Heat-dissipation holder and protective case for electronic equipment
A heat dissipation holder and a protective case for electronic equipment are provided. Both the heat dissipation holder and the protective case are provided with a heat dissipation gel structure. By providing a heat dissipation gel structure that not only contacts the electronic device but also communicates with outside air, a large and effective heat dissipation and temperature reduction of the electronic device can be achieved, and excellent heat dissipation and safety protection of the device can be realized.
1 . A protective case for electronic equipment, which is mounted on the exterior of an electronic device, comprising:
a case body and a heat dissipation gel structure; the case body defining a receiving groove for accommodating the electronic device, and the heat dissipation gel structure being disposed in the receiving groove; a first ventilation structure being defined on at least part of the region of the case body on which the heat dissipation gel structure is disposed, and the heat dissipation gel structure being communicated with ambiance through the first ventilation structure
wherein the protective case for electronic equipment further comprises a magnetic attraction member disposed on the case body; a groove extending along thickness direction of the case body being defined at a position of the case body on which the heat dissipation gel structure is disposed, and the magnetic attraction member is accommodated in the groove; the magnetic attraction member being a ring magnet.
2 . The protective case for electronic equipment according to claim 1 , wherein the area of the first ventilation structure accounts for 20%-70% of plane area of the case body.
3 . The protective case for electronic equipment according to claim 1 , wherein at least one support block is provided on one side of the case body away from the heat dissipation gel structure.
4 . The protective case for electronic equipment according to claim 1 , wherein the heat dissipation gel structure is a flexible material, and the hardness of the case body is greater than that of the heat dissipation gel structure.
5 . The protective case for electronic equipment according to claim 1 , wherein the heat dissipation gel structure comprises a flexible heat conduction layer, a flexible heat dissipation layer and a flexible protective layer; and/or the heat dissipation gel structure comprising the flexible heat conduction layer in contact with the electronic device and/or the flexible heat dissipation layer containing heat dissipation hydrogel and/or the air-permeable, waterproof and dust-proof flexible protective layer.
6 . The protective case for electronic equipment according to claim 5 , wherein the area of the flexible heat conduction layer or the flexible protective layer is greater than or equal to the area of the flexible heat dissipation layer; or the flexible protective layer defining a second ventilation structure; aperture of the second ventilation structure is smaller than aperture of the first ventilation structure on the case body.
7 . The protective case for electronic equipment according to claim 1 , wherein the thickness of the magnetic attraction member being less than or equal to the depth of the groove; or the heat dissipation gel structure covering bottom of the receiving groove; the first ventilation structure being not provided on the groove, and the first ventilation structure being provided at the bottom of the receiving groove corresponding to the heat dissipation gel structure except the region where the groove is defined.
8 . The protective case for electronic equipment according to claim 1 , wherein the magnetic attraction member is disposed between the case body and the heat dissipation gel structure, and the magnetic field of the magnetic attraction member passes through the heat dissipation gel structure to magnetically attract the electronic device.
9 . The protective case for electronic equipment according to claim 5 , wherein thickness of the flexible heat conduction layer is in the range of 0.1-0.5 mm, thickness of the flexible heat dissipation layer is in the range of 0.5-0.7 mm, and thickness of the flexible protective layer is in the range of 0.1-0.3 mm; or thickness of the heat dissipation gel structure is in the range of 1.0-1.2 mm.
10 . The protective case for electronic equipment according to claim 1 , wherein the reducing temperature of the protective case for electronic equipment to the surface of the electronic device that generates heat is in the range of 1-6° C.
11 . The protective case for electronic equipment according to claim 1 , wherein the protective case for electronic equipment is used for mobile phones, iPads, PDAs, notebook computers or other small electronic devices.