IP Library Granted Patent US 12,506,270
Granted Patent B2
US 12,506,270 · App. 18/628,100 · Granted Dec 23, 2025

Broadband decoupled midband dipole for a dense multiband antenna

Inventors: Jiaqiang Zhu (Baldwinsville, NY); Niranjan Sundararajan (Clay, NY); Wengang Chen (Liverpool, NY)
Assignee: John Mezzalingua Associates, LLC
H01Q9/26H01Q5/20
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Quick Facts
Patent No.
US 12,506,270
App. No.
18/628,100
Filed
Apr 5, 2024
Granted
Dec 23, 2025
Kind
B2
Art Unit
2845
USPC
343/797
Abstract

Disclosed is a midband dipole for use in a multiband antenna. The midband dipole has four folded dipoles, each of which is coupled to a decoupling circuit that has two capacitance points. The disclosed decoupling circuit configuration mitigates common mode resonance with nearby lowband dipoles, further preventing cross polarization in the midband.

Claims (15)

1 . A radiator for a multiband antenna, comprising:

a dielectric plate;

four decoupling circuits disposed on a first side of the dielectric plate; and

four folded dipole arms disposed on a second side of the dielectric plate,

wherein the dielectric plate has four vias, each via having a conductive trace that couples a given decoupling circuit to a corresponding folded dipole arm.

2 . The radiator of claim 1 , wherein the dielectric plate comprises a Printed Circuit Board (PCB).

3 . The radiator of claim 1 , wherein each of the four decoupling circuits comprises a first conductive layer disposed on the dielectric plate.

4 . The radiator of claim 1 , wherein each of the four folded dipole arms comprises a second conductive layer disposed on the dielectric plate.

5 . The radiator of claim 1 , wherein the first side of the dielectric plate comprises an upper side of the dielectric plate.

6 . The radiator of claim 5 , wherein the second side of the dielectric plate comprises a lower side of the dielectric plate.

7 . The radiator of claim 1 , wherein each of the four decoupling circuits comprises:

a first capacitive pad;

a second capacitive pad; and

a first inductive trace coupled to the first capacitive pad.

8 . The radiator of claim 7 , wherein the first inductive trace conductively couples through the via to a second inductive trace disposed on the second side of the dielectric plate, wherein the second inductive trace is electrically coupled to the corresponding folded dipole arm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 5, 2024
From: ZHU, JIAQIANG; SUNDARARAJAN, NIRANJAN; CHEN, WENGANG
To: JOHN MEZZALINGUA ASSOCIATES, LLC
Reel/Frame 067915/0048 →
Continuity (4)
Continuation 18118187 · Mar 7, 2023
Continuation 17689278 · Mar 8, 2022
Provisional Application 63158028 · Mar 8, 2021
Related Publication 20240339757A1 · Oct 10, 2024
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