Electronic module for chip card
A process for manufacturing an electronic module intended to be implemented in a dual-interface portable object is provided. The process includes at least the following steps: Using a single-sided film consisting of one or more contact regions and a dielectric comprising one or more apertures, Using a substrate comprising one or more electrically conductive regions intended for the contactless communication of the object, Securing said single-sided film and said substrate together, Positioning an integrated circuit and connecting it to the contact regions of the single-sided film and at least to one terminal of at least one of said electrically conductive regions, Depositing a protective layer incorporating at least said integrated circuit. Also provided is a module obtained by means of the process.
1 . A process for manufacturing an electronic module intended to be implemented in a dual-interface portable object, the process comprising:
providing a film, wherein the film comprises:
one or more contacts on a first face of the film; and
a dielectric layer on a second face of the film;
piercing the dielectric layer to define one or more apertures therein;
providing a substrate bearing an antenna, wherein the substrate is distinct from the dielectric layer, wherein the antenna comprises a crimp, and wherein the crimp is formed by one or more circular regions;
adhering the dielectric layer to the substrate;
cutting out a region of the substrate in a center of at least a portion of the antenna;
positioning an integrated circuit within the cut-out region of the substrate;
bonding the integrated circuit to the dielectric layer;
connecting the integrated circuit to the contacts;
connecting the integrated circuit to at least one terminal of the antenna; and
depositing a protective layer that covers the integrated circuit.
2 . The process as claimed in claim 1 , wherein the antenna comprises at least one contact pad located at at least one end of the antenna.
3 . The process as claimed in claim 1 , wherein the antenna consists of one area of conductive material.
4 . The process as claimed in claim 1 , further comprising perforating the substrate to define one or more apertures in the substrate that correspond to the apertures that are defined in the dielectric layer, wherein the one or more apertures in the substrate form soldering wells between the integrated circuit and the contacts.
5 . The process as claimed in claim 4 , wherein the apertures in the substrate are distributed around the crimp.
6 . The process as claimed in claim 4 , wherein perforating the substrate comprises laser sweeping.
7 . The process as claimed in claim 1 , wherein the antenna comprises aluminum.
8 . The process as claimed in claim 1 , wherein a pattern of the antenna is produced using an etching technique or an additive process.
9 . The process as claimed in claim 1 , wherein a pattern of the antenna is produced using screen printing or transfer.
10 . The process as claimed in claim 1 , wherein the substrate comprises polyethylene terephthalate (PET) or polyvinyl chloride (PVC).
11 . The process as claimed in claim 1 , further comprising cleaning the antenna using laser, plasma, or chemical techniques.
12 . An electronic module intended to be implemented in a portable object comprising a contact function, the electronic module comprising:
a film comprising:
one or more contacts on a first face of the film; and
a dielectric layer on a second face of the film, wherein the dielectric layer has one or more apertures defined therein;
a substrate bearing an antenna, wherein the substrate is distinct from the dielectric layer, wherein the dielectric layer is adhered to the substrate, wherein the antenna comprises a crimp, and wherein the crimp is formed by one or more circular regions;
an integrated circuit positioned within a region cut out of the substrate and bonded to the dielectric layer, wherein the cut-out region of the substrate is in a center of at least a portion of the antenna, and wherein the integrated circuit is connected to the contacts of the film and to at least one terminal of the antenna; and
a protective layer that covers the integrated circuit.
13 . The module as claimed in claim 12 , wherein the antenna comprises
at least one contact pad located at at least one end of the antenna.
14 . The module as claimed in claim 12 , wherein the antenna consists of one area of conductive material.
15 . The module as claimed in claim 12 , wherein the substrate comprises one or more perforations defining one or more apertures in the substrate that correspond to the apertures that are defined in the dielectric layer, wherein the one or more apertures in the substrate form soldering wells between the integrated circuit and the contacts.
16 . The module as claimed in claim 15 , wherein the one or more perforations were defined by laser sweeping.
17 . The module as claimed in claim 12 , wherein the dielectric layer comprises epoxy glass, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), or polyvinyl chloride (PVC).
18 . The module as claimed in claim 12 , wherein the substrate comprises polyethylene terephthalate (PET) or polyvinyl chloride (PVC).
19 . The module as claimed in claim 12 , wherein the crimp is located near a center of the substrate.
20 . The process as claimed in claim 1 , wherein the crimp is located near a center of the substrate.