IP Library › Granted Patent US 12,504,827
Granted Patent B2
US 12,504,827 · App. 18/806,658 · Granted Dec 23, 2025

Haptic feedback module and device thereof with haptic feedback function

Inventors: Cheng-Ta Lee (Tainan, TW); Tai-Yu Kuo (Hsinchu County, TW); Chun-Hsin Liao (Taoyuan, TW)
Assignee: Unictron Technologies Corporation
G06F3/016
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Quick Facts
Patent No.
US 12,504,827
App. No.
18/806,658
Granted
Dec 23, 2025
Kind
B2
Abstract

A haptic feedback module is applied to a haptic feedback operation of a device and includes a member to be vibrated, a vibration-transmitting plate, a vibration-transmitting point array, and a vibration component. The member to be vibrated is disposed on the device. The vibration-transmitting plate has an upper vibration-transmitting surface and a lower vibration-transmitting surface opposite to each other. The vibration-transmitting point array is disposed on the upper vibration-transmitting surface and contacts the member to be vibrated. The vibration component is disposed on one of the upper vibration-transmitting surface and the lower vibration-transmitting surface and coupled to the device. When the haptic feedback operation is performed, a vibration energy from the vibration component driven by the device passes through the vibration-transmitting plate and the vibration-transmitting point array sequentially to the member to be vibrated, for providing a haptic feedback to the device.

Claims (24)

1 . A haptic feedback module applied to a haptic feedback operation of a device, the haptic feedback module comprising:

a member to be vibrated, disposed on the device;

a vibration-transmitting plate having an upper vibration-transmitting surface and a lower vibration-transmitting surface opposite to each other;

a vibration-transmitting point array disposed on the upper vibration-transmitting surface and contacting the member to be vibrated; and

a vibration component disposed on one of the upper vibration-transmitting surface and the lower vibration-transmitting surface and connected to the device;

wherein when the haptic feedback operation of the device is performed, a vibration energy generated by the vibration component driven by the device sequentially passes through the vibration-transmitting plate and the vibration-transmitting point array and is transmitted to the member to be vibrated, for providing a haptic feedback to the device.

2 . The haptic feedback module of claim 1 , wherein the vibration component is selected from a vibration actuator group at least consisting of a piezoelectric actuator, a linear resonant actuator, and an eccentric rotating mass vibration motor.

3 . The haptic feedback module of claim 1 , wherein the vibration-transmitting plate is made of a rigid vibration-transmitting material selected from a group at least consisting of metal material, engineering plastic material, and ceramic material.

4 . The haptic feedback module of claim 3 , wherein the vibration-transmitting point array is integrally formed on the upper vibration-transmitting surface of the vibration-transmitting plate.

5 . The haptic feedback module of claim 4 , wherein the vibration-transmitting plate is made of metal material, and the vibration-transmitting point array is formed on the upper vibration-transmitting surface of the vibration-transmitting plate by a metal stamping process.

6 . The haptic feedback module of claim 1 , wherein the vibration-transmitting plate and the member to be vibrated are rectangular, and the vibration-transmitting point array comprises two vibration-transmitting points symmetrically arranged relative to a center of the member to be vibrated along a central long axis of the member to be vibrated.

7 . The haptic feedback module of claim 6 , wherein a distance between each vibration-transmitting point and the center is between one-fifth and two-fifths of a length of the member to be vibrated.

8 . The haptic feedback module of claim 1 , wherein the vibration-transmitting plate and the member to be vibrated are rectangular, and the vibration-transmitting point array comprises three vibration-transmitting points symmetrically arranged in a triangular configuration relative to a central short axis of the member to be vibrated.

9 . The haptic feedback module of claim 8 , wherein the two vibration-transmitting points at a bottom of the triangular configuration have a distance from the central short axis of the member to be vibrated, respectively, and the distance is between one-fifth and two-fifths of a length of the member to be vibrated; a height of the triangular configuration along the central short axis of the member to be vibrated is between one-half and four-fifths of a width of the member to be vibrated.

10 . The haptic feedback module of claim 1 , wherein the vibration-transmitting plate and the member to be vibrated are rectangular, and the vibration-transmitting point array comprises four vibration-transmitting points symmetrically arranged in a rectangular configuration relative to a central long axis and a central short axis of the member to be vibrated.

11 . The haptic feedback module of claim 10 , wherein a distance between each vibration-transmitting point and the central long axis is between one-fifteenth and two-fifths of a width of the member to be vibrated, and a distance between each vibration-transmitting point and the central short axis is between one-sixth and five-twelfths of a length of the member to be vibrated.

12 . A device with a haptic feedback function, the device comprising:

a main body; and

a haptic feedback module disposed in the main body, the haptic feedback module comprising:

a member to be vibrated;

a vibration-transmitting plate having an upper vibration-transmitting surface and a lower vibration-transmitting surface opposite to each other;

a vibration-transmitting point array disposed on the upper vibration-transmitting surface and contacting the member to be vibrated; and

a vibration component disposed on one of the upper vibration-transmitting surface and the lower vibration-transmitting surface and connected to the main body;

wherein when the haptic feedback operation of the main body is performed, a vibration energy generated by the vibration component driven by the main body sequentially passes through the vibration-transmitting plate and the vibration-transmitting point array and is transmitted to the member to be vibrated, for providing a haptic feedback to the main body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2024
From: LEE, CHENG-TA; KUO, TAI-YU; LIAO, CHUN-HSIN
To: UNICTRON TECHNOLOGIES CORPORATION
Reel/Frame 068304/0421 →
Priority Claims (1)
TW 113116945 · May 8, 2024 · national
Continuity (1)
Related Publication 20250348148A1 · Nov 13, 2025
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