IP Library › Granted Patent US 12,517,665
Granted Patent B2
US 12,517,665 · App. 18/049,001 · Granted Jan 6, 2026

Volatile memory device

Inventors: Jae Pil Lee (Seoul, KR); Kwang Sook Noh (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
G06F3/0626G06F3/0629G06F3/0673G11C5/025G11C11/4097G11C11/4091
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Quick Facts
Patent No.
US 12,517,665
App. No.
18/049,001
Granted
Jan 6, 2026
Kind
B2
Abstract

A memory such as a volatile memory device capable of having a reduced area is provided. The volatile memory device comprises a first sense amplifier, a second sense amplifier spaced apart from the first sense amplifier, a first normal mat disposed between the first sense amplifier and the second sense amplifier, and including a first bit line connected to the first sense amplifier and a second bit line connected to the second sense amplifier, and a first reference mat disposed on the first normal mat between the first sense amplifier and the second sense amplifier, and including a first complementary bit line connected to the first sense amplifier and a second complementary bit line connected to the second sense amplifier.

Claims (58)

1 . A memory device comprising:

a first sense amplifier;

a second sense amplifier spaced apart from the first sense amplifier;

a first normal mat between the first sense amplifier and the second sense amplifier, and including a first bit line connected to the first sense amplifier and a second bit line connected to the second sense amplifier; and

a first reference mat on the first normal mat between the first sense amplifier and the second sense amplifier, and including a first complementary bit line connected to the first sense amplifier and a second complementary bit line connected to the second sense amplifier.

2 . The memory device of claim 1 , wherein the first sense amplifier is configured to perform at least one of a read or write operation on a first memory cell connected to the first bit line by using the first complementary bit line, and

the second sense amplifier is configured to perform at least one of a read or write operation on a second memory cell connected to the second bit line by using the second complementary bit line.

3 . The memory device of claim 1 , wherein

the first bit line is parallel to the first complementary bit line, and

the second bit line is parallel to the second complementary bit line.

4 . The memory device of claim 3 , wherein

the first bit line, the second bit line, the first complementary bit line, and the second complementary bit line extend in a first direction,

the first bit line is spaced apart from the second bit line in a second direction intersecting the first direction, and

the first complementary bit line is spaced apart from the second complementary bit line in the second direction.

5 . The memory device of claim 1 , wherein the first complementary bit line is connected to the first sense amplifier through a first metal line, and the second complementary bit line is connected to the second sense amplifier through a second metal line.

6 . The memory device of claim 1 , wherein the first sense amplifier and the second sense amplifier are on a first layer on which the first normal mat is disposed, and the first reference mat is on a second layer above the first layer.

7 . The memory device of claim 1 , wherein the first normal mat is on a first layer, and the first sense amplifier, the second sense amplifier, and the first reference mat are on a second layer above the first layer.

8 . The memory device of claim 1 , wherein the first normal mat and the first sense amplifier are on a first layer, and the second sense amplifier and the first reference mat are on a second layer above the first layer.

9 . The memory device of claim 1 , further comprising:

a third sense amplifier spaced apart from the second sense amplifier;

a fourth sense amplifier spaced apart from the third sense amplifier;

a second normal mat between the third sense amplifier and the fourth sense amplifier, and including a third bit line connected to the third sense amplifier and a fourth bit line connected to the fourth sense amplifier; and

a second reference mat on the second normal mat between the third sense amplifier and the fourth sense amplifier, and including a third complementary bit line connected to the third sense amplifier and a fourth complementary bit line connected to the fourth sense amplifier.

10 . The memory device of claim 9 , wherein the first to fourth sense amplifiers are sequentially arranged in a first direction,

the first to fourth sense amplifiers, the first normal mat, and the second normal mat are on a first layer, and

the first reference mat and the second reference mat are on a second layer above the first layer.

11 . The memory device of claim 9 , wherein the first sense amplifier, the second sense amplifier, and the first normal mat are on a first layer,

the first reference mat is on a second layer above the first layer,

the third sense amplifier, the fourth sense amplifier, and the second normal mat are on a third layer above the second layer, and

the second reference mat is on a fourth layer above the third layer.

12 . A memory device comprising:

a plurality of memory banks;

a row decoder having a first memory bank among the plurality of memory banks, the memory bank extending in a first direction;

a column decoder extending in a second direction intersecting the first direction;

a bank memory array arranged in the second direction from the row decoder and in the first direction from the column decoder; and

a first sense amplifier at a first edge portion of the bank memory array in a third direction intersecting the first direction,

wherein the bank memory array includes,

a first normal mat spaced apart from the first sense amplifier in the first direction and including a first bit line connected to the first sense amplifier, and

a first reference mat spaced apart from the first normal mat in the third direction, and including a first complementary bit line connected to the first sense amplifier.

13 . The memory device of claim 12 , further comprising:

a second sense amplifier at a second edge portion of the bank memory array in the first direction,

wherein the bank memory array includes,

a second normal mat spaced apart from the second sense amplifier in the third direction and including a second bit line connected to the second sense amplifier, and

a second reference mat spaced apart from the second normal mat in the third direction and including a second complementary bit line connected to the second sense amplifier.

14 . The memory device of claim 13 , further comprising:

a third sense amplifier disposed between the first edge portion and the second edge portion,

wherein the bank memory array includes,

a third bit line extending from the third sense amplifier in the third direction and connected to the third sense amplifier, and

a third complementary bit line extending from the third sense amplifier in the first direction and connected to the third sense amplifier.

15 . The memory device of claim 14 , wherein,

the first sense amplifier is configured to perform a read and/or write operation on a first memory cell connected to the first bit line by using the first complementary bit line,

the second sense amplifier performs a read or write operation on a second memory cell connected to the second bit line by using the second complementary bit line, and

the third sense amplifier performs a read or write operation on a third memory cell connected to the third bit line by using the third complementary bit line.

16 . The memory device of claim 12 , wherein the first bit line is parallel to the first complementary bit line.

17 . The memory device of claim 12 wherein the first bit line and the first complementary bit line extend in the first direction.

18 . The memory device of claim 12 , wherein the first complementary bit line is connected to the first sense amplifier through a metal line.

19 . The memory device of claim 12 , wherein the first sense amplifier is on a first layer on which the first normal mat is disposed, and the first reference mat is on a second layer above the first layer.

20 . The memory device of claim 12 , wherein the first normal mat is on a first layer, and the first sense amplifier and the first reference mat are on a second layer above the first layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2022
From: LEE, JAE PIL; NOH, KWANG SOOK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061646/0501 →
Priority Claims (1)
KR 10-2021-0153886 · Nov 10, 2021 · national
Continuity (1)
Related Publication 20230141221A1 · May 11, 2023
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