Hakho Lee (Acton, MA); Hyungsoon Im (Peabody, MA); Nam Ho Bae (Daejeon, KR); Seok Jae Lee (Daejeon, KR); Kyoung Gyun Lee (Daejeon, KR); Kwang Hee Kim (Daejeon, KR); Kil Sun Roh (Daejeon, KR)
Assignees: The General Hospital Corporation; Korea Advanced Institute of Science and Technology
G01N21/554G01N21/41G01N2021/5903
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Quick Facts
Patent No.
US 12,498,321
App. No.
18/035,202
Granted
Dec 16, 2025
Kind
B2
Abstract

Methods, systems, and apparatus, for a sensor-chip device for performing analysis on target substances. In one aspect, the sensor-chip assembly includes a chip body including a substrate, at least one metal layer formed on the substrate, and nanoholes formed in the metal layer, a base having an accommodating portion for accommodating the chip body, and a fixing member fixing the chip body accommodated in the accommodating portion by being coupled to the base.

Claims (42)

1 . A sensor-chip assembly for detecting a target substance using surface plasmon resonance, the sensor-chip assembly comprising:

a chip body comprising a substrate, at least one metal layer formed on the substrate, and a plurality of nanoholes formed in the metal layer;

a base having an accommodating portion for accommodating the chip body;

a fixing member fixing the chip body accommodated in the accommodating portion by being coupled to the base, the fixing member comprising a body including internal walls defining an opening formed through the body through which a first surface of the chip body is exposed; and

a cover covering the chip body exposed through the opening of the fixing member,

wherein a volume is defined in part by the first surface of the chip body, the internal walls of the fixing member and a surface of the cover.

2 . The sensor-chip assembly of claim 1 , wherein the at least one metal layer includes any one of gold (Au), silver (Ag), copper (Cu), aluminum (Al), and an alloy thereof.

3 . The sensor-chip assembly of claim 1 , wherein the base includes at least one fastening protrusion protruding from a top surface of the base.

4 . The sensor-chip assembly of claim 1 , further comprising a sealing member disposed between the base and the fixing member.

5 . The sensor-chip assembly of claim 4 , wherein the volume is further defined by a third surface of the sealing member.

6 . The sensor-chip assembly of claim 1 , wherein the volume retains at least a threshold volume of the target substance.

7 . The sensor-chip assembly of claim 6 , wherein the threshold volume of the target substance comprises a volume of the target substance sufficient to contact the surface of the cover and the target substance is uniformly distributed on the first surface of the chip body when the threshold volume of the target substance is dispensed.

8 . A sensor-chip assembly for detecting a target substance using surface plasmon resonance, the sensor-chip assembly comprising:

a chip body comprising a substrate, at least one metal layer formed on the substrate, and a plurality of nanoholes formed in the metal layer;

a housing having an accommodating portion for accommodating the chip body; and

a fixing member fixing the chip body accommodated in the accommodating portion by being coupled to the housing, the fixing member comprising a body including internal walls defining an opening formed through the body through which a first surface of the chip body is exposed; and

a cover covering the first surface of the chip body exposed through the opening formed through the body of the fixing member, and

wherein a volume is defined in part by the first surface of the chip body, a second surface of the housing and a third surface of the cover.

9 . The sensor-chip assembly of claim 8 , wherein the housing includes at least one receptacle for coupling the fixing member to the housing.

10 . The sensor-chip assembly of claim 8 , wherein the volume retains at least a threshold volume of the target substance.

11 . The sensor-chip assembly of claim 10 , wherein the threshold volume of the target substance comprises a volume of the target substance sufficient to contact the third surface of the cover and the target substance is uniformly distributed on the first surface of the chip body when the threshold volume of the target substance is dispensed.

12 . The sensor-chip assembly of claim 8 , further comprising an alignment feature to align the sensor-chip assembly with respect to a sensor system.

13 . The sensor-chip assembly of claim 8 , wherein the second surface of the housing comprises a portion of sidewalls defining part of the accommodating portion of the housing.

14 . A method of manufacturing a sensor-chip assembly for detecting a target substance using surface plasmon resonance, the method comprising:

preparing a chip body, the preparation comprising:

preparing a substrate including a glass or quartz material;

forming a metal layer on a side of the substrate;

forming a photoresist pattern on the metal layer through a photolithography process; and

forming nanoholes on the metal layer by etching and removing photoresist remaining on the metal layer;

preparing a base having an accommodating portion;

disposing the chip body to be accommodated in the accommodating portion;

fixing the chip body accommodated in the accommodating portion to the base using a fixing member, the fixing member comprising a body including internal walls defining an opening formed through the body through which a first surface of the chip body is exposed, wherein a volume is defined in part by the first surface of the chip body and the internal walls of the fixing member;

dispensing the target substance on the metal layer of the chip body, the metal layer comprising the first surface of the chip body, wherein the dispensed target substance is at least a threshold volume of target substance; and

covering an exposed surface of the dispensed target substance with a cover.

15 . The method of claim 14 , further comprising:

disposing a sealing member between the base and the fixing member.

16 . The method of claim 14 , wherein the dispensed target substance contacts at least the first surface of the metal layer of the chip body, a second surface of the base, and a third surface of the cover.

17 . The method of claim 14 , further comprising:

exposing a top surface of the sensor-chip assembly to light emitted from a light source, wherein light from the light source that is incident on the chip body generates a surface plasmon resonance on the first surface of the chip body; and

collecting, at a light receiver, a transmitted light signal from a bottom surface of the sensor-chip assembly.

18 . The method of claim 17 , further comprising:

determining, from the light emitted from the light source and the transmitted light signal collected at the light receiver, a property of the target substance.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2023
From: LEE, HAKHO; IM, HYUNGSOON
To: THE GENERAL HOSPITAL CORPORATION
Reel/Frame 064453/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2023
From: BAE, NAM HO; LEE, SEOK JAE; LEE, KYOUNG GYUN; KIM, KWANG HEE; ROH, KIL SUN
To: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
Reel/Frame 064453/0121 →
Continuity (2)
Provisional Application 63109229 · Nov 3, 2020
Related Publication 20230417667A1 · Dec 28, 2023
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