Apparatus and method for manufacturing display device
A manufacturing apparatus of a display device, includes: a first unit to transfer a plurality of light emitting elements on a growth substrate to a first film; a second unit to expand the first film; a third unit to retransfer the plurality of light emitting elements to a second film; a fourth unit to determine positions of the plurality of light emitting elements on the second film; a fifth unit to bin the light emitting elements on the second film, and determine an effective light source from among the light emitting elements; a sixth unit to form a plurality of pixels on a substrate, each pixel including a first bonding electrode; a seventh unit to remove the second film after transferring one light emitting element to the first bonding electrode of one pixel; and an eighth unit to form a second electrode on the one light emitting element.
1 . A manufacturing apparatus of a display device, comprising:
a first unit configured to transfer a plurality of light emitting elements on a growth substrate to a first film;
a second unit configured to expand the first film to space each of the plurality of light emitting elements on the first film from adjacent light emitting elements from among the plurality of light emitting elements;
a third unit configured to retransfer the plurality of light emitting elements to a second film;
a fourth unit configured to determine positions of the plurality of light emitting elements by irradiating a guide laser beam to the plurality of light emitting elements on the second film, and generating, with an image sensor of the fourth unit, a sensing signal corresponding to light received through the second film, the sensing signal being used by the fourth unit to determine the positions of the plurality of light emitting elements;
a fifth unit configured to bin the plurality of light emitting elements on the second film, and to determine an effective light source from among the plurality of light emitting elements; and
a seventh unit configured to control a position of a laser shot based on the sensing signal to irradiate a laser beam toward the effective light source to separate the effective light source from the second film.
2 . The manufacturing apparatus of claim 1 , further comprising:
a sixth unit configured to form a plurality of pixels on a substrate, each of the plurality of pixels comprising one or more transistors, a first electrode electrically connected to a transistor from among the one or more transistors, and a first bonding electrode on the first electrode;
the seventh unit configured to remove the second film after transferring one light emitting element corresponding to the effective light source of the plurality of light emitting elements to the first bonding electrode of one pixel of the plurality of pixels by irradiating the laser beam using the laser shot; and
an eighth unit configured to form a second electrode on the one light emitting element.
3 . The manufacturing apparatus of claim 2 , wherein
each of the plurality of light emitting elements comprises a first end portion and a second end portion in a length direction,
wherein the first end portion is configured to contact the first bonding electrode on the first electrode to be electrically connected to the first electrode, and
wherein the second end portion is configured to contact the second electrode to be electrically connected to the second electrode.
4 . The manufacturing apparatus of claim 3 , wherein each of the plurality of light emitting elements comprises:
a second bonding electrode located at the first end portion, and configured to contact the first bonding electrode to be electrically connected to the first bonding electrode;
an auxiliary layer located at the second end portion, and configured to contact the second electrode to be electrically connected to the second electrode;
a second semiconductor layer located on the second bonding electrode;
a first semiconductor layer located between the auxiliary layer and the second semiconductor layer; and
an active layer located between the first semiconductor layer and the second semiconductor layer, and
wherein the first semiconductor layer is an N-type semiconductor layer doped with an N-type dopant, and the second semiconductor layer is a P-type semiconductor layer doped with a P-type dopant.
5 . The manufacturing apparatus of claim 4 , wherein:
the first end portion of each of the plurality of light emitting elements contacts the first film in the first unit; and
the first unit is configured to separate the second end portion of each of the plurality of light emitting elements from the growth substrate to be exposed.
6 . The manufacturing apparatus of claim 4 , wherein:
the first film includes an expandable material, and comprises a first bonding layer, and a first base substrate on the first bonding layer;
the first bonding layer contacts the second end portion of each of the plurality of light emitting elements, and includes a material having an adhesiveness; and
the first base substrate supports the plurality of light emitting elements contacting the first bonding layer, and includes at least one of polyolefin, polyvinyl chloride (PVC), elastomeric silicone, elastomeric polyurethane, or elastomeric polyisoprene.
7 . The manufacturing apparatus of claim 4 , wherein the fourth unit comprises an image sensor, and
wherein the fourth unit is configured to determine positions of the plurality of light emitting elements depending on whether the guide laser beam irradiated to the plurality of light emitting elements and the second film flows to the image sensor.
8 . The manufacturing apparatus of claim 7 , wherein:
each of the plurality of light emitting elements further comprises a reflective electrode between the second semiconductor layer and the second bonding electrode; and
the reflective electrode is configured to reflect the guide laser beam irradiated to the plurality of light emitting elements to prevent the guide laser beam from passing through the second film on which the plurality of light emitting elements are located.
9 . The manufacturing apparatus of claim 7 , wherein
the seventh unit is configured to bond the first bonding electrode of the one pixel and the second bonding electrode of the one light emitting element to each other.
10 . The manufacturing apparatus of claim 9 , wherein:
the second end portion of the one light emitting element is exposed in the eighth unit; and
the eighth unit is configured to form a bank covering a portion of the one light emitting element, and form the second electrode on the bank.
11 . The manufacturing apparatus of claim 10 , wherein
the seventh unit is configured to transfer the one light emitting element to the first bonding electrode of the one pixel by one laser shot.
12 . The manufacturing apparatus of claim 4 , wherein:
each of the plurality of pixels includes an emission area in which one light emitting element is to be located, and a non-emission area adjacent to the emission area;
the eighth unit is configured to form an upper substrate on the second electrode of each of the pixels; and
the upper substrate comprises:
a light conversion pattern layer located at an upper portion of the second electrode to correspond to the emission area of a corresponding pixel from among the plurality of pixels; and
a light blocking pattern located at an upper portion of the second electrode to correspond to the non-emission area of the corresponding pixel from among the plurality of pixels.