IP Library › Granted Patent US 12,512,574
Granted Patent B2
US 12,512,574 · App. 18/072,516 · Granted Dec 30, 2025

Waveguide components of waveguides formed with additive manufacturing

Inventors: James Benedict (Chelmsford, MA); Lawrence A. Binek (Glastonbury, CT); Erika Klek (Medford, MA)
Assignee: Raytheon Company
H01P3/18H01P3/20H01P5/20H01P11/001
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,512,574
App. No.
18/072,516
Granted
Dec 30, 2025
Kind
B2
Abstract

A radio frequency (“RF”) waveguide device fabricated by additive manufacturing is provided that includes a RF channel comprising a wall and a RF component comprising an unsupported span extending from the wall of the RF channel. The unsupported span can include at least one unsupported surface extending from the wall at an oblique angle relative to the wall. The RF component formed in this manner with additive manufacturing does not negatively impact the RF performance of the RF waveguide.

Claims (15)

1 . A method, for forming a radio frequency (“RF”) waveguide device by additive manufacturing, the method comprising:

fabricating a RF channel comprising at least one wall; and

fabricating a RF component comprising an unsupported span extending from the at least one wall of the RF channel, wherein the unsupported span is formed at least in part by building up a first unsupported surface to extend from one of the at least one wall at a first oblique angle relative to the angle and a second unsupported surface to extend from one of the at least one wall at a second oblique angle, wherein the first and second unsupported surfaces join together at an apex between the first and second unsupported surfaces,

wherein the unsupported span is fabricated without the use of an underlying supporting structure, wherein the unsupported span is completed using additive manufacturing without post processing machining,

wherein the RF component comprises a waveguide splitter disposed within a horn section of the RF channel, and wherein the first and second unsupported surfaces join together to form a chevron profile on the waveguide splitter.

2 . The method of claim 1 , wherein the unsupported surface is fabricated with a surface finish with a Ra of less than 250 micro inches.

3 . The method of claim 1 , wherein the first oblique angle and the second oblique angle are is between 25 degrees and 65 degrees relative to the the at least one wall.

4 . The method of claim 1 , wherein the first oblique angle is equal to the second oblique angle.

5 . The method of claim 1 , wherein the at least one wall includes a first wall and a second wall, wherein the first unsupported surface extends from the first wall and the second unsupported surface extends from the second wall and are joined together at the apex between the first and second walls.

6 . A method, for forming a radio frequency (“RF”) waveguide device by additive manufacturing, the method comprising:

fabricating a RF channel comprising at least one wall; and

fabricating a RF component comprising an unsupported span extending from the at least one wall of the RF channel, wherein the unsupported span is formed at least in part by building up at least one unsupported surface to extend from the at least one wall at an oblique angle relative to the wall,

wherein the unsupported span is fabricated without the use of an underlying supporting structure, wherein the unsupported span is completed using additive manufacturing without post processing machining,

wherein the at least one unsupported surface is fabricated in an arced profile on the unsupported span.

7 . The method of claim 6 , wherein the at least one wall includes a first wall and a second wall, wherein the unsupported span is formed at least in part by building up a first unsupported surface to extend from the first wall and building up a second unsupported surface to extend from the second wall that join together at an apex between the first and second unsupported surfaces, wherein the first and second unsupported surfaces form the arced profile on the unsupported span.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2023
From: BENEDICT, JAMES; KLEK, ERIKA
To: RAYTHEON COMPANY
Reel/Frame 064275/0760 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2023
From: BINEK, LAWRENCE A.
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 064275/0784 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2023
From: RAYTHEON TECHNOLOGIES CORPORATION
To: RAYTHEON COMPANY
Reel/Frame 064275/0803 →
Continuity (2)
Provisional Application 63295441 · Dec 30, 2021
Related Publication 20230216170A1 · Jul 6, 2023
References Cited (25)
US 4167715A · Ohm · 1979 [cited by applicant]
US 10490899B2 · Wilson et al. · 2019 [cited by applicant]
US 10573949B2 · Fluitt et al. · 2020 [cited by applicant]
US 10833382B2 · Sysouphat · 2020 [cited by applicant]
US 10862186B2 · De Rijk et al. · 2020 [cited by applicant]
US 10985448B2 · Bongard et al. · 2021 [cited by applicant]
US 11031669B2 · De Rijk et al. · 2021 [cited by applicant]
US 11128034B2 · Hollenbeck et al. · 2021 [cited by applicant]
US 20190190161A1 · Hollenbeck et al. · 2019 [cited by applicant]
US 20200194860A1 · Hollenbeck et al. · 2020 [cited by applicant]
US 20200274215A1 · Morris et al. · 2020 [cited by applicant]
US 20220190460A1 · Binek · 2022 [cited by examiner]
US 20220258244A1 · Benedict · 2022 [cited by examiner]
CN 209389219U · 2019 [cited by applicant]
EP 3664216A1 · 2020 [cited by applicant]
FR 3087954A1 · 2020 [cited by applicant]
SU 327869A1 · 1980 [cited by applicant]
WO WO2017203568A1 · 2017 [cited by applicant]
WO WO2021005554A1 · 2021 [cited by applicant]
WO WO2021009667A1 · 2021 [cited by applicant]
Sun et al., Millimeter-Wave Magneto-Electric Dipole Antenna Array With a Self-Supporting Geometry for Time-Saving Metallic 3-D Printing, IEEE Transactions on Antennas and Propagation, Aug. 18, 2020, pp. 7822-7832, vol. … [cited by applicant]
Zhao et al., Fully 3-D-Printed Frequency-Scanning Slotted Waveguide Array With Wideband Power-Divider, IEEE Antennas and Wireless Propagation Letters, Dec. 1, 2019, pp. 2756-2760, vol. 18, No. 12, Institute of Electrica… [cited by applicant]
International Search Report for International Application No. PCT/US2022/051437 dated Mar. 20, 2023, 28 pages. [cited by applicant]
Calignano et al., Accuracy of complex internal channels produced by laser powder bed fusion process, Journal of Manufacturing Processes, Jun. 2020, 2 pages, vol. 54, Elsevier, Netherlands. [cited by applicant]
Calignano et al., High-performance microwave waveguide devices produced by laser powder bed fusion process, Procedia CIRP, 2019, pp. 85-88, vol. 79, Elsevier, Netherlands. [cited by applicant]