Microelectromechanical system oven-controlled oscillator
A microelectromechanical system (MEMS) device is provided with partitioning for thermal management. In one illustrative embodiment, the device may include: a heated section including a first die and a second die, wherein: the first die includes a heater, and the second die is coupled to the first die and includes a temperature sensor and a MEMS resonator; and a non-heated section communicatively coupled to the heated section and including a third die. The third die may receive a first signal associated with the temperature sensor and provides a second signal to the first die associated with the heater based on the first signal.
1 . A device comprising:
a heated section including a first die and a second die, wherein:
the first die includes a heater, and
the second die is coupled to the first die and includes a temperature sensor and a microelectromechanical system (MEMS) resonator; and
a non-heated section electrically coupled to the heated section and including a third die, wherein:
the third die receives a first signal associated with the temperature sensor and provides a second signal to the first die associated with the heater based on the first signal to maintain the heated section at a predetermined temperature, wherein
the first die further includes a sustaining circuit coupled to the resonator, and
the third die receives a third signal associated with the sustaining circuit and generates a periodic signal using temperature compensation.
2 . The device of claim 1 , wherein the first die further includes a heater driver, the heater driver controlling the amount of heat generated by heater using the second signal.
3 . The device of claim 1 , wherein the third die further includes a communications port, the communications port receiving configuration information for the temperature compensation.
4 . The device of claim 1 , wherein at least one of the first die, the second die, and the third die comprise silicon.
5 . The device of claim 1 , wherein the temperature sensor comprises at least one of a MEMS resonator, resistance temperature detector, and a bipolar junction.
6 . The device of claim 1 , wherein the heater comprises at least one of a diffused resistor, ion-implanted resistor, thin-film resistor, polysilicon resistor, and transistor.
7 . The device of claim 1 , wherein the non-heated section has a lower thermal resistance to an ambient temperature than the heated section.
8 . The device of claim 1 , wherein the non-heated section is thermally separated from the heated section.
9 . A device comprising:
a substrate;
a first package coupled to the substrate, the first package comprising:
a first die including at least one heater, and
a second die coupled to the first die and including a temperature sensor and a resonator;
a second package coupled to the substrate, the second package comprising:
a third die receiving a first signal associated with the temperature sensor and providing a second signal associated with the at least one heater based on the first signal; and
a cover disposed over the substrate, first package, and second package, wherein
the first die further includes a sustaining circuit coupled to the resonator, and
the third die receives a third signal associated with the sustaining circuit and generates a periodic signal using temperature compensation.
10 . The device of claim 9 , wherein each of the first package and the second package is at least one of a ceramic package, a plastic package, and a metal package.
11 . The device of claim 9 , wherein the first package has a higher thermal resistance to an ambient temperature than the second package.
12 . The device of claim 9 , wherein the first package further comprises an insulator disposed between the first die and a portion of the first package.
13 . The device of claim 12 , wherein the insulator comprises at least one of glass and ceramic.
14 . The device of claim 9 , wherein the substrate is a printed circuit board.
15 . The device of claim 14 , wherein the substrate comprises at least one of aluminum, copper, phenolic paper, woven fiberglass, ceramic, polyimide foil, and polyimide-fluoropolymer composite foil.
16 . The device of claim 9 , wherein the cover comprises at least one of plastic and metal.
17 . A device comprising:
a substrate;
a first package coupled to the substrate, the first package comprising:
an insulator coupled to the first package and a first semiconductor die,
the first semiconductor die including at least one heater and a sustaining circuit, and
a second semiconductor die coupled to the first semiconductor die and including a temperature sensor and a microelectromechanical system (MEMS) resonator; and
a second package coupled to the substrate, the second package comprising:
a third semiconductor die
receiving a first signal associated with the temperature sensor and a second signal associated with the sustaining circuit,
providing a third signal to the first die associated with the at least one heater based on the first signal, and
generating a fourth signal based on the second signal using temperature compensation.
18 . The device of claim 17 , wherein:
dimensions of the insulator are smaller than dimensions of the first die,
the first package is hermetically sealed and coupled to a first surface of the substrate, and
the second package is coupled to a second surface of the substrate.