Semiconductor device
A semiconductor device includes a semiconductor channel layer and a semiconductor barrier layer disposed on a substrate. A passivation layer covers the semiconductor barrier layer. A first gate electrode and a second gate electrode are laterally separated from each other and at least partially disposed in the passivation layer respectively. Along a first direction, a first gate length of the first gate electrode is less than a second gate length of the second gate electrode. A source electrode and a drain electrode are disposed on the semiconductor channel layer. The second gate electrode is electrically connected to the source electrode. The first gate electrode and the second gate electrode are electrically isolated from each other.
1 . A semiconductor device, comprising:
a semiconductor channel layer and a semiconductor barrier layer, disposed on a substrate;
a passivation layer, covering the semiconductor barrier layer;
a first gate electrode and a second gate electrode, laterally separated from each other, and at least a portion of the first gate electrode and at least a portion of the second gate electrode respectively disposed in the passivation layer, wherein along a first direction, a first gate length of the first gate electrode is less than a second gate length of the second gate electrode;
a source electrode and a drain electrode, disposed on the semiconductor channel layer, wherein the second gate electrode is electrically connected to the source electrode, and the first gate electrode and the second gate electrode are electrically isolated from each other; and
a gate dielectric layer, disposed between the first gate electrode and the semiconductor barrier layer, and disposed between the second gate electrode and the semiconductor barrier layer,
wherein the first gate electrode fills up a first trench in the passivation layer, the second gate electrode fills up a second trench in the passivation layer, and the gate dielectric layer is disposed in both the first trench and the second trench.
2 . The semiconductor device of claim 1 , wherein the first gate length is in a range of 0.1 micrometers (μm) to 2 μm.
3 . The semiconductor device of claim 1 , wherein the second gate length is in a range of greater than 2 μm to 5 μm.
4 . The semiconductor device of claim 1 , wherein the first gate electrode is located between the source electrode and the second gate electrode, and the second gate electrode is located between the first gate electrode and the drain electrode.
5 . The semiconductor device of claim 1 , wherein the gate dielectric layer is further conformally disposed on a top surface of the passivation layer.
6 . The semiconductor device of claim 1 , wherein the composition of the passivation layer comprises silicon nitride, and the composition of the gate dielectric layer comprises silicon oxide, silicon nitride, yttrium oxide, yttrium titanium oxide, ytterbium oxide, hafnium oxide, zirconium oxide, titanium oxide, aluminum oxide, tantalum oxide or a combination thereof.
7 . The semiconductor device of claim 1 , wherein the first gate electrode constitutes a gate of a normally-off transistor, the second gate electrode constitutes a gate of a normally-on transistor, and a drain of the normally-off transistor is electrically connected to a source of the normally-on transistor.
8 . The semiconductor device of claim 7 , wherein a withstand voltage of the normally-on transistor is greater than or equal to 600 volts.
9 . The semiconductor device of claim 1 , wherein a first distance between the first gate electrode and the source electrode is less than a second distance between the second gate electrode and the drain electrode.
10 . The semiconductor device of claim 9 , wherein a third distance between the first gate electrode and the second gate electrode is in a range of 2 μm to 4 μm, and the first distance is in a range of 2 μm to 4 μm.
11 . The semiconductor device of claim 1 , wherein the semiconductor barrier layer has a flat top surface, and the first gate electrode and the second gate electrode are disposed on the flat top surface.
12 . The semiconductor device of claim 1 , wherein the first gate electrode comprises a first portion in the passivation layer and a second portion above the passivation layer, the second gate electrode comprises a third portion in the passivation layer and a fourth portion above the passivation layer, the second portion and the fourth portion are laterally separated from each other, and along the first direction, a length of the second portion is less than a length of the fourth portion.
13 . The semiconductor device of claim 1 , wherein the composition of the semiconductor channel layer comprises gallium nitride (GaN), and the composition of the semiconductor barrier layer comprises aluminum gallium nitride (AlGaN).
14 . The semiconductor device of claim 1 , wherein the first gate electrode and the second gate electrode have the same composition.
15 . The semiconductor device of claim 1 , wherein the first gate electrode and the second gate electrode have different compositions.
16 . The semiconductor device of claim 1 , wherein the second gate electrode, the source electrode and the drain electrode have the same composition.
17 . The semiconductor device of claim 1 , wherein the source electrode and the second gate electrode are electrically coupled to a ground terminal.
18 . The semiconductor device of claim 1 , wherein the first gate electrode is a control gate.
19 . The semiconductor device of claim 18 , wherein a distance between the second gate electrode and the drain electrode is less than a distance between the first gate electrode and the drain electrode.