IP Library › Granted Patent US 12,514,096
Granted Patent B2
US 12,514,096 · App. 17/759,392 · Granted Dec 30, 2025

Backplane, backlight module and display panel

Inventor: Juan Li (Guangdong, CN)
Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
H10K59/873H10K59/124H10K59/131H10K77/111
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Quick Facts
Patent No.
US 12,514,096
App. No.
17/759,392
Granted
Dec 30, 2025
Kind
B2
Abstract

The present disclosure provides a backplane, a backlight module, and a display panel. The backplane comprises a flexible substrate, a planarization layer, and a driving circuit layer, wherein a surface roughness of one side of the planarization layer close to the driving circuit layer is smaller than a surface roughness of one side of the flexible substrate close to the planarization layer.

Claims (32)

1 . A backplane, comprising:

a flexible substrate;

a planarization layer disposed on the flexible substrate; and

a driving circuit layer disposed on the planarization layer;

wherein a surface roughness of one side of the planarization layer close to the driving circuit layer is smaller than a surface roughness of one side of the flexible substrate close to the planarization layer; and

wherein the backplane comprises a bending area and non-bending areas located on both sides of the bending area, wherein an elastic modulus of the planarization layer located in the bending area is greater than that of the planarization layer located in the non-bending area.

2 . The backplane according to claim 1 , wherein the planarization layer has a thickness of is greater than or equal to half of that of the flexible substrate and less than or equal to twice of that of the flexible substrate in a direction from the flexible substrate to the planarization layer.

3 . The backplane according to claim 2 , wherein a material of the planarization layer is an inorganic insulating material, and the planarization layer has a thickness of greater than or equal to that of the flexible substrate and less than or equal to twice of that of the flexible substrate in a direction from the flexible substrate to the planarization layer.

4 . The backplane according to claim 3 , wherein the material of the planarization layer is any one of silicon nitride, silicon oxide, and silicon oxynitride.

5 . The backplane according to claim 2 , wherein a material of the planarization layer is an organic insulating material, and the planarization layer has a thickness of greater than or equal to half of that of the flexible substrate and less than that of the flexible substrate in a direction from the flexible substrate to the planarization layer.

6 . The display panel according to claim 2 , wherein the planarization layer has a thickness of greater than or equal to 10 microns and less than or equal to 20 microns in a direction from the flexible substrate to the planarization layer.

7 . The backplane according to claim 1 , further comprising a plurality of light-emitting devices on the driving circuit layer, and the plurality of light-emitting devices are electrically connected to the driving circuit layer.

8 . A backlight module, comprising a backplane and an optical film set, wherein the optical film set is located on a light-emitting side of the backplane, and the backplane comprises:

a flexible substrate;

a planarization layer disposed on the flexible substrate; and

a driving circuit layer disposed on the planarization layer;

wherein a surface roughness of one side of the planarization layer close to the driving circuit layer is smaller than a surface roughness of one side of the flexible substrate close to the planarization layer; and

wherein the backplane comprises a bending area and non-bending areas located on both sides of the bending area, wherein an elastic modulus of the planarization layer located in the bending area is greater than that of the planarization layer located in the non-bending area.

9 . The backlight module according to claim 8 , wherein the planarization layer has a thickness of greater than or equal to half of that of the flexible substrate and less than or equal to twice of that of the flexible substrate in a direction from the flexible substrate to the planarization layer.

10 . The backlight module according to claim 9 , wherein a material of the planarization layer is an organic insulating material, and the planarization layer has a thickness of greater than or equal to half of that of the flexible substrate and less than that of the flexible substrate in a direction from the flexible substrate to the planarization layer.

11 . The backlight module according to claim 9 , wherein a material of the planarization layer is an inorganic insulating material, and the planarization layer has a thickness of greater than or equal to that of the flexible substrate and less than or equal to twice of that of the flexible substrate in a direction from the flexible substrate to the planarization layer.

12 . The backlight module according to claim 8 , wherein the backplane further comprises a plurality of light-emitting devices on the driving circuit layer, and the plurality of light-emitting devices are electrically connected to the driving circuit layer.

13 . A display panel, comprising a backplane and a protective layer, wherein the protective layer is located on a light-emitting side of the backplane, and the backplane comprises:

a flexible substrate;

a planarization layer disposed on the flexible substrate; and

a driving circuit layer disposed on the planarization layer;

wherein a surface roughness of one side of the planarization layer close to the driving circuit layer is smaller than a surface roughness of one side of the flexible substrate close to the planarization layer; and

wherein the backplane comprises a bending area and non-bending areas located on both sides of the bending area, wherein an elastic modulus of the planarization layer located in the bending area is greater than that of the planarization layer located in the non-bending area.

14 . The display panel according to claim 13 , wherein the planarization layer has a thickness of greater than or equal to half of that of the flexible substrate and less than or equal to twice of that of the flexible substrate in a direction from the flexible substrate to the planarization layer.

15 . The display panel according to claim 13 , wherein a material of the planarization layer is an inorganic insulating material, and the planarization layer has a thickness of greater than or equal to that of the flexible substrate and less than or equal to twice of that of the flexible substrate in a direction from the flexible substrate to the planarization layer.

16 . The display panel according to claim 13 , wherein a material of the planarization layer is an organic insulating material, and the planarization layer has a thickness of greater than or equal to half of that of the flexible substrate and less than that of the flexible substrate in a direction from the flexible substrate to the planarization layer.

17 . The display panel according to claim 13 , wherein the backplane further comprises a plurality of light-emitting devices on the driving circuit layer, and the plurality of light-emitting devices are electrically connected to the driving circuit layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2022
From: LI, JUAN
To: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Reel/Frame 060607/0141 →
Priority Claims (1)
CN 202210573695.7 · May 24, 2022 · national
Continuity (1)
Related Publication 20240215391A1 · Jun 27, 2024
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