IP Library Granted Patent US 12,504,589
Granted Patent B2
US 12,504,589 · App. 18/001,861 · Granted Dec 23, 2025

Semiconductor relay module

Inventors: Daisuke Kitahara (Osaka, JP); Naoki Ushiyama (Mie, JP); Shinsuke Taka (Mie, JP)
Assignee: Panasonic Intellectual Property Management Co., Ltd.
G02B6/4201G02B6/42G02B6/4293H10F55/00G02B6/4256
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Quick Facts
Patent No.
US 12,504,589
App. No.
18/001,861
Granted
Dec 23, 2025
Kind
B2
Abstract

A semiconductor relay module includes: first and second semiconductor relays; and first to third input terminals and first and second output terminals that are exposed from a housing. The first semiconductor relay includes a first optocoupler and a first switch, and the second semiconductor relay includes a second optocoupler and a second switch. The first switch and the second switch are connected by an output connecting line, the third input terminal is connected to an input connecting line, and the input connecting line and the output connecting line are covered by the housing.

Claims (99)

1 . A semiconductor relay module comprising:

a first semiconductor relay;

a second semiconductor relay;

a housing covering the first semiconductor relay and the second semiconductor relay;

a first input terminal exposed from the housing;

a second input terminal exposed from the housing;

a first output terminal exposed from the housing;

a second output terminal exposed from the housing;

a third input terminal exposed from the housing;

an input connecting line covered by the housing; and

an output connecting line covered by the housing, wherein

the first semiconductor relay includes:

a first optocoupler including a first light-emitting element and a first light-receiving device configured to receive an optical signal from the first light-emitting element; and

a first switch including a first metal oxide semiconductor field effect transistor (MOSFET) configured to connect and disconnect between a first output end of the first semiconductor relay and a second output end of the first semiconductor relay according to an output signal from the first light-receiving device, a gate of the first MOSFET being coupled to the first optocoupler,

the second semiconductor relay includes:

a second optocoupler including a second light-emitting element and a second light-receiving device configured to receive an optical signal from the second light-emitting element; and

a second switch including a second MOSFET configured to connect and disconnect between a first output end of the second semiconductor relay and a second output end of the second semiconductor relay according to an output signal from the second light-receiving device, a gate of the second MOSFET being coupled to the second optocoupler,

the first input terminal is connected to an anode of the first light-emitting element,

the second input terminal is connected to a cathode of the second light-emitting element,

a cathode of the first light-emitting element of the first semiconductor relay and an anode of the second light-emitting element of the second semiconductor relay are connected via the input connecting line,

the first output terminal is connected to the first output end of the first semiconductor relay,

the second output terminal is connected to the second output end of the second semiconductor relay,

the second output end of the first semiconductor relay and the first output end of the second semiconductor relay are connected via the output connecting line, and

the third input terminal is connected to the input connecting line.

2 . The semiconductor relay module according to claim 1 , further comprising:

a light blocker configured to block the optical signal that is output from the first light-emitting element and the optical signal that is output from the second light-emitting element, wherein

the light blocker is formed of a light-blocking resin, and

the light blocker is disposed between the first optocoupler of the first semiconductor relay and the second optocoupler of the second semiconductor relay.

3 . The semiconductor relay module according to claim 1 , wherein

the output connecting line is completely covered by the housing.

4 . The semiconductor relay module according to claim 1 , wherein

the first semiconductor relay and the second semiconductor relay are arranged side-by-side, and

the output connecting line is disposed adjacent to the first semiconductor relay and the second semiconductor relay in a manner to provide a distance from a first light transmissive part provided in the first optocoupler and a distance from a second light transmissive part provided in the second optocoupler.

5 . The semiconductor relay module according to claim 4 , wherein

the first semiconductor relay and the second semiconductor relay are disposed between the input connecting line and the output connecting line.

6 . The semiconductor relay module according to claim 4 , wherein

the first light transmissive part and the second light transmissive part are integrally formed.

7 . The semiconductor relay module according to claim 1 , wherein

the first semiconductor relay and the second semiconductor relay are arranged side-by-side, and

the input connecting line is disposed adjacent to the first semiconductor relay and the second semiconductor relay in a manner to provide a distance from a first light transmissive part provided in the first optocoupler and a distance from a second light transmissive part provided in the second optocoupler.

8 . The semiconductor relay module according to claim 1 , wherein

the first semiconductor relay further includes a third MOSFET,

the second semiconductor relay further includes a fourth MOSFET, and

at least one of the first MOSFET or the third MOSFET and at least one of the second MOSFET or the fourth MOSFET are arranged to align sources and drains thereof in a same direction.

9 . The semiconductor relay module according to claim 8 , wherein

the first MOSFET and the third MOSFET are electrically connected in series,

the source of the first MOSFET and the source of the third MOSFET are electrically connected to each other,

the second MOSFET and the fourth MOSFET are electrically connected in series, and

the source of the second MOSFET and the source of the fourth MOSFET are electrically connected to each other.

10 . The semiconductor relay module according to claim 8 , further comprising:

a first die pad on which the first MOSFET is mounted;

a second die pad on which the second MOSFET is mounted;

a third die pad on which the third MOSFET is mounted;

a fourth die pad on which the fourth MOSFET is mounted;

a fifth die pad on which the first light-receiving device is mounted; and

a sixth die pad on which the second light-receiving device is mounted, wherein

the first light-receiving device includes:

a first light-receiving element configured to receive the optical signal from the first light-emitting element; and

a first control circuit configured to drive the first MOSFET and the third MOSFET,

the second light-receiving device includes:

a second light-receiving element configured to receive the optical signal from the second light-emitting element; and

a second control circuit configured to drive the second MOSFET and the fourth MOSFET,

the gate of the first MOSFET and a gate of the third MOSFET are electrically connected to the first control circuit,

the drain of the first MOSFET is electrically connected to the first die pad,

the drain of the third MOSFET is electrically connected to the third die pad,

the source of the first MOSFET and the source of the third MOSFET are electrically connected to the fifth die pad,

the gate of the second MOSFET and a gate of the fourth MOSFET are electrically connected to the second control circuit,

the drain of the second MOSFET is electrically connected to the second die pad,

the drain of the fourth MOSFET is electrically connected to the fourth die pad, and

the source of the second MOSFET and the source of the fourth MOSFET are electrically connected to the sixth die pad.

11 . The semiconductor relay module according to claim 1 , further comprising:

a fourth input terminal exposed from the housing and connected to the input connecting line.

12 . The semiconductor relay module according to claim 1 , wherein no output terminal exposed from the housing is provided to the output connecting line.

13 . A semiconductor relay module comprising:

a plurality of semiconductor relays arranged side-by-side in one direction;

a first input terminal exposed from a housing;

a second input terminal exposed from the housing;

a third input terminal exposed from the housing;

a first output terminal exposed from the housing;

a second output terminal exposed from the housing;

an input connecting line covered by the housing; and

an output connecting line covered by the housing, wherein

the plurality of semiconductor relays include a first semiconductor relay at one end, a second semiconductor relay at an other end, and a third semiconductor relay between the first semiconductor relay and the second semiconductor relay, the third semiconductor relay being adjacent to the first semiconductor,

the first semiconductor relay includes:

a first optocoupler including a first light-emitting element and a first light-receiving device configured to receive an optical signal from the first light-emitting element; and

a first switch including a first metal oxide semiconductor field effect transistor (MOSFET) configured to connect and disconnect between a first output end of the first semiconductor relay and a second output end of the first semiconductor relay according to an output signal from the first light-receiving device, a gate of the first MOSFET being coupled to the first optocoupler,

the second semiconductor relay includes:

a second optocoupler including a second light-emitting element and a second light-receiving device configured to receive an optical signal from the second light-emitting element; and

a second switch including a second MOSFET configured to connect and disconnect between a first output end of the second semiconductor relay and a second output end of the second semiconductor relay according to an output signal from the second light-receiving device, a gate of the second MOSFET being coupled to the second optocoupler,

the third semiconductor relay includes:

a third optocoupler including a third light-emitting element and a third light-receiving device configured to receive an optical signal from the third light-emitting element; and

a third switch including a third MOSFET configured to connect and disconnect between a first output end of the third semiconductor relay and a second output end of the third semiconductor relay according to an output signal from the third light-receiving device, a gate of the third MOSFET being coupled to the third optocoupler,

the first input terminal is connected to an anode of the first light-emitting element,

the second input terminal is connected to a cathode of the second light-emitting element,

a cathode of the first light-emitting element of the first semiconductor relay and an anode of the third light-emitting element of the third semiconductor relay are connected via the input connecting line,

the first output terminal is connected to the first output end of the first semiconductor relay,

the second output terminal is connected to the second output end of the second semiconductor relay,

the second output end of the first semiconductor relay and the first output end of the third semiconductor relay are connected via the output connecting line, and

the third input terminal is connected to the input connecting line.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2023
From: KITAHARA, DAISUKE; USHIYAMA, NAOKI; TAKA, SHINSUKE
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 063181/0418 →
Priority Claims (2)
JP 2020-133164 · Aug 5, 2020 · national
JP 2021-120201 · Jul 21, 2021 · national
Continuity (1)
Related Publication 20230335666A1 · Oct 19, 2023
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