IP Library › Granted Patent US 12,507,341
Granted Patent B2
US 12,507,341 · App. 17/775,789 · Granted Dec 23, 2025

Wiring circuit board and producing method thereof

Inventors: Rihito Fukushima (Osaka, JP); Shusaku Shibata (Osaka, JP)
Assignee: NITTO DENKO CORPORATION
H05K1/0296
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Quick Facts
Patent No.
US 12,507,341
App. No.
17/775,789
Granted
Dec 23, 2025
Kind
B2
Abstract

A wiring circuit board includes a base insulating layer, a first wiring layer disposed at one side in a thickness direction of the base insulating layer, and a cover insulating layer disposed on one surface in the thickness direction of the base insulating layer so as to cover the first wiring layer. The first wiring layer includes a first wiring portion in contact with one surface of the base insulating layer, and a second wiring portion in contact with one surface in the thickness direction of the first wiring portion. Both end surfaces in a width direction perpendicular to the thickness direction and a transmission direction of the second wiring portion are disposed inside in the width direction with respect to both end surfaces of the first wiring portion.

Claims (31)

1 . A wiring circuit board comprising:

a base insulating layer, a wiring layer disposed at a one-side surface of the base insulating layer in a thickness direction, and a cover insulating layer made of an insulating resin and disposed on the one-side surface of the base insulating layer in the thickness direction of the base insulating layer so as to cover the wiring layer,

wherein the wiring layer includes:

a first wiring portion having a first surface in contact with the one-side surface of the base insulating layer, and a second surface opposite to the first surface in a thickness direction of the first wiring portion, and

a second wiring portion in contact with the second surface of the first wiring portion,

both end surfaces in a width direction perpendicular to the thickness direction and a transmission direction of the second wiring portion, wherein both the end surfaces are disposed within both end surfaces of the first wiring portion in the width direction, and

a step formed from the first wiring portion and the second wiring portion in each of both end portions in the width direction of the wiring portion,

a third wiring portion in contact with the one-side surface of the base insulating layer in the thickness direction, and

a fourth wiring portion spaced apart from the third wiring portion in the thickness direction from the third wiring portion, and

wherein the cover insulating layer covers the step.

2 . The wiring circuit board according to claim 1 , wherein

a ratio (T 2 /T 1 ) of a thickness T 2 of the second wiring portion to a thickness T 1 of the first wiring portion is 0.7 or more and 3.0 or less.

3 . The wiring circuit board according to claim 1 , wherein the wiring layer includes:

a first pattern portion including the first wiring portion and the second wiring portion, and

a second pattern portion including the third wiring portion and the fourth wiring portion, and independent of the first pattern portion.

4 . The wiring circuit board according to claim 2 , wherein the wiring layer includes:

a first pattern portion including the first wiring portion and the second wiring portion, and

a second pattern portion including the third wiring portion and the fourth wiring portion, and independent of the first pattern portion.

5 . A method for producing the wiring circuit board according to claim 3 , the method comprising:

forming a base insulating layer,

forming a first wiring portion and a third wiring portion,

simultaneously forming a second wiring portion and a fourth wiring portion, and

forming a cover insulating layer.

6 . A method for producing the wiring circuit board according to claim 4 , the method comprising:

forming a base insulating layer,

forming a first wiring portion and a third wiring portion,

simultaneously forming a second wiring portion and a fourth wiring portion, and forming a cover insulating layer.

7 . The wiring circuit board according to claim 1 , wherein a width of the third wiring portion is a same as a width of the second wiring portion.

8 . The wiring circuit board according to claim 2 , wherein a width of the third wiring portion is a same as a width of the second wiring portion.

9 . The wiring circuit board according to claim 7 , wherein a width of the fourth wiring portion is a same as a width of the third wiring portion.

10 . The wiring circuit board according to claim 8 , wherein a width of the fourth wiring portion is a same as a width of the third wiring portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2022
From: FUKUSHIMA, RIHITO; SHIBATA, SHUSAKU
To: NITTO DENKO CORPORATION
Reel/Frame 060981/0366 →
Priority Claims (1)
JP 2019-204943 · Nov 12, 2019 · national
Continuity (1)
Related Publication 20220386458A1 · Dec 1, 2022
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