Method of mounting wires to substrate support ceramic
A substrate support assembly includes a baseplate, a ceramic plate arranged on the baseplate, and a plurality of wires. The ceramic plate includes a plurality of slots arranged on a side facing the baseplate and a plurality of electrically conducting terminals disposed in the plurality of slots, respectively. Each of the terminals includes a base portion connected to the ceramic plate, a second portion extending from the base portion towards the baseplate, and an opening in the second portion extending from an end of the second portion adjacent to the base portion to a distal end of the second portion. Each of the wires passes through the opening of the respective terminal and is braided around the distal end of the second portion of the respective terminal.
1 . A substrate support assembly comprising:
a baseplate;
a ceramic plate arranged on the baseplate, wherein the ceramic plate includes:
a plurality of slots arranged on a side facing the baseplate; and
a plurality of electrically conducting terminals disposed in the plurality of slots, respectively;
wherein each of the terminals includes:
a base portion connected to the ceramic plate;
a second portion extending from the base portion towards the baseplate; and
an opening in the second portion extending from an end of the second portion adjacent to the base portion to a distal end of the second portion; and
a plurality of wires, wherein each of the wires passes through the opening of the respective terminal and is braided around the distal end of the second portion of the respective terminal.
2 . The substrate support assembly of claim 1 wherein each of the wires is looped one or more times around the distal end of the second portion of the respective terminal.
3 . The substrate support assembly of claim 1 further comprising an electrically bonding material deposited at the distal end of the second portion of each of the terminals.
4 . The substrate support assembly of claim 1 wherein the openings of the terminals thermally decouple the respective wires from the ceramic plate during processing of a substrate.
5 . The substrate support assembly of claim 3 wherein the electrically bonding material includes a solder material or an epoxy.
6 . The substrate support assembly of claim 3 wherein the electrically bonding material is localized at the distal end of the second portion of each of the terminals.
7 . The substrate support assembly of claim 3 wherein the electrically bonding material does not extend to the base portions of the terminals.
8 . The substrate support assembly of claim 3 wherein the electrically bonding material does not fill the openings of the terminals.
9 . The substrate support assembly of claim 1 wherein the base portions of the terminals are connected to electrical components disposed in the ceramic plate.
10 . The substrate support assembly of claim 1 wherein the distal ends of the wires are routed through the baseplate and are connected to a circuit arranged along a side of the baseplate facing away from the ceramic plate.
11 . The substrate support assembly of claim 10 wherein the circuit communicates through the wires with electrical components that are disposed in the ceramic plate and that are connected to the base portions of the terminals.
12 . The substrate support assembly of claim 1 wherein each of the terminals is T-shaped, with a horizontal portion of T being the base portion of each of the terminals and a vertical portion of T being the second portion of each of the terminals.
13 . The substrate support assembly of claim 1 wherein in each of the terminals, the second portion extends perpendicularly from the base portion.
14 . The substrate support assembly of claim 1 wherein in each of the terminals, the second portion is longer than the base portion.
15 . The substrate support assembly of claim 1 wherein in each of the terminals, the base portion and the second portion are cylindrical, wherein the base portion has a longer radius and shorter height than the second portion.
16 . The substrate support assembly of claim 1 wherein each of the terminals is made of a material having a first coefficient of thermal expansion that is within a predetermined range of a second coefficient of thermal expansion of the ceramic plate.
17 . The substrate support assembly of claim 1 wherein each of the terminals is made of tungsten and copper.
18 . The substrate support assembly of claim 1 wherein each of the terminals is coated with nickel.
19 . The substrate support assembly of claim 1 wherein each of the wires is made of a single strand of an electrically conducting material.
20 . The substrate support assembly of claim 1 wherein each of the wires is made of multiple strands of an electrically conducting material.
21 . The substrate support assembly of claim 1 wherein each of the wires is made of copper and is coated with silver.
22 . The substrate support assembly of claim 3 wherein the electrically bonding material includes a first material comprising Sn, Ag, and Cu or a second material comprising Sn and Ag.