Granted Patent B2

US 12,503,586 · App. 17/239,789 · Granted Dec 23, 2025

Inventors: Lei Huang (Shanghai, CN); Hao Wu (Shanghai, CN); Xueyu Qiu (Shanghai, CN); Xuan Xie (Shanghai, CN)

Assignee: Henkel AG & Co. KGaA

C08L63/00C09K5/14C08L2205/025

Abstract

Claims (15)

1 . A thermal conductive potting composition, consisting of:

A) a first epoxy resin having a viscosity of at least 10000 mPa·s at 25° C., the epoxy resin being present in an amount of about 10 wt. % based on the total weight of the composition,

B) a second epoxy resin that is different from the first epoxy resin, the second epoxy resin being a triglycidyl ether resin having at least three epoxy functional groups, and a viscosity of at least 10 mPa·s and not greater than 1000 mPa·s at 25° C.,

C) core shell nanoparticles, 20% by weight of which have a particle size of 0.01 to 1 μm,

D) fillers, which consist of:

D1) a silane surface-modified spherical alumina, which has an average particle size of greater than 17 μm and not greater than 35 μm, the silane surface-modified spherical alumina being present in an amount of about 56 wt. % based on the total weight of the composition and

D2) a thermal conductive alumina powder having an average particle size of greater than 3 μm and not greater than 5 μm, the thermal conductive powder being present in an amount of about 14 wt. % based on the total weight of the composition,

E) a curing agent,

F) a cure accelerator being tris(dimethylaminomethyl)phenol, and

G) silica.

2 . The thermal conductive potting composition according to claim 1 , wherein the content of the component B) is from 1.5% to 5% by weight, based on the total weight of the composition.

3 . The thermal conductive potting composition according to claim 1 , wherein the content of the component C) is from 1% to 50% by weight, based on the total weight of the composition.

4 . The thermal conductive potting composition according to claim 1 , wherein the component D1) contains 0.001% to 5% by weight of silane.

5 . The thermal conductive potting composition according to claim 1 , wherein the content of the component E) is from 1% to 20% by weight, based on the total weight of the composition.

6 . A new energy vehicle comprising a cured product of the thermal conductive potting composition according to claim 1 .

Continuity (2)

References Cited (42)