Acoustic resistance improvement in piezoelectric microelectromechanical system microphone using compliant joint
A piezoelectric microelectromechanical system microphone comprises a support substrate, a cantilever sensing element including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the cantilever sensing element the cantilever sensing element divided into a plurality of cantilevers having gaps between side edges of adjacent cantilevers, and a compliant material disposed in at least a portion of the gaps between adjacent cantilevers to improve the performance of the piezoelectric microelectromechanical system microphone.
1 . A piezoelectric microelectromechanical system microphone comprising:
a support substrate;
a membrane including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the membrane, the membrane divided into a plurality of cantilevers having gaps between side edges of adjacent cantilevers, the membrane including an uppermost electrode disposed on an uppermost surface of the piezoelectric material and a lowermost electrode disposed on a lowermost surface of the piezoelectric material; and
a compliant material disposed in at least a portion of the gaps between the adjacent cantilevers to improve performance of the piezoelectric microelectromechanical system microphone, the compliant material extending continuously vertically through the portion of the gaps between the adjacent cantilevers from a lower plane defined by a lower surface of the lowermost electrode to an upper plane defined by an upper surface of the uppermost electrode, all surfaces of the membrane above the uppermost electrode and below the lowermost electrode being free of the compliant material, a ventilation hole defined at a center of the membrane and portions of the gaps between the adjacent cantilevers extending radially outward from the ventilation hole being free of the compliant material.
2 . The piezoelectric microelectromechanical system microphone of claim 1 wherein the compliant material is disposed within between 50% and 90% of a total area of the gaps between the adjacent cantilevers.
3 . The piezoelectric microelectromechanical system microphone of claim 1 wherein the compliant material is a polymeric material.
4 . The piezoelectric microelectromechanical system microphone of claim 3 wherein the compliant material includes one of polydimethylsiloxane, silicone glue, resin, or epoxy.
5 . The piezoelectric microelectromechanical system microphone of claim 3 wherein the compliant material has a profile that decreases in thickness from edges of the adjacent cantilevers toward centers of the gaps between the adjacent cantilevers.
6 . The piezoelectric microelectromechanical system microphone of claim 3 wherein the compliant material has a profile defining a notch about centers of the gaps between the adjacent cantilevers.
7 . The piezoelectric microelectromechanical system microphone of claim 3 wherein the compliant material is in a form of a film coupled to one of fronts or rears of side edges of the adjacent cantilevers.
8 . The piezoelectric microelectromechanical system microphone of claim 7 wherein the film is corrugated.
9 . The piezoelectric microelectromechanical system microphone of claim 1 wherein the compliant material is a metal film.
10 . The piezoelectric microelectromechanical system microphone of claim 9 wherein the film is coupled to one of fronts or rears of side edges of the adjacent cantilevers.
11 . The piezoelectric microelectromechanical system microphone of claim 9 wherein the film is corrugated.
12 . The piezoelectric microelectromechanical system microphone of claim 1 exhibiting a −3 dB roll-off frequency of about 20 Hz or less.
13 . An electronics device module including the piezoelectric microelectromechanical system microphone of claim 1 .
14 . An electronic device including the electronic device module of claim 13 .
15 . A telephone including the electronic device module of claim 13 .
16 . A method of forming a piezoelectric microelectromechanical system microphone, the method comprising:
attaching a membrane including a piezoelectric material to a support substrate, the membrane configured to deform and generate an electrical potential responsive to impingement of sound waves on the membrane, the membrane divided into a plurality of cantilevers having gaps between side edges of adjacent cantilevers, the membrane including an uppermost electrode disposed on an uppermost surface of the piezoelectric material and a lowermost electrode disposed on a lowermost surface of the piezoelectric material; and
disposing a compliant material in at least a portion of the gaps between the adjacent cantilevers to improve performance of the piezoelectric microelectromechanical system microphone, the compliant material extending continuously vertically through the portion of the gaps between the adjacent cantilevers from a lower plane defined by a lower surface of the lowermost electrode to an upper plane defined by an upper surface of the uppermost electrode, all surfaces of the membrane above the uppermost electrode and below the lowermost electrode being free of the compliant material, a ventilation hole defined at a center of the membrane and portions of the gaps between the adjacent cantilevers extending radially outward from the ventilation hole being free of the compliant material.
17 . The method of claim 16 wherein the compliant material is disposed within between 50% and 90% of the total area of the gaps between the adjacent cantilevers.
18 . The method of claim 16 wherein the compliant material is a polymeric material.