Electronic control device with resin case
An object of the present invention is to provide an electronic control device that can be improved in EMC resistance when a resin case is used without using a metal case. An electronic control device of the present invention includes: a substrate 101 ; an electronic component 302 disposed on an electronic component mounting surface 101 a of the substrate 101 ; and a resin case 100 that houses the substrate 101 . The case 100 includes a conductive member 102 on a surface facing the electronic component mounting surface 101 a of the substrate 101 . The substrate 101 includes a plurality of conductive surface-mounted members 301 mounted on the electronic component mounting surface 101 a to surround the electronic component 302 . The plurality of conductive surface-mounted members 301 are arranged to be separated from each other on the electronic component mounting surface 101 a and form electrical shielding by coming into contact with the conductive member 102.
1 . An electronic control device comprising: a substrate; an electronic component disposed on an electronic component mounting surface of the substrate; and a resin case that houses the substrate,
wherein the case includes a conductive member on a surface facing the electronic component mounting surface of the substrate,
the substrate includes a plurality of conductive surface-mounted members mounted on the electronic component mounting surface to surround the electronic component, and
the plurality of conductive surface-mounted members are arranged to be separated from each other on the electronic component mounting surface and form electrical shielding by coming into contact with the conductive member.
2 . The electronic control device according to claim 1 , wherein an arrangement interval of the plurality of conductive surface-mounted members is smaller than λ/2 with respect to a wavelength λ of a noise component emitted by the electronic component.
3 . The electronic control device according to claim 1 , wherein
one or more projecting portions are formed by projecting from a facing surface of the case which faces the electronic component mounting surface, and
a projecting height of the one or more projecting portions gradually increases from a front side to a back side in an insertion direction of the substrate.
4 . The electronic control device according to claim 3 , wherein a cross-sectional area of the projecting portion perpendicular to the insertion direction decreases in a direction opposite to the insertion direction.
5 . The electronic control device according to claim 4 , wherein the projecting portion has a tapered shape, and a front end of the projecting portion in a projecting direction is brought into contact with the conductive surface-mounted member.
6 . The electronic control device according to claim 5 , wherein the projecting portion has a semi-conical shape, and a front end of the projecting portion in a projecting direction is brought into contact with the conductive surface-mounted member.
7 . The electronic control device according to claim 4 , wherein the projecting portion has a semi-cylindrical shape, and a front end of the projecting portion in a projecting direction is brought into contact with the conductive surface-mounted member.
8 . The electronic control device according to claim 3 , wherein the plurality of conductive surface-mounted members are arranged so as not to overlap each other in a width direction parallel to the electronic component mounting surface of the substrate and perpendicular to the insertion direction.
9 . The electronic control device according to claim 3 , wherein
a number of the one or more plurality of the projecting portions is equal to a number of the conductive surface-mounted members, and
an inclination of a surface of a first projecting portion of the one or more projecting portions is steeper than an inclination of a surface of each of the other projecting portions, wherein the surface of the first projecting portion is in contact with the conductive surface-mounted member.
10 . The electronic control device according to claim 9 , wherein a pad of the substrate to which the conductive surface-mounted member is in contact with the first projecting portion is electrically connected to a connector by a signal line.
11 . The electronic control device according to claim 1 , wherein
a region of the conductive member which is not in contact with the conductive surface-mounted member is punched, and
a diameter of a pit opened is smaller than λ/2 with respect to a wavelength λ of a noise component.
12 . The electronic control device according to claim 1 , wherein the conductive member is a metal plate.
13 . The electronic control device according to claim 1 , wherein the conductive member is made of a conductive resin.