Resin composition, resin-attached metal foil, cured product, metal-based substrate, and electronic part
An object of the present invention is to provide a resin composition having high electrically insulating properties, high thermally conductive properties, low elasticity, and high solder heat resistance as an electrically insulating layer for a metal-based base material to be used for electronic devices, especially for on-vehicle electronic devices, and having favorable workability during coating a body to be coated as a resin composition for an electrically insulating layer before being cured. The present invention provides a thermosetting resin composition, a cured product, and a resin-attached metal foil, each containing a rubber-like polymer compound (A) having a glass transition temperature (Tg) of −40° C. or lower and a weight average molecular weight (Mw) in a range of 8,000 to 50,000, an epoxy resin (B), a filler (C), and a phenoxy resin (D). The present invention also provides a method for producing a metal-based substrate having any one of the thermosetting resin composition, the cured product, and the resin-attached metal foil, and a method for producing an electronic part using the metal-based substrate.
1 . A thermosetting resin composition, comprising:
a rubber-like polymer compound having a glass transition temperature of −40° C. or lower and a weight average molecular weight in a range of 8,000 to 50,000;
an epoxy resin;
a filler; and
a phenoxy resin.
2 . The thermosetting resin composition according to claim 1 , wherein the rubber-like polymer compound has an isoprene skeleton or a butadiene skeleton.
3 . The thermosetting resin composition according to claim 1 , wherein the epoxy resin is liquid at normal temperature of 25° C.
4 . A resin-attached metal foil, comprising:
a metal foil or a carrier-attached metal foil; and
a B-stage state resin layer obtained by a process comprising heating and drying the thermosetting resin composition of claim 1 on the metal foil or the carrier-attached metal foil.
5 . A dry film, comprising:
a carrier film; and
a B-stage state resin layer obtained by a process comprising heating and drying the thermosetting resin composition of claim 1 on the carrier film.
6 . A cured product obtained by a process comprising curing the resin layer of the resin-attached metal foil of claim 4 .
7 . A metal-based substrate, comprising:
a metal substrate; and
the cured product of claim 6 on the metal substrate.
8 . A method for producing a metal-based substrate, comprising:
overlaying a resin layer side of the resin-attached metal foil of claim 4 on one surface or each surface of a metal substrate; and
heating and pressurizing the resin-attached metal foil and the metal substrate with a vacuum press to obtain the metal-based substrate.
9 . A method for producing a metal-based substrate, comprising:
overlaying a metal foil on a metal substrate having a B-stage state resin layer obtained by a process comprising applying, heating and drying the thermosetting resin composition of claim 1 ; and
heating and pressurizing the metal foil and the metal substrate with a vacuum press to obtain the metal-based substrate.
10 . A method for producing an electronic part, comprising:
using the cured product of claim 6 .
11 . A method for producing an electronic part, comprising:
using the metal-based substrate of claim 7 .
12 . A method for producing an electronic part, comprising:
using the metal-based substrate obtained by the method of claim 8 .
13 . A method for producing an electronic part, comprising:
using the metal-based substrate obtained by the method of claim 9 .
14 . The thermosetting resin composition according to claim 2 , wherein the epoxy resin is liquid at normal temperature of 25° C.
15 . A resin-attached metal foil, comprising:
a metal foil or a carrier-attached metal foil; and
a B-stage state resin layer obtained by a process comprising heating and drying the thermosetting resin composition of claim 2 on the metal foil or the carrier-attached metal foil.
16 . A dry film, comprising:
a carrier film; and
a B-stage state resin layer obtained by a process comprising heating and drying the thermosetting resin composition of claim 2 on the carrier film.
17 . A cured product obtained by a process comprising curing the resin layer of the dry film of claim 5 .
18 . A method for producing a metal-based substrate, comprising:
overlaying a metal foil on a metal substrate having a B-stage state resin layer obtained by a process comprising applying, heating and drying the thermosetting resin composition of claim 2 ; and
heating and pressurizing the metal foil and the metal substrate with a vacuum press to obtain the metal-based substrate.
19 . A resin-attached metal foil, comprising:
a metal foil or a carrier-attached metal foil; and
a B-stage state resin layer obtained by a process comprising heating and drying the thermosetting resin composition of claim 3 on the metal foil or the carrier-attached metal foil.
20 . A dry film, comprising:
a carrier film; and
a B-stage state resin layer obtained by a process comprising heating and drying the thermosetting resin composition of claim 3 on the carrier film.