Granted Patent B1

US 12,506,283 · App. 18/386,418 · Granted Dec 23, 2025

Inventors: Jeremiah D. Wolf (Atkins, IA); James B. West (Cedar Rapids, IA); Jiwon L Moran (Marion, IA)

Assignee: Rockwell Collins, Inc.

H01Q23/00H01Q1/2225H05K1/0393H05K1/111H05K1/115

Abstract

Claims (61)

1 . A conformal interposer assembly, comprising:

a plurality of first conductive pads conforming to a first interconnection geometry, each first conductive pad configured for connection to at least one antenna element set into at least one printed circuit board (PCB);

a plurality of second conductive pads conforming to a second interconnection geometry, the plural of second conductive pads configured for connection to, and contoured with, a feed board configured for providing energy to the at least one antenna element, wherein the feed board curves according to at least one axis;

a plurality of conductive vias, each conductive via connecting a first conductive pad to a corresponding second conductive pad, each conductive via configured for conveying energy between the feed board and the at least one antenna element;

and

at least one rigid interposer disposed between the PCB and the feed board, each rigid interposer fashioned of at least one dielectric material and configured for:

insulating at least one conductive via;

and

physically bridging at least two conductive vias.

2 . The conformal interposer assembly of claim 1 , wherein the at least one PCB defines a plane.

3 . The conformal interposer assembly of claim 2 , wherein the feed board curves according to at least two axes.

4 . The conformal interposer assembly of claim 1 , wherein the second interconnection geometry is at least one of cylindrical, paraboloid, hyperboloid, or ellipsoid.

5 . The conformal interposer assembly of claim 1 , wherein the at least one feed board is a single feed board comprising a plurality of segments, wherein each segment curves according to at least one axis.

6 . The conformal interposer assembly of claim 1 , wherein the at least one rigid interposer is a single rigid interposer physically bridging the plurality of conductive vias.

7 . The conformal interposer assembly of claim 1 , wherein:

the first interconnection geometry and the second interconnection geometry are mutually conformal;

and

neither the first interconnection geometry nor the second interconnection geometry is planar.

8 . The conformal interposer assembly of claim 1 , wherein the conveyed energy includes at least one of:

RF energy transmitted by the at least one antenna element;

RF energy received by the at least one antenna element;

control signals;

or

power signals.

9 . The conformal interposer assembly of claim 1 , wherein:

the plurality of first conductive pads is a plurality of N first conductive pads, wherein N is a positive integer;

the plurality of second conductive pads is a plurality of N second conductive pads;

and

the plurality of conductive vias is a plurality of N conductive vias.

10 . A conformal electronically scanned array (ESA) assembly, comprising:

at least one printed circuit board (PCB) conformal to a first interconnecting geometry;

a plurality of antenna elements coupled to the at least one PCB, each antenna element configured for transmission of radio frequency (RF) energy and reception of reflected RF energy;

a plurality of first conductive pads conformal to the first interconnecting geometry, each first conductive pad conductively coupled to at least one antenna element via the at least one PCB;

at least one feed board conformal to a second interconnecting geometry, the at least one feed board configured to transmit energy to the plurality of antenna elements and to receive the reflected RF energy from the plurality of antenna elements, wherein the at least one feed board curves according to at least one axis;

a plurality of second conductive pads conformal to the second interconnecting geometry, each second conductive pad conductively coupled to the at least one feed board;

a plurality of conductive vias, each conductive via conductively connecting a first conductive pad to a corresponding second conductive pad, each conductive via configured for conveying energy between the feed board and the at least one antenna element;

and

at least one rigid interposer disposed between the at least one feed board and the at least one PCB, the at least one rigid interposer fashioned of at least one dielectric material and configured for:

insulating at least one conductive via;

and

physically bridging at least two conductive vias.

11 . The conformal ESA of claim 10 , wherein the at least one PCB defines a plane.

12 . The conformal ESA of claim 11 , wherein the at least one feed board curves according to at least two axes.

13 . The conformal ESA of claim 10 , wherein the second interconnection geometry is at least one of cylindrical, paraboloid, hyperboloid, or ellipsoid.

14 . The conformal ESA of claim 10 , wherein the at least one feed board is a single feed board comprising a plurality of segments, wherein each segment curves according to at least one axis.

15 . The conformal ESA of claim 10 , wherein the at least one rigid interposer is a single rigid interposer physically bridging the plurality of conductive vias.

16 . The conformal ESA of claim 10 , wherein:

the first interconnection geometry and the second interconnection geometry are mutually conformal;

and

neither the first interconnection geometry nor the second interconnection geometry is planar.

17 . The conformal ESA of claim 10 , wherein the conveyed energy includes at least one of:

RF energy transmitted by the at least one antenna element;

reflected RF energy received by the at least one antenna element;

control signals;

or

power signals.

18 . The conformal ESA of claim 10 , wherein:

the plurality of first conductive pads is a plurality of N first conductive pads, wherein N is a positive integer;

the plurality of second conductive pads is a plurality of N second conductive pads;

and

the plurality of conductive vias is a plurality of N conductive vias.

Assignments (1)

References Cited (27)